Patents by Inventor Youichi Ito

Youichi Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020104618
    Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.
    Type: Application
    Filed: March 28, 2002
    Publication date: August 8, 2002
    Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
  • Publication number: 20020096116
    Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.
    Type: Application
    Filed: March 28, 2002
    Publication date: July 25, 2002
    Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
  • Publication number: 20020046706
    Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.
    Type: Application
    Filed: December 21, 2001
    Publication date: April 25, 2002
    Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
  • Patent number: 6336991
    Abstract: In a method of holding a substrate and a substrate holding system, the amount of foreign substances on the back surface of the substrate can be decreased, and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: January 8, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
  • Patent number: 6310787
    Abstract: A switching power converter capable of operation in either Nonconversion, Stepdown, or Stepup Mode. Included is a parallel circuit of three serial connections of a first, a second and a third pair of switches. The junction between the first pair of switches is connected to an a.c. input terminal via an inductor, the junction between the second switch pair grounded, and the junction between the third switch pair connected to an a.c. output terminal via another inductor. The first and third switch pairs are driven at the frequency (e.g. 50 Hz) of an a.c. input voltage, and the second switch pair at a higher frequency (e.g. 20 kHz), in Nonconversion Mode; the first switch pair at the low frequency, and the second and third switch pairs at the high frequency, in Stepdown Mode; and the first and second switch pairs at the high frequency, and the third switch pair at low frequency, in Stepup Mode. The second switch pair is invariably driven at the high frequency.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: October 30, 2001
    Assignee: Sanken Electric Co., Ltd.
    Inventors: Youichi Ito, Sinji Sato, Yasuhiro Nakajima, Toshihiko Watanabe
  • Publication number: 20010025608
    Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.
    Type: Application
    Filed: May 7, 2001
    Publication date: October 4, 2001
    Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
  • Publication number: 20010026460
    Abstract: A switching power converter capable of operation in either Nonconversion, Stepdown, or Stepup Mode. Included is a parallel circuit of three serial connections of a first, a second and a third pair of switches. The junction between the first pair of switches is connected to an a.c. input terminal via an inductor, the junction between the second switch pair grounded, and the junction between the third switch pair connected to an a.c. output terminal via another inductor. The first and third switch pairs are driven at the frequency (e.g. 50 Hz) of an a.c. input voltage, and the second switch pair at a higher frequency (e.g. 20 kHz), in Nonconversion Mode; the first switch pair at the low frequency, and the second and third switch pairs at the high frequency, in Stepdown Mode; and the first and second switch pairs at the high frequency, and the third switch pair at low frequency, in Stepup Mode. The second switch pair is invariably driven at the high frequency.
    Type: Application
    Filed: March 29, 2001
    Publication date: October 4, 2001
    Inventors: Youichi Ito, Sinji Sato, Yasuhiro Nakajima, Toshihiko Watanabe
  • Publication number: 20010009178
    Abstract: Present invention provides a method of holding substrate and a substrate holding system where the amount of foreign substances on the back surface can be decreased, and a little amount of foreign substances may be transferred from a mounting table to a substrate. The substrate holding system comprises a ring-shaped leakage-proof surface having smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic ttraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface.
    Type: Application
    Filed: February 8, 2001
    Publication date: July 26, 2001
    Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
  • Patent number: 6221201
    Abstract: Present invention provides a method of holding substrate and a substrate holding system where the amount of foreign substances on the back surface can be decreased, and a little amount of foreign substances may be transferred from a mounting table to a substrate. The substrate holding system comprises a ring-shaped leakage-proof surface having smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic ttraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: April 24, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
  • Patent number: 6217705
    Abstract: A substrate holding system is provided for holding a substrate in a substrate etching apparatus by using electrostatic force. An electrical insulating member is also provided having a top surface approximately at the same level as the treated surface of the substrate and having an inner side surface in adjacent relationship with a surface of the substrate forming the periphery of the substrate. The inner side surface of the electrical insulating member faces the periphery of the substrate in substantially parallel relationship with a direction normal to the treated surface of the substrate. A dielectric film is formed on one surface of a metallic member having a flow passage for circulating a coolant to control the temperature of the substrate. An electrically insulating material member is placed on and in contact with a surface of the metallic member.
