Abstract: A sheet laminator includes a thermal fixing roller pair, a first heater, a second heater, multiple temperature detectors, and a driver. The thermal fixing roller pair includes a first thermal fixing roller and a second thermal fixing roller facing the first thermal fixing roller. The thermal fixing roller pair thermally fixes and conveys a two-ply sheet and a sheet medium nipped between two sheets of the two-ply sheet. The first heater heats the first thermal fixing roller. The second heater heats the second thermal fixing roller. The multiple temperature detectors are at different positions along an axial direction of the thermal fixing roller pair. The multiple temperature detectors detect a surface temperature of the thermal fixing roller pair. The driver drives the thermal fixing roller pair.

Abstract: An embodiment includes a main body holding pin groups and partition walls partitioning adjacent signal pins from each other, each of the signal pins has a fixing part located on a mount part side and fixed to a substrate, tip parts located on an insertion-extraction part side and serving as a free end, and a contact part provided between the fixing part and the tip parts and configured to be in electrical contact with electrodes of a device, and the adjacent tip parts are located via an opening.

Abstract: A sheet processing system includes a sheet processing device and a lamination processing device. The sheet processing device includes a sheet separator that separates a two-ply sheet and inserts an inner sheet between the two-ply sheet to form a first enclosed two-ply sheet. The lamination processing device bonds the first enclosed two-ply sheet, and bonds a second enclosed two-ply sheet in which the inner sheet is inserted outside the sheet separator. The sheet processing system includes a relay conveyor that conveys the first enclosed two-ply sheet from the sheet separator to the lamination processing device attachable to a sheet feeder to directly feed the second enclosed two-ply sheet to the lamination processing device. The sheet processing device includes a cord holder to hold the power cord of the lamination processing device at a position where feeding and ejecting the two-ply sheet after bonding the two-ply sheet are not hindered.

Abstract: A sheet separation device for separating two sheets of a two-ply sheet, in which the two sheets are overlapped and a part of the two sheets are joined, and inserting at least one sheet medium between the two sheets includes an upper surface, an ejection tray, and a conveyor. A lamination fixing device that laminates the two-ply sheet including the at least one sheet medium inserted between the two sheets is to be mounted on the upper surface. The ejection tray is disposed on the upper surface. The two-ply sheet laminated and ejected from an ejection port of the lamination fixing device is to be stacked on the ejection tray. The conveyor is coupled to the lamination fixing device to convey the two-ply sheet including the at least one sheet medium from the sheet separation device to the lamination fixing device.

Abstract: A lamination processing system includes a sheet separation device, a lamination fixing device, and a conveyor. The sheet separation device separates a two-ply sheet to insert a sheet medium between two sheets of the two-ply sheet to form an enclosed two-ply sheet. The lamination fixing device includes an inlet port and a heater. The conveyor conveys the enclosed two-ply sheet from the sheet separation device to the lamination fixing device in a conveyance direction. The conveyor includes a conveyance passage and a guide. The conveyance passage guides the enclosed two-ply sheet from the sheet separation device toward the lamination fixing device. The guide guides the enclosed two-ply sheet to the inlet port. The guide forms a space accommodatable a deflected part of the enclosed two-ply sheet formed by a difference in a conveyance speed of the enclosed two-ply sheet between the sheet separation device and the lamination fixing device.

Abstract: A connector set is provided that includes a first connector, a first cap to be attached to the first connector when the first connector is reflow-mounted on a first external substrate, a second connector, and a second cap to be attached to the second connector when the second connector is reflow-mounted on a second external substrate formed of a material with a smaller thermal expansion coefficient than that of the first external substrate. The second cap is formed of a material with a smaller thermal expansion coefficient than that of the first cap.

Abstract: A connector set is disclosed that includes a plurality of connectors and a cap to be attached to the plurality of connectors when the plurality of connectors are reflow-mounted on an external substrate. Each one end portion of the connectors and the cap is provided with a fitted portion and a fitting portion to be fitted in the fitted portion. The fitted portion is provided with an opening portion for moving the fitting portion so as to absorb thermal expansion from one end portion side to the other end portion side due to temperature conversion of reflow.

Abstract: A connector is provided that includes a plurality of socket type connectors to be mounted on a first substrate and a plurality of plug type connectors to be mounted on a second substrate, thereby electrically connecting the first substrate and the second substrate. The socket type connector includes a housing with a slot and a plurality of contacts arranged in the slot. The plug type connector includes a housing with a header to be fitted in the slot, and a plurality of contacts arranged in the header. The housing of the socket type connector and the housing of the plug type connector has a rotationally asymmetrical shape as viewed from a fitting direction.

Abstract: Provided is a connector having: a top pin group 120 having a plurality of contact pins 121, 122 aligned in a predetermined direction; and a bottom pin group having a plurality of contact pins aligned in the predetermined direction in which the bottom pin group is arranged so as to face the top pin group 120 and located on a mount substrate side. Each of the contact pins 121, 122 is at least either one of a signal pin 122 used for signaling and a ground pin 121 used for grounding, and the top pin group 120 includes a double ground configuration in which sets each including two signal pins 122 aligned between two ground pins 121 are aligned adjacent to each other in the predetermined direction.

