Abstract: A filter circuit includes: a magnetic material core having a hollow hole through which a conductor line can be inserted; a wound wire wound around the magnetic material core through the hollow hole of the magnetic material core; and a variable impedance unit that is connected with the wound wire, and has impedance that is variable depending on a current or a voltage induced from the conductor line to the wound wire.

Abstract: A switch driving device for driving an upper arm switch, which is a switch on an upper arm, and a lower arm switch, which is a switch on a lower arm, where the upper arm and lower arm switches are electrically connected in series with each other. In the switch driving device, a determiner is configured to determine, for each of the upper arm and lower arm switches, whether the switch is on or off, and a driver is configured to, in response to the determiner determining that one of the upper arm and lower arm switches is off, turn on the other of the upper arm and lower arm switches. The determiner is further configured to variably set determination parameters for determining whether a respective one of the upper arm and lower arm switches is on or off, according to characteristics of the upper arm and lower arm switches.

Abstract: A vapor chamber including a container having a cavity portion formed inside, and including a first surface and a second surface opposing the first surface, a working fluid sealed in the cavity portion, and a vapor flow path through which the working fluid in a gas phase flows, the vapor flow path being provided in the cavity portion, wherein a container inner surface area increasing unit including a protruding part is formed on an inner surface of the first surface, and a first wick structure is provided on a surface of the protruding part.

Abstract: A semiconductor device includes a semiconductor substrate including a p-type semiconductor and an n-type semiconductor region arranged on the p-type semiconductor region; a first pattern overlapping the n-type semiconductor region in plan view and formed over the semiconductor substrate; and a second pattern overlapping the first pattern in plan view and magnetically or capacitively coupled to the first pattern.

Abstract: As antibody variants and isoforms having reduced FVIII mimetic activity than Emicizumab, the antibody variants having some specific amino acid residues in the variable region cleaved out and missing (Q-CDR-Clipped Variants) and the antibody isoforms having inter-heavy chain disulfide bonds less susceptible to reduction under mild reducing conditions (Protected Disulfide Isoforms) are provided.

Abstract: A vapor chamber including a container having a cavity portion formed inside, and including a first surface and a second surface opposing the first surface, a working fluid sealed in the cavity portion, and a vapor flow path through which the working fluid in a gas phase flows, the vapor flow path being provided in the cavity portion, wherein a container inner surface area increasing unit including a protruding part is formed on an inner surface of the first surface, and a first wick structure is provided on a surface of the protruding part.

Abstract: It is intended to realize a modular soft robot having a high degree of freedom of movement. A voxel 10 constituting at least a portion of a robot comprises: a polyhedral-shaped casing 100 contractable according to discharge of a working fluid from an internal space thereof; and a deformation-regulating member 200 housed in the casing 100 and configured to regulate deformation of the voxel 10 when the working fluid in the casing 100 is discharged, wherein a plurality of the voxels 10 can be coupled together to constitute at least a portion of a robot.

Abstract: A method for operating a film forming device, the method includes: (a) supplying a silicon-containing gas into a process chamber and coating inside of the process chamber with an amorphous silicon film; (b) supplying a nickel raw material gas into the process chamber after the (a) to form a nickel-containing film; and (c) cleaning the inside of the process chamber by supplying a halogen-containing gas into the process chamber after the (b).

Abstract: To provide a technique capable of controlling a nickel concentration in a silicon film, a film forming method includes: preparing a substrate having an amorphous silicon film on a surface of the substrate; changing a surface state of the amorphous silicon film; and after the changing, diffusing nickel into the amorphous silicon film by supplying a nickel raw material gas to the amorphous silicon film.

Abstract: To provide a technique capable of increasing the nickel concentration in a silicon film, a film forming method according to one embodiment of the present disclosure includes: preparing a substrate having an amorphous silicon film on a surface thereof; and diffusing nickel into the amorphous silicon film by simultaneously supplying a nickel raw material gas and a hydrogen gas to the amorphous silicon film.

Abstract: As antibody variants and isoforms having reduced FVIII mimetic activity than Emicizumab, the antibody variants having some specific amino acid residues in the variable region cleaved out and missing (Q-CDR-Clipped Variants) and the antibody isoforms having inter-heavy chain disulfide bonds less susceptible to reduction under mild reducing conditions (Protected Disulfide Isoforms) are provided.

Abstract: A semiconductor device includes a semiconductor substrate and a multilayer wiring layer disposed on the semiconductor substrate. The semiconductor substrate includes, in plan view, a coil region and a peripheral region surrounding the coil region. The multilayer wiring layer includes a first coil, a second coil, a third coil, a fourth coil, and a metal film. The first coil and the second coil are formed in a first wiring layer being one of the plurality of wiring layers disposed on the coil region. The third coil and the fourth coil are formed in a second wiring layer being another one of the plurality of wiring layers disposed on the coil region. The second wiring layer is disposed above the first wiring layer. The third coil and the fourth coil are disposed so as to face the first coil and the second coil, respectively.

