Abstract: A polyimide film bonding method according to an embodiment may include: bonding two polyimide films to each other by bringing a hot plate into contact with a portion where the two polyimide films are superposed. A heating temperature by the contact with the hot plate is 450° C. or higher. A contact time between the polyimide films and the hot plate is 12 seconds or less. A polyimide film bonding method according to another embodiment may include: bonding two polyimide films to each other by irradiating, with a laser beam, a portion where the two polyimide films are superposed. A top surface of the superposed polyimide films is irradiated with the laser beam while a bottom surface of the superposed polyimide films is kept tightly attached to a heat insulator.

Abstract: An embodiment includes a main body holding pin groups and partition walls partitioning adjacent signal pins from each other, each of the signal pins has a fixing part located on a mount part side and fixed to a substrate, tip parts located on an insertion-extraction part side and serving as a free end, and a contact part provided between the fixing part and the tip parts and configured to be in electrical contact with electrodes of a device, and the adjacent tip parts are located via an opening.

Abstract: A connector set is provided that includes a first connector, a first cap to be attached to the first connector when the first connector is reflow-mounted on a first external substrate, a second connector, and a second cap to be attached to the second connector when the second connector is reflow-mounted on a second external substrate formed of a material with a smaller thermal expansion coefficient than that of the first external substrate. The second cap is formed of a material with a smaller thermal expansion coefficient than that of the first cap.

Abstract: A connector set is disclosed that includes a plurality of connectors and a cap to be attached to the plurality of connectors when the plurality of connectors are reflow-mounted on an external substrate. Each one end portion of the connectors and the cap is provided with a fitted portion and a fitting portion to be fitted in the fitted portion. The fitted portion is provided with an opening portion for moving the fitting portion so as to absorb thermal expansion from one end portion side to the other end portion side due to temperature conversion of reflow.

Abstract: A connector is provided that includes a plurality of socket type connectors to be mounted on a first substrate and a plurality of plug type connectors to be mounted on a second substrate, thereby electrically connecting the first substrate and the second substrate. The socket type connector includes a housing with a slot and a plurality of contacts arranged in the slot. The plug type connector includes a housing with a header to be fitted in the slot, and a plurality of contacts arranged in the header. The housing of the socket type connector and the housing of the plug type connector has a rotationally asymmetrical shape as viewed from a fitting direction.

Abstract: Provided is a connector including: a pin group having contact pins aligned in a predetermined direction; an alignment member formed extending in the predetermined direction and having an alignment groove at an end in a width direction orthogonal to the predetermined direction, the alignment groove being for aligning the contact pins; and a conductive member formed extending in the predetermined direction, coupled to the alignment member, and electrically connected to the contact pins used for grounding. The alignment member includes any one of a first protrusion and a first hole configured to accommodate the first protrusion in a center area in the predetermined direction, the conductive member includes the other of the first protrusion and the first hole in the center area in the predetermined direction, and the alignment member and the conductive member are coupled to each other by the first protrusion being secured in the first hole.

Abstract: Provided is a connector having: a top pin group 120 having a plurality of contact pins 121, 122 aligned in a predetermined direction; and a bottom pin group having a plurality of contact pins aligned in the predetermined direction in which the bottom pin group is arranged so as to face the top pin group 120 and located on a mount substrate side. Each of the contact pins 121, 122 is at least either one of a signal pin 122 used for signaling and a ground pin 121 used for grounding, and the top pin group 120 includes a double ground configuration in which sets each including two signal pins 122 aligned between two ground pins 121 are aligned adjacent to each other in the predetermined direction.

Abstract: A plug connector 200 configured to be inserted in a host connector 100 includes a plurality of contact pins aligned in a predetermined direction and a housing 210 configured to hold the plurality of contact pins. Each of the contact pins extends in an intersecting direction that is a direction intersecting the predetermined direction, and the housing 210 includes pin grooves 212a provided in the surface thereof, extending in the intersecting direction, and configured to accommodate the contact pins and includes holes 212b provided aligned with the pin grooves 212a in the intersecting direction and recessed deeper than the pin grooves 212a from the surface.

Abstract: A connector for high-speed transmission includes a housing, a column of contacts and a metal member in the contacts. The housing includes an opening portion to be fitted into an external communication partner. The contact has a contact portion in contact with the communication partner, a first linear portion extending rearward from a rear end of the contact portion, a second linear portion bent and extending from a rear end of the first linear portion and a terminal portion soldered to an external substrate. The metal member shorts the contact for ground and is bent so as to avoid contacts other than the contact for ground. The metal member has a bent portion bent in a U-shape across the contacts other than the contact for ground, and is connected to the first and/or the second linear portion of the contact for ground.

