Patents by Inventor Younes Achkire
Younes Achkire has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090032068Abstract: In one aspect, a method is provided. The method comprises forming a meniscus at an interface between a substrate and a fluid surface by moving the substrate through the fluid; shortening the meniscus by applying an air knife to the meniscus at the interface between the substrate and the fluid surface; and Marangoni drying the substrate by applying a drying vapor to the shortened meniscus. Numerous other aspects are provided.Type: ApplicationFiled: October 12, 2008Publication date: February 5, 2009Applicant: APPLIED MATERIALS, INC.Inventors: Nathan D. Stein, Younes Achkire, Timothy J. Franklin, Julia Svirchevski, Dan A. Marohl
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Publication number: 20080210258Abstract: A scrubber box is provided that includes a tank adapted to receive a substrate for cleaning, supports outside of the tank and adapted to couple to ends of scrubber brushes disposed within the tank, a motor mounted to each of the supports and adapted to rotate the scrubber brushes, a base to which the supports are pivotally mounted via spherical bearings adapted to permit toe-in of the scrubber brushes, a brush gap actuator adapted, via a crank and rocker mechanism, to substantially simultaneously pivot the supports toward or away from each other so as to permit the scrubber brushes to substantially simultaneously achieve or break contact with the substrate, and a toe-in actuator adapted to move two of the spherical bearings toward or away from each other so as to adjust a toe-in angle between the scrubber brushes.Type: ApplicationFiled: April 14, 2008Publication date: September 4, 2008Inventors: Joseph Yudovsky, Avi Tepman, Kenneth R. Reynolds, Younes Achkire, Dan A. Marohl, Steve G. Ghanayem, Alexander S. Polyak, Gary Ettinger, Haochuan Zhang, Hui Chen
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Patent number: 7377002Abstract: A scrubber box is provided that includes a tank adapted to receive a substrate for cleaning, supports outside of the tank and adapted to couple to ends of scrubber brushes disposed within the tank, a motor mounted to each of the supports and adapted to rotate the scrubber brushes, a base to which the supports are pivotally mounted via spherical bearings adapted to permit toe-in of the scrubber brushes, a brush gap actuator adapted, via a crank and rocker mechanism, to substantially simultaneously pivot the supports toward or away from each other so as to permit the scrubber brushes to substantially simultaneously achieve or break contact with the substrate, and a toe-in actuator adapted to move two of the spherical bearings toward or away from each other so as to adjust a toe-in angle between the scrubber brushes.Type: GrantFiled: October 28, 2004Date of Patent: May 27, 2008Assignee: Applied Materials, Inc.Inventors: Joseph Yudovsky, Avi Tepman, Kenneth R. Reynolds, Younes Achkire, Dan A. Marohl, Steve G. Ghanayem, Alexander S. Polyak, Gary Ettinger, Haochuan Zhang, Hui Chen
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Patent number: 7364349Abstract: A dilution stage is adapted to supply a dilute chemistry to a semiconductor device processing apparatus. The dilution stage includes a first vessel adapted to store the chemistry after dilution and a second vessel adapted to store the chemistry prior to dilution. The dilution stage may also include a control mechanism which is adapted to selectively control flowing of the chemistry and a dilutant to the first vessel. The control mechanism may be operative to fill the second vessel with the chemistry, and to flow the dilutant to the first vessel via the second vessel.Type: GrantFiled: May 22, 2006Date of Patent: April 29, 2008Assignee: Applied Materials, Inc.Inventors: Younes Achkire, Julia Svirchevski, Jonathan S. Frankel, Kien-Bang Lam
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Publication number: 20070295371Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.Type: ApplicationFiled: August 28, 2007Publication date: December 27, 2007Inventors: Younes Achkire, Alexander Lerner, Boris Govzman, Boris Fishkin, Michael Sugarman, Rashid Mavleiv, Haoquan Fang, Shijian Li, Guy Shirazi, Jianshe Tang
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Publication number: 20060211344Abstract: A dilution stage is adapted to supply a dilute chemistry to a semiconductor device processing apparatus. The dilution stage includes a first vessel adapted to store the chemistry after dilution and a second vessel adapted to store the chemistry prior to dilution. The dilution stage may also include a control mechanism which is adapted to selectively control flowing of the chemistry and a dilutant to the first vessel. The control mechanism may be operative to fill the second vessel with the chemistry, and to flow the dilutant to the first vessel via the second vessel.Type: ApplicationFiled: May 22, 2006Publication date: September 21, 2006Inventors: Younes Achkire, Julia Svirchevski, Jonathan Frankel, Kien-Bang Lam
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Publication number: 20060207634Abstract: In a first aspect, a method is provided that includes the steps of (1) providing a tank having a volume of fluid filled to a level; (2) inserting a substrate into the tank; (3) displacing fluid in the tank due to a volume of the substrate; and (4) adjusting the volume of fluid in the tank to compensate for the volume of the substrate so as to maintain the level of fluid in the tank. Numerous other aspects are provided.Type: ApplicationFiled: March 16, 2005Publication date: September 21, 2006Inventor: Younes Achkire
