Abstract: A battery pack includes a battery module assembly having at least one battery cell, a pack case configured to accommodate the battery module assembly, and a barrier unit provided on at least one side of the pack case, configured to discharge a vent gas in the pack case to the outside of the pack case and having at least one blocking baffle disposed obliquely to have a predetermined inclination angle.

Abstract: A battery pack includes a plurality of battery modules each including one or more battery cells to store and release energy, each battery module further including an intake portion and an exhaust portion, an intake duct including an intake channel and communicating with the intake portion of each of the plurality of battery modules, and an exhaust duct including an exhaust channel and communicating with the exhaust portion of each of the plurality of battery modules. Each of the plurality of battery modules further includes an opening/closing member configured to close the intake portion when internal pressure increases.

Abstract: According to one embodiment, a method by which a device provides a service so as to enable cognitive function rehabilitation by using a virtual object model comprises the steps of: generating a virtual object model in a virtual space matched to correspond to a real space where a subject is located; generating a plurality of first preliminary stimuli for identifying egocentric neglect in the visual range of the subject on the basis of the virtual object model; obtaining and collecting first reaction information about whether the subject has recognized the first preliminary stimuli; determining an egocentric cognition range in which the subject can egocentrically recognize visual stimuli on the basis of the first reaction information; sequentially generating a plurality of second preliminary stimuli for identifying allocentric neglect in the egocentric cognition range on the basis of the virtual object model; obtaining and collecting second reaction information about whether the subject has recognized the secon

Abstract: A battery pack is configured to improve safety by effectively suppressing heat transfer between battery modules in the present disclosure. A battery pack includes a plurality of battery modules each having one or more battery cells, configured to store and release energy, and stacked in at least one direction; a pack case provided on at least one side of the plurality of battery modules, covering at least a portion of the outside of the plurality of battery modules, and having one or more openings formed therein; and a melting member provided in the opening of the pack case to seal the opening and configured to open the opening by being melted by heat generated from one or more battery modules among the plurality of battery modules.

Abstract: A battery rack includes a plurality of battery modules, each including at least one battery cell, wherein each battery module has at least one venting hole; a rack case accommodating the plurality of battery modules; and a plurality of support brackets disposed in the rack case such that each support bracket supports each battery module and is in communication with the at least one venting hole.

Abstract: A battery module ac includes a cell stack in which a plurality of battery cells are vertically stacked; a module housing including a base plate supporting the cell stack, and a pair of side plates covering both side portions of the cell stack and each including a spark direction changing portion formed by bending an end portion of the side plate in a longitudinal direction of the side plate toward the cell stack; and a bus bar frame assembly covering an opening portion formed on a side of the module housing in a longitudinal direction of the module housing, the bus bar frame assembly including a bus bar frame coupled to a side of the cells tack in a longitudinal direction of the cell stack and a bus bar located on the bus bar frame and coupled to an electrode lead of the battery cell.

Abstract: A battery pack includes a sub-pack including a plurality of battery modules that are located adjacent to one another; a duct coupled to a side of the sub-pack in a width direction of the sub-pack; and a duct cover covering a duct opening portion formed on a side of the duct in a longitudinal direction of the duct, the duct cover including a filter having a mesh structure.

Abstract: A battery module includes a cell stack in which a plurality of battery cells are vertically stacked; a module housing including a base plate supporting the cell stack and a pair of side plates covering both side portions of the cell stack; a bus bar frame assembly covering an opening portion formed on a side of the module housing in a longitudinal direction of the module housing; and a plurality of spark delay portions protruding from an inner surface of each of the pair of side plates and spaced apart from one another in a height direction of the side plate.

Abstract: A power control device configured for diagnosing an open-circuit fault occurring in a power system of an autonomous vehicle and an open-circuit diagnosis method thereof, may include a power control switch that selectively connects or separates main power output from the first power supply and auxiliary power output from the second power supply, and a processor that determines a possibility of an open-circuit fault of a vehicle power source based on a current flowing through the power control switch and determines whether it is possible to drive an electric load with an output power of the second power supply alone and determine an open-circuit position based on an output of the first power supply when there is the possibility of the open-circuit fault.

Abstract: A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.

Abstract: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.

Abstract: A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.

Abstract: Disclosed is a process for non-stop production of encapsulated probiotics, in which an alginate hydrogel is spontaneously formed through a simple process of culturing probiotics in a medium containing an alginate, a salt that forms a hydrogel by binding to alginic acid, preferably an insoluble carbonate, and optionally an encapsulation enhancer, and probiotics are encapsulated by the alginate hydrogel, thereby not only greatly improving the probiotic encapsulation process but also remarkably improving the freeze-drying viability, heat tolerance, shelf stability, and in-vivo stability (acid resistance and bile resistance) of probiotics.

Abstract: A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.

Abstract: A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.

Abstract: A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.

Abstract: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.

Abstract: A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.

Abstract: A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.

Abstract: An apparatus for processing a substrate includes a process chamber; a support which is placed inside the process chamber and supports the substrate; a fluid supplier which supplies fluid into the process chamber; and a controller configured to perform a compressing step to bring the fluid into a supercritical phase inside the process chamber, in which the compressing step includes a continuous first section and second section, the fluid supplier includes a first portion and a second portion, and the controller supplies the fluid into the process chamber at a first speed during the first section using the first portion, and supplies the fluid into the process chamber at a second speed higher than the first speed during the second section using the second portion.