Patents by Inventor Yosuke Yukawa

Yosuke Yukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8018038
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Grant
    Filed: July 14, 2010
    Date of Patent: September 13, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Hirotaka Nishizawa, Yosuke Yukawa, Takashi Totsuka
  • Publication number: 20100277963
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Application
    Filed: July 14, 2010
    Publication date: November 4, 2010
    Inventors: Hirotaka NISHIZAWA, Yosuke YUKAWA, Takashi TOTSUKA
  • Patent number: 7768110
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Grant
    Filed: October 1, 2007
    Date of Patent: August 3, 2010
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Yosuke Yukawa, Takashi Totsuka
  • Publication number: 20090181721
    Abstract: A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secret codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level. Owing to the adoption of a plural-column layout corresponding to a form typified by the zigzag fashion in an array of the connector terminals, a relatively simple structure can be adopted in a card slot.
    Type: Application
    Filed: March 23, 2009
    Publication date: July 16, 2009
    Inventors: Hirotaka NISHIZAWA, Haruji ISHIHARA, Atsushi SHIRAISHI, Yosuke YUKAWA
  • Patent number: 7547961
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Grant
    Filed: January 2, 2007
    Date of Patent: June 16, 2009
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Yosuke Yukawa, Takashi Totsuka
  • Patent number: 7538418
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Grant
    Filed: January 2, 2007
    Date of Patent: May 26, 2009
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Yosuke Yukawa, Takashi Totsuka
  • Patent number: 7516903
    Abstract: A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secret codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level. Owing to the adoption of a plural-column layout corresponding to a form typified by the zigzag fashion in an array of the connector terminals, a relatively simple structure can be adopted in a card slot.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: April 14, 2009
    Assignees: Renesas Technology Corp., Hitachi ULSI Systems Co., Ltd.
    Inventors: Hirotaka Nishizawa, Haruji Ishihara, Atsushi Shiraishi, Yosuke Yukawa
  • Patent number: 7440337
    Abstract: A memory card (1) includes an electrically rewritable non-volatile memory (4), a data processor (3) having a function of executing instructions, and managing the allocation of file data in the non-volatile memory, an interface control circuit (2) having a function of establishing an external interface, for controlling the execution of instructions by the data processor in response to external commands and for controlling access to the non-volatile memory and a buffer memory (7) for temporarily storing the file data. The interface control circuit includes command control means for decoding a first command externally supplied and for instructing the data processor to fetch an instruction from the buffer memory and to operate.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: October 21, 2008
    Assignee: Renesas Technology Corp.
    Inventors: Kenji Kozakai, Yuusuke Jono, Motoki Kanamori, Kazunori Furusawa, Atsushi Shikata, Yosuke Yukawa
  • Patent number: 7402047
    Abstract: A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively exclusively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secrete codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level.
    Type: Grant
    Filed: June 9, 2006
    Date of Patent: July 22, 2008
    Assignees: Renesas Technology Corp., Hitachi UlSI Systems Co., Ltd.
    Inventors: Hirotaka Nishizawa, Haruji Ishihara, Atsushi Shiraishi, Yosuke Yukawa
  • Publication number: 20080046643
    Abstract: A memory card (1) includes an electrically rewritable non-volatile memory (4), a data processor (3) having a function of executing instructions, and managing the allocation of file data in the non-volatile memory, an interface control circuit (2) having a function of establishing an external interface, for controlling the execution of instructions by the data processor in response to external commands and for controlling access to the non-volatile memory and a buffer memory (7) for temporarily storing the file data. The interface control circuit includes command control means for decoding a first command externally supplied and for instructing the data processor to fetch an instruction from the buffer memory and to operate.
    Type: Application
    Filed: October 12, 2007
    Publication date: February 21, 2008
    Inventors: Kenji Kozakai, Yuusuke Jono, Motoki Kanamori, Kazunori Furusawa, Atsushi Shikata, Yosuke Yukawa
  • Publication number: 20080023562
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Application
    Filed: October 1, 2007
    Publication date: January 31, 2008
    Inventors: Hirotaka NISHIZAWA, Yosuke Yukawa, Takashi Totsuka
  • Patent number: 7292480
    Abstract: A memory card (1) includes an electrically rewritable non-volatile memory (4), a data processor (3) having a function of executing instructions, and managing the allocation of file data in the non-volatile memory, an interface control circuit (2) having a function of establishing an external interface, for controlling the execution of instructions by the data processor in response to external commands and for controlling access to the non-volatile memory and a buffer memory (7) for temporarily storing the file data. The interface control circuit includes command control means for decoding a first command externally supplied and for instructing the data processor to fetch an instruction from the buffer memory and to operate.
    Type: Grant
    Filed: July 18, 2005
    Date of Patent: November 6, 2007
    Assignee: Renesas Technology Corp.
    Inventors: Kenji Kozakai, Yuusuke Jono, Motoki Kanamori, Kazunori Furusawa, Atsushi Shikata, Yosuke Yukawa
  • Patent number: 7291018
    Abstract: A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively exclusively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secrete codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level.
    Type: Grant
    Filed: June 9, 2006
    Date of Patent: November 6, 2007
    Assignees: Renesas Technology Corp., Hitachi ULSI Systems Co., Ltd.
    Inventors: Hirotaka Nishizawa, Haruji Ishihara, Atsushi Shiraishi, Yosuke Yukawa
  • Patent number: 7291019
    Abstract: A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively exclusively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secrete codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level.
    Type: Grant
    Filed: June 9, 2006
    Date of Patent: November 6, 2007
    Assignees: Renesas Technology Corp., Hitachi ULSI Systems Co., Ltd.
    Inventors: Hirotaka Nishizawa, Haruji Ishihara, Atsushi Shiraishi, Yosuke Yukawa
  • Patent number: 7267287
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Grant
    Filed: January 2, 2007
    Date of Patent: September 11, 2007
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Yosuke Yukawa, Takashi Totsuka
  • Patent number: 7224052
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: May 29, 2007
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Yosuke Yukawa, Takashi Totsuka
  • Publication number: 20070111554
    Abstract: A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively exclusively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secrete codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level.
    Type: Application
    Filed: June 9, 2006
    Publication date: May 17, 2007
    Inventors: Hirotaka Nishizaw, Haruji Ishihara, Atsushi Shiraishi, Yosuke Yukawa
  • Publication number: 20070102799
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Application
    Filed: January 2, 2007
    Publication date: May 10, 2007
    Inventors: Hirotaka NISHIZAWA, Yosuke Yukawa, Takashi Totsuka
  • Publication number: 20070102530
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Application
    Filed: January 2, 2007
    Publication date: May 10, 2007
    Inventors: Hirotaka NISHIZAWA, Yosuke Yukawa, Takashi Totsuka
  • Publication number: 20070102798
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Application
    Filed: January 2, 2007
    Publication date: May 10, 2007
    Inventors: Hirotaka Nishizawa, Yosuke Yukawa, Takashi Totsuka