Abstract: The present invention provide a chemically amplified positive resist composition comprising a resin which contains a structural unit having an acid labile group and which itself is insoluble or poorly soluble in an alkali aqueous solution and becomes soluble in an alkali aqueous solution by the action of an acid; an acid generator; and a compound of the formula (C-1) ?wherein R1 and R2 each independently represents a hydrogen or an alkyl having 1 to 4 carbon atoms, R3, R4 and R5 each independently represents a hydrogen or a hydroxyl.

Abstract: A resin which comprises (1) at least one structural unit selected from the group consisting of a structural unit derived from 3-hydroxy-1-adamantyl(meth)acrylate, a structural unit derived from 3,5-dihydroxy-1-adamantyl(meth)acrylate, a structural unit derived from (meth)acryloyloxy-?-butyrolactone having a lactone ring optionally substituted by alkyl, a structural unit of the formula (Ia) and a structural unit of the formula (Ib) and (2) a structural unit of the formula (II) and which itself is insoluble or poorly soluble in an alkali aqueous solution but becomes soluble in an alkali aqueous solution by the action of an acid; and also provides a chemical amplification type positive resist composition comprising a resin defined above and an acid generator.

Abstract: The present invention provides a resin which comprises a structural unit of the formula (I) wherein R1 represents alkylene having 1 to 4 carbon atoms, R2 represents alkyl having 1 to 4 carbon atoms, and R3 represents hydrogen or methyl, and also prvides a chemical amplification type positive resist composition comprising a resin defined above and an acid generator.

Abstract: A resist composition excellent in balance of performance of resolution and sensitivity as well as in solubility and, particularly, suitable for use as a positive photo resist which comprises a resin having a alicyclic lactone structure unit that is insoluble in alkali by itself but becomes soluble due to the action of an acid, a solvent containing 2-heptanone and an acid generating agent, wherein a content of 2-heptanone in the solvent is in a weight ratio of from about 5 to about 95% is provided.

Abstract: A positive resist composition, having a superior resolution as well as good resist performances such as sensitivity, depth of focus and profile, is described and includes a novolac resin, a radiation-sensitive quinonediazide compound and a thioxanthone compound represented by the following formula (I): wherein R1, R2, R3, R4, R5, R6, R7 and R8 independently represent hydrogen, halogen, alkyl, alkoxy, aryl, carboxyl or alkoxycarbonyl.

Abstract: The present invention provides a chemical amplification type positive resist composition comprising

Abstract: The present invention provides a resist composition comprising: a resin which has a structural unit represented by the following formula (I) 1

Abstract: A chemical amplification type positive resist composition excellent in balance of properties such as resolution, profile, sensitivity, dry etching resistance, adhesion and the like which comprises a resin which has the following polymeric units (A), (B) and (C); and an acid generating agent.

Abstract: A chemical amplification type positive resist composition is provided which gives resist patterns showing remarkably improved line edge roughness and comprises an acid generator containing a benzenesulfonate ion of the formula (I): 1

Abstract: A chemically amplified positive resist composition capable of giving a resist film excellent in adhesion to a substrate; excellent in various resist performance characteristics such as dry etching resistance, sensitivity and resolution; and comprising a resin (X) which, per se, is insoluble or slightly soluble in alkali but becomes soluble in alkali due to an action of acid, and has a polymeric unit (a) derived from 3-hydroxy-1-adamantyl(meth)acrylate and a polymeric unit (b) derived from &bgr;-(meth)acryloyloxy-&ggr;-butyrolactone wherein the lactone ring may optionally be substituted by alkyl; and an acid generating agent (Y).

Abstract: A resist composition excellent in balance of performance of resolution and sensitivity as well as in solubility and, particularly, suitable for use as a positive photo resist which comprises a resin having a alicyclic lactone structure unit that is insoluble in alkali by itself but becomes soluble due to the action of an acid, a solvent containing 2-heptanone and an acid generating agent, wherein a content of 2-heptanone in the solvent is in a weight ratio of from about 5 to about 95% is provided.

Abstract: A chemically amplified positive resist composition excellent in adhesion to a substrate, as well as good in dry-etching resistance; suitable for use in excimer laser lithography utilizing ArF, KrF or the like; and comprising a resin (X) which, per se, is insoluble in alkali but becomes soluble in alkali when subjected to an action of acid, and has a polymeric unit represented by the formula(I), a polymeric unit represented by the formula(II) and a polymeric unit represented by the formula(III): and an acid generating agent (Y).

Abstract: A chemically amplified positive resist composition which is suitable for use in an exposure process utilizing an ArF excimer laser and is capable of forming a resist coat exhibiting a high hydrophillcity; is excellent in adhesion to a substrate and satisfactory in resist performance characteristics; and comprises a resin (X) which has a polymeric unit(a) derived from dihydroxy-1-adamantyl (meth)acrylate and a polymeric unit(b) derived from 2-alkyl-2-adamantyl (meth)acrylate, and which, per se, is insoluble or slightly soluble in alkali but becomes soluble in alkali due to an action of acid; and an acid generating agent (Y).

Abstract: A chemically amplified positive resist composition excellent in sensitivity and resolution as well as other resist performance characteristics comprising a resin (X) which has a polymeric unit represented by the following formula (I): wherein R1 represents hydrogen or methyl, R2 and R3 represent alkyl having 1 to 4 carbon atoms, and R4 and R5 represent hydrogen, hydroxyl or alkyl, polymeric unit represented by the following formula (II): and a polymeric unit derived from unsaturated dicarboxylic acid anhydride selected from maleic anhydride and itaconic anhydride; and an acid generating agent (Y).

Abstract: A positive resist composition, having a superior resolution as well as good resist performances such as sensitivity, depth of focus and profile, which comprises a novolac resin, a radiation-sensitive quinonediazide compound and a thioxanthone compound represented by the following formula (I): 1

Abstract: A chemically amplified positive resist composition excellent in adhesion to a substrate, as well as good in dry-etching resistance;

Abstract: A chemical amplification type positive resist composition excellent in balance of properties such as resolution, profile, sensitivity, dry etching resistance, adhesion and the like which comprises a resin which has the following polymeric units (A), (B) and (C); and an acid generating agent.

Abstract: A chemically amplified positive resist composition excellent in sensitivity and resolution as well as other resist performance characteristics comprising a resin (X) which has a polymeric unit represented by the following formula (I): 1

Abstract: A positive resist composition, having a superior resolution as well as good resist performances such as sensitivity, depth of focus and profile, is described and includes a novolac resin, a radiation-sensitive quinonediazide compound and a thioxanthone compound represented by the following formula (I): 1

Abstract: A chemically amplified positive resist composition capable of giving a resist film excellent in adhesion to a substrate;