Abstract: This hot-rolled copper alloy sheet contains Mg: 0.2 mass % or more and 2.1 mass % or less, Al: 0.4 mass % or more and 5.7 mass % or less, and Ag: 0.01 mass % or less, with a remainder being Cu and inevitable impurities, an area ratio of Cube orientation (area ratio of crystal orientation) measured by an EBSD method is 5% or less, an average KAM value when a boundary between adjacent pixels where an orientation difference between the pixels is 5° or more is regarded as a crystal grain boundary is 2.0 or less, and an average crystal grain size ? in a sheet-thickness central portion is 40 ?m or less.

Abstract: An infrastructure diagnostic device according to an aspect of the present disclosure includes: at least one memory configured to store instructions; and at least one processor configured to execute the instructions to: generate a road section by dividing, by meshes, a movement path of a moving body collected from the moving body moving on a road, the meshes being obtained by dividing a ground surface into a predetermined size; and determine and output a state of the road section based on sensor information of the road section collected from the moving body.

Abstract: An infrastructure diagnostic device comprises a time-series display control unit, a reception unit, and a location display control unit. The time-series display control unit displays the infrastructure states of a plurality of locations in a predetermined area in time series on a display. The reception unit receives selection of data from among the time series for the infrastructure states of the plurality of locations. The location display control unit displays, on a map, a location corresponding to the selected data on the display.

Abstract: A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12?f1=[Zn]+5×[Sn]?2×[Ni]?30, 10?[Zn]?0.3×[Sn]?2×[Ni]?28, 10?f3={f1×(32?f1)×[Ni]}1/2?33, 1.2?0.7×[Ni]+[Sn]?4, and 1.4?[Ni]/[Sn]?90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an ? phase is 99.5% or more by area ratio or an area ratio of a ? phase (?)% and an area ratio of a ? phase (?)% in an ? phase matrix satisfy a relationship of 0?2×(?)+(?)?0.7.

Abstract: A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12?f1=[Zn]+5×[Sn]?2×[Ni]?30, 10?[Zn]?0.3×[Sn]?2×[Ni]?28, 10?f3={f1×(32?f1)×[Ni]}1/2?33, 1.20?0.7×[Ni]+[Sn]?4, and 1.4?[Ni]/[Sn]?90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an ? phase is 99.5% or more by area ratio or an area ratio of a ? phase (?)% and an area ratio of a ? phase (?)% in an ? phase matrix satisfy a relationship of 0?2×(?)+(?)?0.7.

Abstract: A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11?[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]?19 is satisfied, a relationship of 7?[Ni]/[P]?40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 ?m to 8.0 ?m, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t?0.

Abstract: A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12?f1=[Zn]+5×[Sn]?2×[Ni]?30, 10?[Zn]?0.3×[Sn]?2×[Ni]?28, 10?f3={f1×(32?f1)×[Ni]}1/2?33, 1.20?0.7×[Ni]+[Sn]?4, and 1.4?[Ni]/[Sn]?90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an ? phase is 99.5% or more by area ratio or an area ratio of a ? phase (?) % and an area ratio of a ? phase (?) % in an ? phase matrix satisfy a relationship of 0?2×(?)+(?)?0.7.

Abstract: Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17?f1=[Zn]+5×[Sn]?2×[Ni]?30, 14?f2=[Zn]?0.5×[Sn]?3×[Ni]?26, 8?f3={f1×(32?f1)}1/2×[Ni]?23, 1.3?[Ni]+[Sn]?2.4, 1.5?[Ni]/[Sn]?5.5, and 20?[Ni]/[P]?400 are satisfied. The copper alloy has a metallographic structure of an ? single phase.

Abstract: The present invention relates to a copper alloy sheet for terminal and connector materials, which is excellent in terms of tensile strength, proof stress, Young's modulus, electric conductivity, bending workability, stress corrosion crack resistance, stress relaxation characteristics and solderability.