Abstract: According to an embodiment of the present disclosure, a connector for high-speed transmission to be fitted with an external counterpart connector includes a housing and a plurality of terminals. The housing has at least one or more slots. The plurality of terminals includes ground terminals and signal terminals are arranged in the slot along a first direction orthogonal to a fitting direction of the connector. Partition walls are provided between adjacent terminals in the slot, and a height of the partition walls between the ground terminals and the signal terminals in the fitting direction is lower than a height of other partition walls in the fitting direction.

Abstract: A group of contact pads (20EB) formed on a lower surface (20B) at a connection end of a board portion of an optical module board (20) includes, in order from the endmost end, a contact pad (20B1) conducting to a ground line (G), contact pads (20B2) and (20B3) conducting to transmission-side high-speed signal lines (S), a contact pad (20B4) conducting to the ground line (G), contact pads (20B5, 20B6, and 20B7) conducting to low-speed signal lines (S), a contact pad (20B8) conducting to the ground line (G), contact pads (20B9 and 20B10) conducting to receiving-side high-speed signal lines (S), and a contact pad (20B11) conducting to the ground line (G).

Abstract: A connector set is provided that includes a first connector, a first cap to be attached to the first connector when the first connector is reflow-mounted on a first external substrate, a second connector, and a second cap to be attached to the second connector when the second connector is reflow-mounted on a second external substrate formed of a material with a smaller thermal expansion coefficient than that of the first external substrate. The second cap is formed of a material with a smaller thermal expansion coefficient than that of the first cap.

Abstract: A connector is provided that includes a plurality of socket type connectors to be mounted on a first substrate and a plurality of plug type connectors to be mounted on a second substrate, thereby electrically connecting the first substrate and the second substrate. The socket type connector includes a housing with a slot and a plurality of contacts arranged in the slot. The plug type connector includes a housing with a header to be fitted in the slot, and a plurality of contacts arranged in the header. The housing of the socket type connector and the housing of the plug type connector has a rotationally asymmetrical shape as viewed from a fitting direction.

Abstract: A connector set is disclosed that includes a plurality of connectors and a cap to be attached to the plurality of connectors when the plurality of connectors are reflow-mounted on an external substrate. Each one end portion of the connectors and the cap is provided with a fitted portion and a fitting portion to be fitted in the fitted portion. The fitted portion is provided with an opening portion for moving the fitting portion so as to absorb thermal expansion from one end portion side to the other end portion side due to temperature conversion of reflow.

Abstract: According to an embodiment, an LGA socket includes a center substrate, first and second insulator and a plurality of pairs of contacts. The center substrate is configured by a multi-layer structure including a ground layer and a plurality of through holes formed through the center substrate. The first insulator is arranged around the plurality of through holes on an upper surface of the center substrate. The second insulator is arranged around the plurality of through holes on a lower surface of the center substrate. The plurality of pairs of contacts are inserted into the through holes from an upper side and from a lower side of the through holes and are soldered via the through holes to be electrically connected to each other.

Abstract: In a transceiver module, when one end portion of a module board (18) is inserted and connected to a concave portion (16R) of a plug connector (16), a projection portion (16PP) formed on the periphery of the concave portion (16R) of the plug connector (16) is fitted into a notch portion (18PH) as one end surface of the module board (18) comes into contact with an inner peripheral surface that forms the concave portion (16R).

Abstract: A host connector includes a connector insulator having a slot allowing detachable insertion of a plug connector of a module, a first contact terminal group including contact terminals arranged inside the connector insulator and each brought into contact with a contact pad on one side at a connection end of the plug connector, and a second contact terminal group including contact terminals each brought into contact with a contact pad on another side opposed to the aforementioned contact pad. The first contact terminal group includes grounding sub-contact terminals arranged inside slits of the connector insulator, grounding main contact terminals supporting the grounding sub-contact terminals, and signal contact terminals. Contact portions of each grounding main contact terminal and of each signal contact terminal having the same shape are arranged on a common straight line, and the signal contact terminals are disposed between the grounding main contact terminals.

Abstract: A length of a protection wall, which is greater than a length of projection of a connecting end portion of a plug connector from opening end portions of an upper case as well as a lower case of an optical module, is set to be smaller than an interval between a contact surface of each of lower stopper pieces of a receptacle cage to come into contact with an end surface of a side wall as well as an end surface of an end surface of the lower case and an opening end surface of a slot of a host connector.