Abstract: A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof, determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser against the polishing cloth while the turntable and the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.

Abstract: A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the workpiece and pressing the workpiece against the polishing surface of the polishing table to thereby polish a surface of the workpiece, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the workpiece.

Abstract: A polishing apparatus such as a semiconductor wafer. The polishing apparatus has a turntable, a cloth cartridge detachably exchangeably mounted on the turntable, and a top ring for holding a workpiece and pressing the workpiece against the polishing cloth. The cloth cartridge includes a cartridge base member and a polishing cloth bonded to an upper surface of the cartridge base member. The cartridge base member comprises a plurality of base member segments, and the polishing cloth comprises a plurality of polishing cloth segments bonded to upper surfaces of respective of the base member segments.

Abstract: A polishing apparatus is employed to polish an object to be polished by urging the surface of the object to be polished against the surface of a polishing cloth and causing a relative movement therebetween, while supplying a polishing liquid into an area between the object to be polished and the polishing cloth. A plurality of nozzles spray respective fluid jets to strike against the surface of the cloth. The plurality of nozzles include more than one type of nozzle which vary flow velocity, flow rate, angle of spray, and cross-sectional configuration of a jet. The plurality of nozzles have axes positioned at a location at different distances from the rotation axis of the polishing cloth.

Abstract: A polishing apparatus for polishing a surface of an object such as a semiconductor wafer includes a turntable having a polishing cloth mounted on an upper surface thereof, a top ring for holding and pressing the object against the polishing cloth, and a plurality of radially arranged nozzles for supplying a polishing solution, containing abrasive material, of different concentrations that differ along a radial direction of the polishing cloth.

Abstract: An apparatus and method for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The workpiece is held by a top ring, and a surface of the workpiece is polished by pressing the workpiece against an abrasive cloth mounted on a turntable while applying an abrasive solution onto the abrasive cloth. While the workpiece is being polished, a surface of the abrasive cloth is dressed while applying a dressing liquid onto the abrasive cloth. A polishing operation and a dressing operation are performed in such a state that the abrasive solution and the dressing liquid do not interfere with each other.

Abstract: A predetermined amount of liquid such as water is supplied to a backside surface of a workpiece such as a semiconductor wafer. Such liquid is a workpiece retaining liquid and is attached to a concave workpiece holding surface of a top ring. The workpiece is positioned between a turntable and the top ring and is polished by an abrasive cloth on the turntable while the workpiece is being pressed against the turntable by the top ring. While polishing, the workpiece is deformed toward the concave workpiece holding surface of the top ring, and a curvature of the deformed workpiece is controlled by the amount of liquid between the workpiece holding surface and the backside surface of the workpiece.

Abstract: A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.

Abstract: A workpiece such as a semiconductor wafer is positioned between a turntable and a top ring and polished by an abrasive cloth on the turntable while the top ring is being pressed against the turntable. The top ring has a retaining ring for preventing the workpiece from deviating from the lower surface of the top ring, and the retaining ring has an inside diameter larger than an outside diameter of the workpiece. The rotation of the turntable imparts a pressing force in a direction parallel to the upper surface of the turntable to the workpiece so that an outer periphery of the workpiece contacts an inner periphery of the retaining ring, and the rotation of the retaining ring imparts a rotational force to the workpiece so that the workpiece performs a planetary motion relative to the top ring in the retaining ring.

Abstract: A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereof for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.