Patents by Inventor Young Chae Lee

Young Chae Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970090
    Abstract: A railess variable seatback type rear seat includes: a linear movement device configured to convert a rotation of a motor into a linear movement; a sliding movement device configured to convert the linear movement into a sliding movement in which a seat cushion is pushed forward or backward; and a reclining angle change device configured to convert the sliding movement into a reclining movement, and to fold a seatback, which is connected to the seat cushion, forward or to recline the seatback backward.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: April 30, 2024
    Assignees: HYUNDAI MOTOR COMPANY, Kia Corporation, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.
    Inventors: Seung-Hyun Kim, Sang-Hyun Lee, Min-Ju Lee, Byung-Yong Choi, Chan-Ho Jung, Seon-Chae Na, Young-Woon Choi, Jae-Jin Lee, Dong-Hwan Kim, In-Chang Hwang
  • Publication number: 20130084405
    Abstract: A method for plating circuits on a housing by spraying and laser engraving is provided. Before manufacturing the circuit, a first spraying layer is formed. The thickness of the first spraying layer is approximately equal to that of the circuit to be formed thereon. Laser engraving is used to form laser engraving areas for forming the circuit metal layer. Then the circuit metal layer is formed by chemical plating, and the thickness of the metal layer is approximately equal to that of the first spraying layer. Then a second spraying layer is applied on both of the metal layer and the first spraying layer so as to present a flat and aesthetic appearance. As the present invention is applied in 2-shot molding, each time the pattern of the circuit is changed, it is only necessary to change the paths in the laser engraving. No more molds modification is needed for changing the pattern of the circuit.
    Type: Application
    Filed: October 3, 2011
    Publication date: April 4, 2013
    Inventors: Young Chae Lee, Sheng-Hong Wang, De-Shan Liang
  • Publication number: 20100101593
    Abstract: Disclosed is a nail pack, and more particularly, for alleviating a damage of a nail by being adhered to the surface of a nail such as a fingernail or toenail and supplying nutrition and moisture to the nail, and for providing easiness in removal in spite of excellent adhesion strength, a nail pack including a base sheet having elasticity or flexibility to be adhered to and cover a surface of a fingernail or a toenail, and a moisturizing agent or nutrient applied to one side or both sides of the base sheet, in which a flap may be formed at a circumferential edge of the base sheet, and in this case, a boundary between the base sheet and the flap is in the shape of zigzag or wave when viewed from top or the outer ring of the flap is in the shape of zigzag or wave when viewed from side, a plurality of air holes are bored in the base sheet, and the base sheet is rounded to protrude upward in a convex shape.
    Type: Application
    Filed: August 19, 2009
    Publication date: April 29, 2010
    Inventors: Young Chae Lee, Kwan Soo Wom