Abstract: The nitride semiconductor light-emitting element comprises a light-emitting element structure portion having a plurality of nitride semiconductor layers including at least an n-type layer, an active layer and a p-type layer. The active layer has a quantum well structure comprising at least one well layer composed of a GaN-based semiconductor. In the well layer, the shortest distance between a first surface on the n-type layer side and a second surface on the p-type layer side varies in an orthogonal plane to the layering direction of the nitride semiconductor layers, and the peak emission wavelength of light emitted from the light-emitting element structure portion is shorter than 354 nm.

Abstract: The ultraviolet light-emitting device includes a base, a nitride semiconductor ultraviolet light-emitting element flip-chip mounted on the base, and a lens for sealing a nitride semiconductor ultraviolet light-emitting element to focus or diffuse light emitted from the nitride semiconductor ultraviolet light-emitting device. The lens is composed of an amorphous fluororesin in which a structural unit of a polymer or copolymer has a fluorine-containing aliphatic cyclic structure and a terminal functional group is a perfluoroalkyl group, and a density of the amorphous fluororesin is higher than 2.11 g/cm3.

Abstract: A light-emitting device 1 comprises a base 30, a nitride semiconductor light-emitting element 10 flip-chip mounted on the base 30, and an amorphous fluororesin sealing the nitride semiconductor light-emitting element 10. The light-emitting device 1 comprises a deformation-prevention layer 60 for preventing a shape change of an amorphous fluororesin by heat treatment after shipment of the light-emitting device 1, and the deformation-prevention layer 60 is formed of a layer in which a thermosetting resin or an ultraviolet curing resin is cured, and the cured layer directly covers the surface of the amorphous fluororesin.

Abstract: A manufacturing method of a nitride semiconductor ultraviolet light-emitting element having a peak emission wavelength of 285 nm or shorter comprises a first step of forming an n-type semiconductor layer composed of an n-type AlXGa1-XN-based semiconductor (1?X?0.5) on an upper surface of an underlying portion including a sapphire substrate, a second step of forming, above the n-type semiconductor layer, an active layer that includes a light-emitting layer composed of an AlYGa1-YN-based semiconductor (X>Y>0) and that is composed of an AlGaN-based semiconductor as a whole, and a third step of forming a p-type semiconductor layer composed of a p-type AlZGa1-ZN-based semiconductor (1?Z>Y) above the active layer. In the manufacturing method, a growth temperature at the second step is higher than 1200° C. and equal to or higher than a growth temperature at the first step.

Abstract: A component mounting device mounting a component on a substrate comprises a pair of opening/closing members opening and closing, and a plurality of adapters detachably attached to the opening/closing members; the adapters are attached to the opening/closing members depending on the component to be mounted so as to clamp the component by using the adapters; and the plurality of adapters includes first adapters each having a flat clamping surface clamping a body of the component and second adapters each having a holding groove holding an axial portion of the component.

Abstract: A component mounting apparatus for mounting a component on a substrate includes a pair of chuck claws that sandwich and grip the component; and adapters that are detachably mounted on the chuck claws and grip the component in place of the chuck claws. The adapters are mounted on the chuck claws in accordance with the component that is an object to be mounted and the component is gripped by using the adapters.

Abstract: A nitride semiconductor ultraviolet light-emitting element 1 comprises a sapphire substrate 10 and an element structure part 20 formed on a main surface 101 of the substrate 10. In the substrate 10, in a first portion 110 extending from the main surface 101 by a first distance, a sectional area of a cross section parallel to the main surface 101 continuously increases with distance from the main surface 101, and in a second portion 120 extending from a side opposite to the main surface 101 by a second distance, a sectional area of a cross section parallel to the main surface 101 continuously increases with distance from the side opposite to the main surface 101. The sum of the first distance and the second distance is equal to or less than the thickness of the substrate 10.

Abstract: A position and orientation of an electronic component attitude are recognized, a mounting head is moved above the electronic component, a rotator is horizontally rotated so that a lower surface of the electronic component is oriented in a direction opposite to a pusher, the electronic component of the fallen-down attitude is sucked and held by the nozzle by lowering a component holder, a attitude of the electronic component that is held is changed to a stand-up attitude by vertically rotating the component holder, leads of the electronic component of which the attitude is changed to the stand-up attitude and insertion holes of the substrate into which the leads are inserted are positioned, and the leads are inserted into the insertion holes of the substrate by pushing the electronic component toward the substrate by causing the pusher to abut against an upper surface of the electronic component of the stand-up attitude.

Abstract: A component supply device includes a posture maintainer and a pair of cutting members. The posture maintainer includes a pair of grip members, each of which includes a tip end portion that extends in a traveling direction of a component holding tape. The posture maintainer maintains the posture of a component by gripping a body portion of the component having been supplied to a component supply position with the body portion interposed between the tip end portions of the pair of the grip members. The pair of cutting members cuts a lead portion of the component having been gripped by the pair of grip members with the lead portion interposed between the pair of cutting members in a direction intersecting a traveling direction of the component holding tape.

