Abstract: According to an aspect of the present disclosure, there is provided a substrate treating apparatus comprising: a vessel part having a substrate treatment region formed therein and including a supply port through which a treating fluid is supplied to the substrate treatment region and an exhaust port through which the treating fluid is exhausted from the substrate treatment region; a fluid supply unit configured to supply the treating fluid to the substrate treatment region; an exhaust unit configured to exhaust the treating fluid from the vessel part. The exhaust unit comprises: a main line connected to the exhaust port; an extension line branched from at least one of first and second nodes of the main line and including at least one of a first orifice or a first check valve to control an exhaust speed; and an auxiliary line branched from a third node of the main line, where an orifice and a check valve are not formed.

Abstract: A protection film for an electronic device includes an adhesive layer including a first surface to which an electronic device is attached, and a film layer which contacts a second surface of the adhesive layer and includes at least one member, where a thickness of the adhesive layer satisfies Inequality 1: z?(5.1x+57.4)·ln(y)?(14.7x+140.5), where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.

Abstract: A method for counting coughs is provided. The method includes acquiring a plurality of onset signals from the sound signal, wherein the onset signal has a predetermined time length; acquiring a plurality of spectrograms corresponding to each of the plurality of onset signals; determining whether each of the acquired plurality of spectrograms represents a cough using a cough determination model; and calculating a number of coughs included in the sound signal based on a time point of a cough signal. The cough signal is an onset signal corresponding to one spectrogram determined to represent the cough. When a time interval between a first time point of a first cough signal and a second time point of a second cough is within a reference time interval, the first cough signal and the second cough signal are regarded as one cough signal at the first time point.

Abstract: A hydrogen storage device includes a storage container having an accommodation space in an interior thereof, a first metal hydride material provided in the interior of the storage container and that stores hydrogen, and a second metal hydride material provided in the interior of the storage container and that stores the hydrogen at a pressure that is different from that of the first metal hydride material. An advantageous effect of restraining an excessive rise of a pressure of the storage container and enhancing safety and reliability may be obtained.

Abstract: A hydrogen storage system is disclosed and includes a storage unit including a plurality of unit storage containers, in which metal hydride materials are respectively provided in an interior thereof and which are connected to each other in parallel, and a thermal fluid line defining a thermal fluid passage, which passes via the plurality of unit storage containers continuously and through which a thermal fluid flows for heating or cooling the unit storage containers, thereby enhancing a storage performance and an efficiency of the hydrogen.

Abstract: Disclosed is a liquid mulching agent composition, which is environmentally friendly due to use of seaweed, facilitates soil coating, and has high light blocking efficiency, making it possible to control heat retention and water content in the soil. The liquid mulching agent composition includes a seaweed extract, a first component including at least one selected from the group consisting of humic acid, fulvic acid, and charcoal, and a second component including at least one selected from the group consisting of sodium alginate, polyvinyl alcohol, keratin, and sodium silicate.

Abstract: Provided in a semiconductor device including a substrate, an active region upwardly protruding from the substrate, a plurality of active fins upwardly protruding from the active region and extending in a first direction parallel to an upper surface of the substrate, the plurality of active fins being provided in a second direction that is parallel to the upper surface of the substrate and intersects with the first direction, and an isolation structure provided on the substrate, the isolation structure covering a sidewall of the active region and a lower portion of a sidewall of each of the plurality of active fins, wherein a first sidewall of the active region adjacent to a first active fin among the plurality of active fins has a staircase shape, the first active fin being provided on a first edge of the active region in the second direction.

Abstract: A method of obtaining urination information and a device thereof are proposed. The method includes obtaining one or more first feature data by using first sound data, obtaining a urine volume determination value by using the one or more first feature data and a pre-trained urine volume determination model, obtaining a urine flow rate determination value by using the one or more first feature data and a pre-trained urine flow rate determination model, and obtaining urine flow rate information by reflecting a ratio of an estimated urine volume calculated based on the urine flow rate determination value and the urine volume determination value to the urine flow rate determination value.

Abstract: Semiconductor packaging substrates and processing sequences are described. In an embodiment, a packaging substrate includes a build-up structure, and a patterned metal contact layer partially embedded within the build-up structure and protruding from the build-up structure. The patterned metal contact layer may include an array of surface mount (SMT) metal bumps in a chip mount area, a metal dam structure or combination thereof.

Abstract: Disclosed is a rotor including a sleeve part having a shape corresponding to a cylinder extending in a reference direction, and having an inner hole extending in the reference direction, in an interior thereof, a division part disposed in the inner hole, and dividing the inner hole into a first space and a second space, together with the sleeve part, a first magnet part disposed in the first space, and a second magnet part disposed in the second space, and disposed to have an opposite polarity to that of the first magnet part when viewed along the reference direction.

Abstract: Die reconstitution methods and dies with reconstituted contact bumps are described. In an embodiment, a die reconstitution method includes reconstituting a plurality of dies including first contact bumps of a first type, partially removing the first contact bumps, and forming second contact bumps of a second type on top of the partially removed first contact bumps, where the second type is different than the first type.

