Patents by Inventor Youichi Ito
Youichi Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20020104618Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.Type: ApplicationFiled: March 28, 2002Publication date: August 8, 2002Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Publication number: 20020096116Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.Type: ApplicationFiled: March 28, 2002Publication date: July 25, 2002Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Publication number: 20020046706Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.Type: ApplicationFiled: December 21, 2001Publication date: April 25, 2002Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 6336991Abstract: In a method of holding a substrate and a substrate holding system, the amount of foreign substances on the back surface of the substrate can be decreased, and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions.Type: GrantFiled: July 2, 1998Date of Patent: January 8, 2002Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 6310787Abstract: A switching power converter capable of operation in either Nonconversion, Stepdown, or Stepup Mode. Included is a parallel circuit of three serial connections of a first, a second and a third pair of switches. The junction between the first pair of switches is connected to an a.c. input terminal via an inductor, the junction between the second switch pair grounded, and the junction between the third switch pair connected to an a.c. output terminal via another inductor. The first and third switch pairs are driven at the frequency (e.g. 50 Hz) of an a.c. input voltage, and the second switch pair at a higher frequency (e.g. 20 kHz), in Nonconversion Mode; the first switch pair at the low frequency, and the second and third switch pairs at the high frequency, in Stepdown Mode; and the first and second switch pairs at the high frequency, and the third switch pair at low frequency, in Stepup Mode. The second switch pair is invariably driven at the high frequency.Type: GrantFiled: March 29, 2001Date of Patent: October 30, 2001Assignee: Sanken Electric Co., Ltd.Inventors: Youichi Ito, Sinji Sato, Yasuhiro Nakajima, Toshihiko Watanabe
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Publication number: 20010025608Abstract: A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.Type: ApplicationFiled: May 7, 2001Publication date: October 4, 2001Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Publication number: 20010026460Abstract: A switching power converter capable of operation in either Nonconversion, Stepdown, or Stepup Mode. Included is a parallel circuit of three serial connections of a first, a second and a third pair of switches. The junction between the first pair of switches is connected to an a.c. input terminal via an inductor, the junction between the second switch pair grounded, and the junction between the third switch pair connected to an a.c. output terminal via another inductor. The first and third switch pairs are driven at the frequency (e.g. 50 Hz) of an a.c. input voltage, and the second switch pair at a higher frequency (e.g. 20 kHz), in Nonconversion Mode; the first switch pair at the low frequency, and the second and third switch pairs at the high frequency, in Stepdown Mode; and the first and second switch pairs at the high frequency, and the third switch pair at low frequency, in Stepup Mode. The second switch pair is invariably driven at the high frequency.Type: ApplicationFiled: March 29, 2001Publication date: October 4, 2001Inventors: Youichi Ito, Sinji Sato, Yasuhiro Nakajima, Toshihiko Watanabe
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Publication number: 20010009178Abstract: Present invention provides a method of holding substrate and a substrate holding system where the amount of foreign substances on the back surface can be decreased, and a little amount of foreign substances may be transferred from a mounting table to a substrate. The substrate holding system comprises a ring-shaped leakage-proof surface having smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic ttraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface.Type: ApplicationFiled: February 8, 2001Publication date: July 26, 2001Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 6221201Abstract: Present invention provides a method of holding substrate and a substrate holding system where the amount of foreign substances on the back surface can be decreased, and a little amount of foreign substances may be transferred from a mounting table to a substrate. The substrate holding system comprises a ring-shaped leakage-proof surface having smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic ttraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface.Type: GrantFiled: July 2, 1998Date of Patent: April 24, 2001Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 6217705Abstract: A substrate holding system is provided for holding a substrate in a substrate etching apparatus by using electrostatic force. An electrical insulating member is also provided having a top surface approximately at the same level as the treated surface of the substrate and having an inner side surface in adjacent relationship with a surface of the substrate forming the periphery of the substrate. The inner side surface of the electrical insulating member faces the periphery of the substrate in substantially parallel relationship with a direction normal to the treated surface of the substrate. A dielectric film is formed on one surface of a metallic member having a flow passage for