Abstract: The heat transport device includes a first wick structure provided in the internal space of the first heat transport section, and extending from the evaporation section to the condensation section, a second wick structure provided on an inner surface of the second heat transport section, and extending along the heat transport direction of the second heat transport section, and a reflux promoting body provided on the second wick structure, extending along the heat transport direction of the second heat transport section, and having a capillary force, wherein a capillary force of the first wick structure is larger than the capillary force of the reflux promoting body, and the capillary force of the reflux promoting body is larger than a capillary force of the second wick structure, or the capillary force of the reflux promoting body is equal to the capillary force of the second wick structure.

Abstract: A heat sink including a plurality of plate-like radiating fins erected on a base plate at a predetermined erection angle ?1 with respect to an extending direction of the base plate. The radiating fins each has: a fin base portion that extends from one end to another end in a width direction of the radiating fin; a perpendicular portion that extends from one end of the fin base portion to a fin tip portion of the radiating fin on a same plane as the fin base portion; an inclined portion that extends from the perpendicular portion to the other end at a predetermined inclination angle ?2 with respect to the fin base portion and the perpendicular portion and extends from the fin tip portion to a fin intermediate portion; and a twisted portion that connects the fin base portion, the perpendicular portion, and the inclined portion.

Abstract: A noise suppression tape is provided with a tape-shaped insulator, a sticky layer, and a conductive layer. In the sticky layer, one surface is exposed and the other surface is joined to be fixed to one surface of the insulator. A width of the sticky layer is the same as a width of the insulator. The conductive layer, one surface of which is exposed and flush with the one surface of the sticky layer, is embedded in the sticky layer to be fixed to the sticky layer. A width of the conductive layer is smaller than the width of the sticky layer.

Abstract: The heat sink includes a heat transport member having an evaporation portion to be thermally connected to a heat-generating element, a tube body which is connected to a connection portion located in a condensation portion of the heat transport member, and a heat radiation fin group which is thermally connected to the tube body, in which the heat transport member has an integral internal space, the internal space of the heat transport member communicates with an internal space of the tube body via the connection portion, the tube body has a circular portion in which a shape in a radial direction is a circular shape, and a flat portion in which a shape in the radial direction is a flat shape, the circular portion is located in the connection portion, and the flat portion is located in a part to which the heat radiation fin group is thermally connected.

Abstract: A filter circuit includes: a magnetic material core having a hollow hole through which a conductor line can be inserted; a wound wire wound around the magnetic material core through the hollow hole of the magnetic material core; and a variable impedance unit that is connected with the wound wire, and has impedance that is variable depending on a current or a voltage induced from the conductor line to the wound wire.

Abstract: A two-part thermally conductive resin composition can be cured at normal temperature. A cured product has a sufficient resin elongation percentage. A two-part thermally conductive resin composition comprising a component (A) to a component (F): component (A): an epoxy resin (excluding epoxy resins having a (meth) acrylic-based polymer skeleton); component (B): a metal catalyst; component (C): an acrylic-based polymer and/or a polyether polyol (excluding component (D)); component (D): a crosslinkable silyl-containing organic polymer; component (E): an epoxy curing agent; and component (F): a heat dissipating filler.

Abstract: A right angle type connector includes: a first signal terminal for differential signal, including a first portion and a second portion bent via a bent portion, and allocated for one differential signal; a second signal terminal for differential signal, including a first portion and a second portion bent via a bent portion, allocated for an other differential signal, and having a shorter entire length than an entire length of the first signal terminal; a grounding terminal including a first portion and a second portion bent via a bent portion, and allocated for grounding; and a first noise reduction part to increase a parasitic capacitance between the second signal terminal and the grounding terminal, the first noise reduction part being interposed between the first portion located on a bent portion side of the second signal terminal and the first portion located on a bent portion side of the grounding terminal.

Abstract: The heat sink including a base plate and a plurality of plate-like radiating fins, wherein the plate-like radiating fins have a fin base portion that extends from one end to another end of the plate-like radiating fin, and a twisted portion that is provided in a height direction of the plate-like radiating fin from the fin base portion, and inclines in a main front surface direction of the base plate, and the twisted portion has a planar region defined by a twist start portion that linearly stretches from the fin base portion, one end portion that is at least a part of the one end facing the twist start portion and inclines at an angle ?1, and a fin tip portion that is at least a part of a fin tip facing the fin base portion, and inclines at an angle ?2 with respect to the fin base portion.