Abstract: A manufacturing method of a nitride semiconductor ultraviolet light-emitting element having a peak emission wavelength of 285 nm or shorter comprises a first step of forming an n-type semiconductor layer composed of an n-type AlXGa1-XN-based semiconductor (1?X?0.5) on an upper surface of an underlying portion including a sapphire substrate, a second step of forming, above the n-type semiconductor layer, an active layer that includes a light-emitting layer composed of an AlYGa1-YN-based semiconductor (X>Y>0) and that is composed of an AlGaN-based semiconductor as a whole, and a third step of forming a p-type semiconductor layer composed of a p-type AlZGa1-ZN-based semiconductor (1?Z>Y) above the active layer. In the manufacturing method, a growth temperature at the second step is higher than 1200° C. and equal to or higher than a growth temperature at the first step.

Abstract: Provided is an ultraviolet light emitting device that prevents peeled off of a non-bonding amorphous fluororesin and has high quality and high reliability.

Abstract: A component supply device includes a transport path that guides a component connected body from a component insertion port on an upstream side in a component feeding direction to a component supply position on a downstream side, the component connected body including a plurality of axial components arranged and connected at a predetermined pitch, the plurality of axial components each having a lead, and a feed mechanism that pitch-feeds the component connected body along the transport path to the downstream side. The feed mechanism includes a feed member which has a plurality of feed hooks disposed at the predetermined pitch along the component feeding direction, a rotating shaft which is connected to one end side of the feed member, and a moving mechanism which is connected to the feed member through the rotating shaft and reciprocates the rotating shaft along the component feeding direction.

Abstract: A nitride semiconductor ultraviolet light-emitting element 1 comprises a sapphire substrate 10 and an element structure part 20 formed on a main surface 101 of the substrate 10. In the substrate 10, in a first portion 110 extending from the main surface 101 by a first distance, a sectional area of a cross section parallel to the main surface 101 continuously increases with distance from the main surface 101, and in a second portion 120 extending from a side opposite to the main surface 101 by a second distance, a sectional area of a cross section parallel to the main surface 101 continuously increases with distance from the side opposite to the main surface 101. The sum of the first distance and the second distance is equal to or less than the thickness of the substrate 10.

Abstract: A component mounting device configured to mount an axial component on a substrate, comprising: a movable forming-die; a fixed forming-die; a mounting head; and a distance adjustment portion, wherein the distance adjustment portion makes an adjustment such that when the movable forming-die delivers the axial component to the mounting head the distance between the claws is larger than a distance of the fixed forming-die.

Abstract: A first vital signs information detecting sensor and a second vital signs information sensor are attached to a living body. The first vital signs information detecting sensor detects over time first vital signs information and first motion information of the living body. The first vital signs information and the first motion information are transmitted from the first vital signs information detecting sensor to a receiver. The second vital signs information detecting sensor detects over time second vital signs information and second motion information of the living body. The second vital signs information and the second motion information are transmitted from the second vital signs information detecting sensor to the receiver. The first vital signs information and the second vital signs information are displayed on a display of the receiver in a synchronized state, on the basis of the first motion information and the second motion information.

Abstract: A component mounting device mounting a component on a substrate comprises a pair of opening/closing members opening and closing, and a plurality of adapters detachably attached to the opening/closing members; the adapters are attached to the opening/closing members depending on the component to be mounted so as to clamp the component by using the adapters; and the plurality of adapters includes first adapters each having a flat clamping surface clamping a body of the component and second adapters each having a holding groove holding an axial portion of the component.

Abstract: A component mounting device for mounting a component on a substrate comprises a pair of clamping members pinching and clamping the component; the pair of clamping members is able to clamp both a first component including a first body and a first lead projecting downward from a lower portion of the first body and a second component including a second body and a second lead projecting laterally from both side portions of the second body with a tip bent downward; and the pair of clamping members has facing portions each provided with a clamping surface contacting the first body of the first component and a holding groove formed at the clamping surface and holding the second lead of the second component.

Abstract: There is provided an electronic component mounter configured to include a supplier holder in which a radial lead type electronic component supplier can be mounted, and to cause a mounting head to hold a radial lead type electronic component so as to mount the component on a board positioned by a board holder. The electronic component mounter includes a tape guide passage that guides a tape body after the radial lead type electronic components are picked up from the tape body. The electronic component supplier is configured to further include a posture converter that converts a posture of the tape body from a posture perpendicular to a horizontal plane to a posture parallel to the horizontal plane, after the radial lead type electronic components are picked up from the tape body, and that introduces the tape body to the tape guide passage.

Abstract: A component supply device includes a posture maintainer and a pair of cutting members. The posture maintainer includes a pair of grip members, each of which includes a tip end portion that extends in a traveling direction of a component holding tape. The posture maintainer maintains the posture of a component by gripping a body portion of the component having been supplied to a component supply position with the body portion interposed between the tip end portions of the pair of the grip members. The pair of cutting members cuts a lead portion of the component having been gripped by the pair of grip members with the lead portion interposed between the pair of cutting members in a direction intersecting a traveling direction of the component holding tape.

Abstract: A component mounting apparatus for mounting a component on a substrate includes a pair of chuck claws that sandwich and grip the component; and adapters that are detachably mounted on the chuck claws and grip the component in place of the chuck claws. The adapters are mounted on the chuck claws in accordance with the component that is an object to be mounted and the component is gripped by using the adapters.