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Publication number: 20060174921Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.Type: ApplicationFiled: April 4, 2006Publication date: August 10, 2006Inventors: Younes Achkire, Alexander Lerner, Boris Govzman, Boris Fishkin, Michael Sugarman, Rashid Mavleiv, Haoquan Fang, Shijian Li, Guy Shirazi, Jianshe Tang
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Publication number: 20050241684Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.Type: ApplicationFiled: July 12, 2005Publication date: November 3, 2005Inventors: Younes Achkire, Alexander Lerner, Boris Govzman, Boris Fishkin, Michael Sugarman, Rashid Mavleiv, Haoquan Fang, Shijian Li, Guy Shirazi, Jianshe Tang
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Patent number: 6957749Abstract: In a first aspect, a liquid delivery system is provided that includes a first liquid delivery module adapted to store and dispense a first chemical and a second liquid delivery module adapted to store and dispense a second chemical. The liquid delivery system further includes at least one connecting mechanism coupled to the first and second delivery modules and adapted to couple the first and second delivery modules to a substrate processing device. Each delivery module includes a vessel including a first chamber and a second chamber. The vessel is configured to receive a liquid from a bulk supply and to receive a pressurized flow of gas from a gas source. Each liquid delivery module also includes a valve assembly operable to selectively permit fluid communication between the first chamber and the second chamber during a non-refill state and to prevent fluid communication between the first chamber and the second chamber during a refill state.Type: GrantFiled: May 30, 2003Date of Patent: October 25, 2005Assignee: Applied Materials, Inc.Inventors: Younes Achkire, Jonathan S Frankel, Brian J Brown
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Publication number: 20050229426Abstract: In a first aspect, a first method of drying a substrate is provided. The first method includes the steps of (1) lifting a substrate through an air/fluid interface at a first rate; (2) directing a drying vapor at the air/fluid interface during lifting of the substrate; and (3) while a portion of the substrate remains in the air/fluid interface, reducing a rate at which a remainder of the substrate is lifted through the air/fluid interface to a second rate. The drying vapor may form an angle of about 23° with the air/fluid interface and/or the second rate may be about 2.5 mm/sec.Type: ApplicationFiled: February 9, 2005Publication date: October 20, 2005Inventors: Younes Achkire, Alexander Lerner, Boris Govzman, Boris Fishkin, Michael Sugarman, Rashid Mavliev, Haoquan Fang, Shijian Li, Guy Shirazi, Jianshe Tang
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Patent number: 6955516Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.Type: GrantFiled: November 1, 2002Date of Patent: October 18, 2005Assignee: Applied Materials, Inc.Inventors: Younes Achkire, Alexander Lerner, Boris T. Govzman, Boris Fishkin, Michael Sugarman, Rashid Mavliev, Haoquan Fang, Shijian Li, Guy Shirazi, Jianshe Tang
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Publication number: 20050087212Abstract: A scrubber box is provided that includes a tank adapted to receive a substrate for cleaning, supports outside of the tank and adapted to couple to ends of scrubber brushes disposed within the tank, a motor mounted to each of the supports and adapted to rotate the scrubber brushes, a base to which the supports are pivotally mounted via spherical bearings adapted to permit toe-in of the scrubber brushes, a brush gap actuator adapted, via a crank and rocker mechanism, to substantially simultaneously pivot the supports toward or away from each other so as to permit the scrubber brushes to substantially simultaneously achieve or break contact with the substrate, and a toe-in actuator adapted to move two of the spherical bearings toward or away from each other so as to adjust a toe-in angle between the scrubber brushes.Type: ApplicationFiled: October 28, 2004Publication date: April 28, 2005Inventors: Joseph Yudovsky, Avi Tepman, Kenneth Reynolds, Younes Achkire, Dan Marohl, Steve Ghanayem, Alexander Polyak, Gary Ettinger, Haochuan Zhang, Hui Chen
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Publication number: 20040197179Abstract: A substrate handler is provided comprising a carriage positionable along a first axis of motion, a first substrate gripper coupled to the carriage and positionable relative to the carriage along a second axis of motion oriented substantially perpendicular to the first axis of motion, and a second substrate gripper coupled to the carriage and positionable relative to the carriage along a third axis of motion oriented substantially parallel to the second axis of motion, wherein the second gripper is independently movable relative to the first gripper.Type: ApplicationFiled: April 3, 2003Publication date: October 7, 2004Applicant: Applied Materials, Inc.Inventors: Younes Achkire, Dan Marohl, Lakshmanan Karuppiah