    Type: Grant
    Filed: January 7, 2000
    Date of Patent: April 17, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshitumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
  • Patent number: 6048434
    Abstract: A substrate holding system is provided for holding a substrate in a substrate etching apparatus by using electrostatic force. An electrical insulating member is also provided having a top surface approximately at the same level as the treated surface of the substrate and having an inner side surface in adjacent relationship with a surface of the substrate forming the periphery of the substrate. The inner side surface of the electrical insulating member faces the periphery of the substrate in substantially parallel relationship with a direction normal to the treated surface of the substrate. A dielectric film is formed on one surface of a metallic member having a flow passage for circulating a coolant to control the temperature of the substrate. An electrically insulating material member is placed on and in contact with a surface of the metallic member.
    Type: Grant
    Filed: June 20, 1996
    Date of Patent: April 11, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
  • Patent number: 5985035
    Abstract: In a method of holding a substrate and a substrate holding system, the amount of foreign substances on the back surface of the substrate can be decreased and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: November 16, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
  • Patent number: 5961774
    Abstract: In a method of holding a substrate and a substrate holding system, the amount of foreign substances on the back surface of the substrate can be decreased and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions.
    Type: Grant
    Filed: August 1, 1997
    Date of Patent: October 5, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
  • Patent number: 5906684
    Abstract: In a method of holding a substrate and a substrate holding system where, the amount of foreign substances on the back surface of the substrate can be decreased and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions.
    Type: Grant
    Filed: March 31, 1998
    Date of Patent: May 25, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
  • Patent number: 5792304
    Abstract: In a method of a holding substrate and a substrate holding system, the amount of foreign substances on the back surface of the substrate can be decreased, and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions.
    Type: Grant
    Filed: September 16, 1994
    Date of Patent: August 11, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
  • Patent number: 5534273
    Abstract: A method for manufacturing packed wet-type instant noodles of a double-layered structure which is simple in structure as compared with a three-ply structure, excellent in smoothness, tenacity and softness, and have improved elasticity and firmness. This method comprises the steps of, forming a first noodle strip from a dough obtained by kneading in vacuum a first raw material containing an alkaline agent and raw powders consisting mainly of wheat flour and starch, forming a second noodle strip from a dough obtained by kneading a second raw material in a vacuum higher in degree than that employed in kneading the first raw material, the second raw material containing alginic acid or alginate, an alkaline agent and raw powders consisting mainly of wheat flour and 7.
    Type: Grant
    Filed: May 31, 1995
    Date of Patent: July 9, 1996
    Assignee: Toyo Suisan Kaisha, Ltd.
    Inventors: Youichi Ito, Akihiro Hanaoka, Kenichi Tezuka
  • Patent number: 3983577
    Abstract: The data processing terminal unit in the form of a point of sale transaction device disclosed herein contains a keyboard for introducing data into the data processing terminal unit and a cassette tape deck which includes a cassette type magnetic tape and a cassette tape recording scheme for data storage. There are provided an E key and an M key on the keyboard for introducing end marking signals (EM signals) which indicates completion of data entry. The EM signals are introduced into the data processing terminal unit when the E key and the M key are depressed successively or simultaneously, thereby preventing erroneous introduction of the EM signals at an undesired time.
    Type: Grant
    Filed: August 27, 1974
    Date of Patent: September 28, 1976
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Youichi Ito, Kozo Kitamura
  • Patent number: 3938185
    Abstract: The data processing terminal unit in the form of a point of sale transaction device disclosed herein contains a cassette tape deck which includes a cassette type magnetic tape for data manipulation and a cassette tape loading member for allowing the entry and withdrawal of the cassette tape in addition to a cassette tape recording scheme. There is provided a deck state sensing arrangement which detects open and closed states of the tape loading member, a tape loading state, the positions of various records included in the cassette tape and so forth. The tape loading member is opened to allow the withdrawal of the cassette tape loaded within the tape recording scheme only after writing end markings into the cassette tape.
    Type: Grant
    Filed: June 28, 1974
    Date of Patent: February 10, 1976
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Youichi Ito