Abstract: A power electronics module for an industrial or vehicle battery charger system or the like is provided. The power electronics module utilizes a chassis housing including a heatsink surface and a plurality of sidewalls. A main power section printed circuit board is disposed adjacent to the heatsink surface of the chassis housing a. A low voltage, low power printed circuit board is disposed adjacent to the main power section printed circuit board opposite the heatsink surface of the chassis housing. An alternating current input filter portion printed circuit board including electromagnetics is disposed along one of the plurality of sidewalls of the chassis housing and separated from the low voltage, low power printed circuit board within the chassis housing.

Abstract: An illustrative drive unit for an electric vehicle includes a first electrical motor, a first axle mechanically couplable to the first electrical motor, a second electrical motor, a second axle mechanically couplable to the second electrical motor, and a dual power inverter module electrically couplable to a source of high voltage DC electrical power. The dual power inverter module includes: a first inverter configured to convert the high voltage DC electrical power to three phase, high voltage AC electrical power and electrically couplable to provide the three phase, high voltage AC electrical power to the first electrical motor; a second inverter configured to convert the high voltage DC electrical power to three phase, high voltage AC electrical power and electrically couplable to provide the three phase, high voltage AC electrical power to the second electrical motor; and a common controller configured to control the first inverter and the second inverter.

Abstract: Semiconductor packaging substrates and processing sequences are described. In an embodiment, a packaging substrate includes a build-up structure, and a patterned metal contact layer partially embedded within the build-up structure and protruding from the build-up structure. The patterned metal contact layer may include an array of surface mount (SMT) metal bumps in a chip mount area, a metal dam structure or combination thereof.

Abstract: An illustrative dual power inverter module includes a DC link capacitor electrically connectable to a source of high voltage direct current (DC) electrical power. A first power inverter is electrically connectable to the DC link capacitor and configured to convert high voltage DC electrical power to three phase high voltage alternating current (AC) electrical power and is configured to supply the three phase high voltage AC electrical power to a first electric motor. A second power inverter is electrically connectable to the DC link capacitor and configured to convert high voltage DC electrical power to three phase high voltage AC electrical power and is configured to supply the three phase high voltage AC electrical power to a second electric motor. A common controller is electrically connectable to the first power inverter and the second power inverter. The common controller is configured to control the first power inverter and the second power inverter.

Abstract: An illustrative drive unit for an electric vehicle includes a first electrical motor, a first axle mechanically couplable to the first electrical motor, a second electrical motor, a second axle mechanically couplable to the second electrical motor, and a dual power inverter module electrically couplable to a source of high voltage DC electrical power. The dual power inverter module includes: a first inverter configured to convert the high voltage DC electrical power to three phase, high voltage AC electrical power and electrically couplable to provide the three phase, high voltage AC electrical power to the first electrical motor; a second inverter configured to convert the high voltage DC electrical power to three phase, high voltage AC electrical power and electrically couplable to provide the three phase, high voltage AC electrical power to the second electrical motor; and a common controller configured to control the first inverter and the second inverter.

Abstract: An illustrative dual power inverter module includes a DC link capacitor electrically connectable to a source of high voltage direct current (DC) electrical power. A first power inverter is electrically connectable to the DC link capacitor and configured to convert high voltage DC electrical power to three phase high voltage alternating current (AC) electrical power and is configured to supply the three phase high voltage AC electrical power to a first electric motor. A second power inverter is electrically connectable to the DC link capacitor and configured to convert high voltage DC electrical power to three phase high voltage AC electrical power and is configured to supply the three phase high voltage AC electrical power to a second electric motor. A common controller is electrically connectable to the first power inverter and the second power inverter. The common controller is configured to control the first power inverter and the second power inverter.

Abstract: Provided in a semiconductor device including a substrate, an active region upwardly protruding from the substrate, a plurality of active fins upwardly protruding from the active region and extending in a first direction parallel to an upper surface of the substrate, the plurality of active fins being provided in a second direction that is parallel to the upper surface of the substrate and intersects with the first direction, and an isolation structure provided on the substrate, the isolation structure covering a sidewall of the active region and a lower portion of a sidewall of each of the plurality of active fins, wherein a first sidewall of the active region adjacent to a first active fin among the plurality of active fins has a staircase shape, the first active fin being provided on a first edge of the active region in the second direction.

Abstract: Semiconductor packaging substrates and processing sequences are described. In an embodiment, a packaging substrate includes a build-up structure, and a patterned metal contact layer partially embedded within the build-up structure and protruding from the build-up structure. The patterned metal contact layer may include an array of surface mount (SMT) metal bumps in a chip mount area, a metal dam structure or combination thereof.

Abstract: Various disclosed embodiments include illustrative inverter modules that are integratably mountable with a drive unit of a vehicle, illustrative drive units with an inverter module integratably mounted therewith, and illustrative vehicles with at least one drive unit with an inverter module integratably mounted therewith. Given by way of non-limiting example, an illustrative module for a drive unit of a vehicle includes a housing having an open face defined therein. Inverter circuitry is disposed in the housing.