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Publication number: 20040130965Abstract: A dilution stage is adapted to supply a dilute chemistry to a semiconductor device processing apparatus. The dilution stage includes a first vessel adapted to store the chemistry after dilution and a second vessel adapted to store the chemistry prior to dilution. The dilution stage may also include a control mechanism which is adapted to selectively control flowing of the chemistry and a dilutant to the first vessel. The control mechanism may be operative to fill the second vessel with the chemistry, and to flow the dilutant to the first vessel via the second vessel.Type: ApplicationFiled: January 6, 2003Publication date: July 8, 2004Applicant: APPLIED MATERIALS, INC.Inventors: Younes Achkire, Julia Svirchevski, Jonathan S. Frankel, Kien-Bang Lam
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Patent number: 6749086Abstract: A pressurized delivery module having two chambers enables refill of the module while liquid material continues to be supplied to a semiconductor processing tool. Initially, the chambers are in fluid communication with each other through a valve assembly, with positive pressure applied to the module from an inert gas supply. When material in the module becomes depleted, the chambers are isolated from one another to permit refilling. In the refill module state, one chamber remains pressurized, with material remaining therein continued to be dispensed to the semiconductor fabrication tool. The second chamber is vented and placed into fluid communication with the bulk material supply. Once the level of material in the second chamber has been replenished and processing of the remaining wafer has been completed, during transfer of the next incoming wafer to the tool, the second chamber is sealed off from the material supply, repressurized, and placed back into fluid communication with the first chamber.Type: GrantFiled: December 1, 2000Date of Patent: June 15, 2004Assignee: Applied Materials Inc.Inventors: Younes Achkire, Johnathan Frankel, Brian Brown
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Publication number: 20040031167Abstract: In one aspect, a method of drying a substrate includes (1) setting a gas delivery angle for an air knife used during an immersion-drying process; (2) using the air knife during immersion drying of a hydrophilic substrate; and (3) using the air knife during immersion drying of a hydrophobic substrate. The gas delivery angle is unchanged during immersion drying of both the hydrophilic substrate and hydrophobic substrate. Numerous other aspects are provided.Type: ApplicationFiled: June 13, 2003Publication date: February 19, 2004Inventors: Nathan D. Stein, Younes Achkire, Timothy J. Franklin, Julia Svirchevski, Dan A. Marohl
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Publication number: 20040000377Abstract: In a first aspect, a liquid delivery system is provided that includes a first liquid delivery module adapted to store and dispense a first chemical and a second liquid delivery module adapted to store and dispense a second chemical. The liquid delivery system further includes at least one connecting mechanism coupled to the first and second delivery modules and adapted to couple the first and second delivery modules to a substrate processing device. Each delivery module includes a vessel including a first chamber and a second chamber. The vessel is configured to receive a liquid from a bulk supply and to receive a pressurized flow of gas from a gas source. Each liquid delivery module also includes a valve assembly operable to selectively permit fluid communication between the first chamber and the second chamber during a non-refill state and to prevent fluid communication between the first chamber and the second chamber during a refill state.Type: ApplicationFiled: May 30, 2003Publication date: January 1, 2004Inventors: Younes Achkire, Jonathon S. Frankel, Brian J. Brown
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Publication number: 20030121170Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.Type: ApplicationFiled: November 1, 2002Publication date: July 3, 2003Applicant: APPLIED MATERIALS, INC.Inventors: Younes Achkire, Alexander Lerner, Boris T. Govzman, Boris Fishkin, Michael Sugarman, Rashid Mavliev, Haoquan Fang, Shijian Li, Guy Shirazi
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Publication number: 20020066410Abstract: A pressurized delivery module having two chambers enables refill of the module while liquid material continues to be supplied to a semiconductor processing tool. Initially, the chambers are in fluid communication with each other through a valve assembly, with positive pressure applied to the module from an inert gas supply. When material in the module becomes depleted, the chambers are isolated from one another to permit refilling. In the refill module state, one chamber remains pressurized, with material remaining therein continued to be dispensed to the semiconductor fabrication tool. The second chamber is vented and placed into fluid communication with the bulk material supply. Once the level of material in the second chamber has been replenished and processing of the remaining wafer has been completed, during transfer of the next incoming wafer to the tool, the second chamber is sealed off from the material supply, repressurized, and placed back into fluid communication with the first chamber.Type: ApplicationFiled: December 1, 2000Publication date: June 6, 2002Applicant: Applied Materials Inc.Inventors: Younes Achkire, Johnathan Frankel, Brian Brown