circulating a coolant to control the temperature of the substrate. An electrically insulating material member is placed on and in contact with a surface of the metallic member.Type: GrantFiled: January 7, 2000Date of Patent: April 17, 2001Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshitumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 6048434Abstract: A substrate holding system is provided for holding a substrate in a substrate etching apparatus by using electrostatic force. An electrical insulating member is also provided having a top surface approximately at the same level as the treated surface of the substrate and having an inner side surface in adjacent relationship with a surface of the substrate forming the periphery of the substrate. The inner side surface of the electrical insulating member faces the periphery of the substrate in substantially parallel relationship with a direction normal to the treated surface of the substrate. A dielectric film is formed on one surface of a metallic member having a flow passage for circulating a coolant to control the temperature of the substrate. An electrically insulating material member is placed on and in contact with a surface of the metallic member.Type: GrantFiled: June 20, 1996Date of Patent: April 11, 2000Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 5985035Abstract: In a method of holding a substrate and a substrate holding system, the amount of foreign substances on the back surface of the substrate can be decreased and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions.Type: GrantFiled: July 2, 1998Date of Patent: November 16, 1999Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 5961774Abstract: In a method of holding a substrate and a substrate holding system, the amount of foreign substances on the back surface of the substrate can be decreased and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions.Type: GrantFiled: August 1, 1997Date of Patent: October 5, 1999Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 5906684Abstract: In a method of holding a substrate and a substrate holding system where, the amount of foreign substances on the back surface of the substrate can be decreased and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions.Type: GrantFiled: March 31, 1998Date of Patent: May 25, 1999Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 5792304Abstract: In a method of a holding substrate and a substrate holding system, the amount of foreign substances on the back surface of the substrate can be decreased, and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions.Type: GrantFiled: September 16, 1994Date of Patent: August 11, 1998Assignee: Hitachi, Ltd.Inventors: Naoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
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Patent number: 5534273Abstract: A method for manufacturing packed wet-type instant noodles of a double-layered structure which is simple in structure as compared with a three-ply structure, excellent in smoothness, tenacity and softness, and have improved elasticity and firmness. This method comprises the steps of, forming a first noodle strip from a dough obtained by kneading in vacuum a first raw material containing an alkaline agent and raw powders consisting mainly of wheat flour and starch, forming a second noodle strip from a dough obtained by kneading a second raw material in a vacuum higher in degree than that employed in kneading the first raw material, the second raw material containing alginic acid or alginate, an alkaline agent and raw powders consisting mainly of wheat flour and 7.Type: GrantFiled: May 31, 1995Date of Patent: July 9, 1996Assignee: Toyo Suisan Kaisha, Ltd.Inventors: Youichi Ito, Akihiro Hanaoka, Kenichi Tezuka
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Patent number: 3983577Abstract: The data processing terminal unit in the form of a point of sale transaction device disclosed herein contains a keyboard for introducing data into the data processing terminal unit and a cassette tape deck which includes a cassette type magnetic tape and a cassette tape recording scheme for data storage. There are provided an E key and an M key on the keyboard for introducing end marking signals (EM signals) which indicates completion of data entry. The EM signals are introduced into the data processing terminal unit when the E key and the M key are depressed successively or simultaneously, thereby preventing erroneous introduction of the EM signals at an undesired time.Type: GrantFiled: August 27, 1974Date of Patent: September 28, 1976Assignee: Sharp Kabushiki KaishaInventors: Youichi Ito, Kozo Kitamura
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Patent number: 3938185Abstract: The data processing terminal unit in the form of a point of sale transaction device disclosed herein contains a cassette tape deck which includes a cassette type magnetic tape for data manipulation and a cassette tape loading member for allowing the entry and withdrawal of the cassette tape in addition to a cassette tape recording scheme. There is provided a deck state sensing arrangement which detects open and closed states of the tape loading member, a tape loading state, the positions of various records included in the cassette tape and so forth. The tape loading member is opened to allow the withdrawal of the cassette tape loaded within the tape recording scheme only after writing end markings into the cassette tape.Type: GrantFiled: June 28, 1974Date of Patent: February 10, 1976Assignee: Sharp Kabushiki KaishaInventor: Youichi Ito