Abstract: A plug connector 200 configured to be inserted in a host connector 100 includes a plurality of contact pins aligned in a predetermined direction and a housing 210 configured to hold the plurality of contact pins. Each of the contact pins extends in an intersecting direction that is a direction intersecting the predetermined direction, and the housing 210 includes pin grooves 212a provided in the surface thereof, extending in the intersecting direction, and configured to accommodate the contact pins and includes holes 212b provided aligned with the pin grooves 212a in the intersecting direction and recessed deeper than the pin grooves 212a from the surface.

Abstract: Provided is a connector including: a pin group having contact pins aligned in a predetermined direction; an alignment member formed extending in the predetermined direction and having an alignment groove at an end in a width direction orthogonal to the predetermined direction, the alignment groove being for aligning the contact pins; and a conductive member formed extending in the predetermined direction, coupled to the alignment member, and electrically connected to the contact pins used for grounding. The alignment member includes any one of a first protrusion and a first hole configured to accommodate the first protrusion in a center area in the predetermined direction, the conductive member includes the other of the first protrusion and the first hole in the center area in the predetermined direction, and the alignment member and the conductive member are coupled to each other by the first protrusion being secured in the first hole.

Abstract: A connector for high-speed transmission includes a housing, a column of contacts and a metal member in the contacts. The housing includes an opening portion to be fitted into an external communication partner. The contact has a contact portion in contact with the communication partner, a first linear portion extending rearward from a rear end of the contact portion, a second linear portion bent and extending from a rear end of the first linear portion and a terminal portion soldered to an external substrate. The metal member shorts the contact for ground and is bent so as to avoid contacts other than the contact for ground. The metal member has a bent portion bent in a U-shape across the contacts other than the contact for ground, and is connected to the first and/or the second linear portion of the contact for ground.

Abstract: According to an embodiment of the present disclosure, a connector for high-speed transmission to be fitted with an external counterpart connector includes a housing and a plurality of terminals. The housing has at least one or more slots. The plurality of terminals includes ground terminals and signal terminals are arranged in the slot along a first direction orthogonal to a fitting direction of the connector. Partition walls are provided between adjacent terminals in the slot, and a height of the partition walls between the ground terminals and the signal terminals in the fitting direction is lower than a height of other partition walls in the fitting direction.

Abstract: A group of contact pads (20EB) formed on a lower surface (20B) at a connection end of a board portion of an optical module board (20) includes, in order from the endmost end, a contact pad (20B1) conducting to a ground line (G), contact pads (20B2) and (20B3) conducting to transmission-side high-speed signal lines (S), a contact pad (20B4) conducting to the ground line (G), contact pads (20B5, 20B6, and 20B7) conducting to low-speed signal lines (S), a contact pad (20B8) conducting to the ground line (G), contact pads (20B9 and 20B10) conducting to receiving-side high-speed signal lines (S), and a contact pad (20B11) conducting to the ground line (G).

Abstract: A connector is provided that includes a plurality of socket type connectors to be mounted on a first substrate and a plurality of plug type connectors to be mounted on a second substrate, thereby electrically connecting the first substrate and the second substrate. The socket type connector includes a housing with a slot and a plurality of contacts arranged in the slot. The plug type connector includes a housing with a header to be fitted in the slot, and a plurality of contacts arranged in the header. The housing of the socket type connector and the housing of the plug type connector has a rotationally asymmetrical shape as viewed from a fitting direction.

Abstract: A connector set is disclosed that includes a plurality of connectors and a cap to be attached to the plurality of connectors when the plurality of connectors are reflow-mounted on an external substrate. Each one end portion of the connectors and the cap is provided with a fitted portion and a fitting portion to be fitted in the fitted portion. The fitted portion is provided with an opening portion for moving the fitting portion so as to absorb thermal expansion from one end portion side to the other end portion side due to temperature conversion of reflow.

Abstract: A connector set is provided that includes a first connector, a first cap to be attached to the first connector when the first connector is reflow-mounted on a first external substrate, a second connector, and a second cap to be attached to the second connector when the second connector is reflow-mounted on a second external substrate formed of a material with a smaller thermal expansion coefficient than that of the first external substrate. The second cap is formed of a material with a smaller thermal expansion coefficient than that of the first cap.

Abstract: According to an embodiment, an LGA socket includes a center substrate, first and second insulator and a plurality of pairs of contacts. The center substrate is configured by a multi-layer structure including a ground layer and a plurality of through holes formed through the center substrate. The first insulator is arranged around the plurality of through holes on an upper surface of the center substrate. The second insulator is arranged around the plurality of through holes on a lower surface of the center substrate. The plurality of pairs of contacts are inserted into the through holes from an upper side and from a lower side of the through holes and are soldered via the through holes to be electrically connected to each other.