Abstract: A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12?f1=[Zn]+5×[Sn]?2×[Ni]?30, 10?[Zn]?0.3×[Sn]?2×[Ni]?28, 10?f3={f1×(32?f1)×[Ni]}1/2?33, 1.2?0.7×[Ni]+[Sn]?4, and 1.4?[Ni]/[Sn]?90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an ? phase is 99.5% or more by area ratio or an area ratio of a ? phase (?) % and an area ratio of a ? phase (?) % in an ? phase matrix satisfy a relationship of 0?2×(?)+(?)?0.7.

Abstract: Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17?f1=[Zn]+5×[Sn]?2×[Ni]?30, 14?f2=[Zn]?0.5×[Sn]?3×[Ni]?26, 8?f3={f1×(32?f1)}1/2×[Ni]?23, 1.3?[Ni]+[Sn]?2.4, 1.5?[Ni]/[Sn]?5.5, and 20?[Ni]/[P]<400 are satisfied. The copper alloy has a metallographic structure of an ? single phase.

Abstract: A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12?f1=[Zn]+5×[Sn]?2×[Ni]?30, 10?[Zn]?0.3×[Sn]?2×[Ni]?28, 10?f3={f1×(32?f1)×[Ni]}1/2?33, 1.2?0.7×[Ni]+[Sn]?4, and 1.4?[Ni]/[Sn]?90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an ? phase is 99.5% or more by area ratio or an area ratio of a ? phase (?)% and an area ratio of a ? phase (?)% in an ? phase matrix satisfy a relationship of 0?2×(?)+(?)?0.7.

Abstract: A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12?f1=[Zn]+5×[Sn]?2×[Ni]?30, 10?[Zn]?0.3×[Sn]?2×[Ni]?28, 10?f3={f1×(32?f1)×[Ni]}1/2?33, 1.2?0.7×[Ni]+[Sn]?4, and 1.4?[Ni]/[Sn]?90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an ? phase is 99.5% or more by area ratio or an area ratio of a ? phase (?)% and an area ratio of a ? phase (?)% in an ? phase matrix satisfy a relationship of 0?2×(?)+(?)?0.7.

Abstract: Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17?f1=[Zn]+5×[Sn]?2×[Ni]?30, 14?f2=[Zn]?0.5×[Sn]?3×[Ni]?26, 8?f3={f1×(32?f1)}1/2×[Ni]?23, 1.3?[Ni]+[Sn]?2.4, 1.5?[Ni]/[Sn]?5.5, and 20?[Ni]/[P]?400 are satisfied. The copper alloy has a metallographic structure of an ? single phase.

Abstract: A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11?[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]?19 is satisfied, a relationship of 7?[Ni]/[P]?40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 ?m to 8.0 ?m, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t?0.

Abstract: A copper alloy wiring film of a flat panel display of the present invention and a sputtering target for forming the same have a composition including Mg: 0.1 to 5 atom %; either one or both of Mn and Al: 0.1 to 11 atom % in total; and Cu and inevitable impurities as the balance, and if necessary, may be further including P: 0.001 to 0.1 atom %.

Abstract: A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11?[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]?19 is satisfied, a relationship of 7?[Ni]/[P]?40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 ?m to 8.0 ?m, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t?0.

Abstract: A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44?[Zn]+20×[Sn]?37 and 32?[Zn]+9×([Sn]?0.25)1/2?37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 ?m to 7.0 ?m, and a sum of an area ratio of a ? phase and an area ratio of a ? phase in a metallographic structure of the copper alloy material is 0% to 0.9%.

Abstract: A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44?[Zn]+20×[Sn]?37 and 32?[Zn]+9×([Sn]?0.25)1/2?37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 ?m to 7.0 ?m, and a sum of an area ratio of a ? phase and an area ratio of a ? phase in a metallographic structure of the copper alloy material is 0% to 0.9%.

Abstract: A copper alloy wiring film of a flat panel display of the present invention and a sputtering target for forming the same have a composition including Mg: 0.1 to 5 atom %; either one or both of Mn and Al: 0.1 to 11 atom % in total; and Cu and inevitable impurities as the balance, and if necessary, may be further including P: 0.001 to 0.1 atom %.