Patents by Inventor Young Hoon Kwark
Young Hoon Kwark has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10967372Abstract: An apparatus for an electro-fluidic flow probe includes a body portion including an electro-fluidic bias tee for receiving (i) a fluid electrolyte and (ii) an electrical connection for providing an electrical potential to the fluid electrolyte; a first inlet including a tube extending from the first inlet to an outlet through the electro-fluidic bias tee; and a second inlet including the electrical connection having a wire that extends from the second inlet to the outlet through the electro-fluidic bias tee to transfer the electrical potential to a device under test.Type: GrantFiled: December 17, 2014Date of Patent: April 6, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Yann Andre Nicolas Astier, Jingwei Bai, Young Hoon Kwark, Stanislav Polonsky, Joshua T. Smith
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Patent number: 10967373Abstract: An apparatus for an electro-fluidic flow probe includes a body portion including an electro-fluidic bias tee for receiving (i) a fluid electrolyte and (ii) an electrical connection for providing an electrical potential to the fluid electrolyte; a first inlet including a tube extending from the first inlet to an outlet through the electro-fluidic bias tee; and a second inlet including the electrical connection having a wire that extends from the second inlet to the outlet through the electro-fluidic bias tee to transfer the electrical potential to a device under test.Type: GrantFiled: June 19, 2015Date of Patent: April 6, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Yann Andre Nicolas Astier, Jingwei Bai, Young Hoon Kwark, Stanislav Polonsky, Joshua T. Smith
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Patent number: 10818572Abstract: An electrical circuit device includes a circuit board including a cavity extending from a top surface of the circuit board to an embedded conductor, an integrated circuit chip in the cavity, an electrical connection between the integrated circuit chip and the embedded conductor, a thermal slug disposed over a top surface of the integrated circuit chip, and a heat sink mounted to an outer surface of the thermal slug for transferring a thermal energy away from the circuit board, the heat sink extending above a top surface of the circuit board.Type: GrantFiled: May 8, 2017Date of Patent: October 27, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: Young Hoon Kwark
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Publication number: 20200168524Abstract: A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, electrically connecting the integrated circuit chip to the embedded conductor, and disposing a heat sink over a surface of the integrated circuit chip. The electrically connecting the integrated circuit chip to the embedded conductor includes flip chip mounting of the integrated circuit chip within the cavity.Type: ApplicationFiled: January 28, 2020Publication date: May 28, 2020Inventor: Young Hoon Kwark
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Publication number: 20200168525Abstract: A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit hoard to an embedded conductor, electrically connecting the integrated circuit chip to the embedded conductor, and disposing a heat sink over a surface of the integrated circuit chip.Type: ApplicationFiled: January 28, 2020Publication date: May 28, 2020Inventor: Young Hoon Kwark
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Patent number: 10600715Abstract: A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, and electrically connecting the integrated circuit chip to the embedded conductor.Type: GrantFiled: May 8, 2017Date of Patent: March 24, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: Young Hoon Kwark
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Publication number: 20170243802Abstract: An electrical circuit device includes a circuit board including a cavity extending from a top surface of the circuit board to an embedded conductor, an integrated circuit chip in the cavity, an electrical connection between the integrated circuit chip and the embedded conductor, a thermal slug disposed over a top surface of the integrated circuit chip, and a heat sink mounted to an outer surface of the thermal slug for transferring a thermal energy away from the circuit board, the heat sink extending above a top surface of the circuit board.Type: ApplicationFiled: May 8, 2017Publication date: August 24, 2017Inventor: Young Hoon Kwark
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Publication number: 20170243816Abstract: A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, and electrically connecting the integrated circuit chip to the embedded conductor.Type: ApplicationFiled: May 8, 2017Publication date: August 24, 2017Inventor: Young Hoon Kwark
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Patent number: 9713258Abstract: An electrical circuit device that includes a circuit board with an integrated circuit chip in a cavity that extends from a surface of the circuit board to an embedded conductor, and an electrical connection between the integrated circuit chip and the embedded conductor.Type: GrantFiled: April 27, 2006Date of Patent: July 18, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: Young Hoon Kwark
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Publication number: 20150300973Abstract: An apparatus for an electro-fluidic flow probe includes a body portion including an electro-fluidic bias tee for receiving (i) a fluid electrolyte and (ii) an electrical connection for providing an electrical potential to the fluid electrolyte; a first inlet including a tube extending from the first inlet to an outlet through the electro-fluidic bias tee; and a second inlet including the electrical connection having a wire that extends from the second inlet to the outlet through the electro-fluidic bias tee to transfer the electrical potential to a device under test.Type: ApplicationFiled: June 19, 2015Publication date: October 22, 2015Inventors: Yann Andre Nicolas Astier, Jingwei Bai, Young Hoon Kwark, Stanislav Polonsky, Joshua T. Smith
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Publication number: 20150300984Abstract: An apparatus for an electro-fluidic flow probe includes a body portion including an electro-fluidic bias tee for receiving (i) a fluid electrolyte and (ii) an electrical connection for providing an electrical potential to the fluid electrolyte; a first inlet including a tube extending from the first inlet to an outlet through the electro-fluidic bias tee; and a second inlet including the electrical connection having a wire that extends from the second inlet to the outlet through the electro-fluidic bias tee to transfer the electrical potential to a device under test.Type: ApplicationFiled: December 17, 2014Publication date: October 22, 2015Inventors: Yann Andre Nicolas Astier, Jingwei Bai, Young Hoon Kwark, Stanislav Polonsky, Joshua T. Smith
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Patent number: 9076615Abstract: A method is provided to form an electromechanical relay. A magnetic layer is etched to form a substrate-metal structure having a pattern of conductive contacts. The substrate-metal structure is electroplated. The electroplated structure is attached to a printed circuit board (PCB). A portion of the electroplated structure is removed to electrically decouple the conductive contacts. The PCB includes a common contact terminal aligned to one end of each conductive contact. The PCB includes magnetic actuators each having a magnetic core with a first core part disposed within a via extending through layers of the PCB, and an electrical coil disposed around the first core part within layers of the PCB. Each conductive contact is aligned to an associated magnetic actuator to enable electrical contact between the common contact terminal and the conductive contact upon activation of the associated magnetic actuator.Type: GrantFiled: May 21, 2013Date of Patent: July 7, 2015Assignee: International Business Machines CorporationInventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
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Publication number: 20130247362Abstract: Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.Type: ApplicationFiled: May 21, 2013Publication date: September 26, 2013Applicant: International Business Machines CorporationInventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
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Patent number: 8436701Abstract: Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.Type: GrantFiled: February 8, 2010Date of Patent: May 7, 2013Assignee: International Business Machines CorporationInventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
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Publication number: 20120282749Abstract: A method of forming a semiconductor device for processing a signal includes providing a circuit board including an input signal line, providing a high performance resonant element connected to the input signal line, and providing an output signal line connected to the high performance resonant element. The high performance resonant element includes a via.Type: ApplicationFiled: November 2, 2011Publication date: November 8, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian P. Gaucher, Young Hoon Kwark, Christian Schuster
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Publication number: 20120188033Abstract: Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.Type: ApplicationFiled: March 21, 2012Publication date: July 26, 2012Applicant: International Business Machines CorporationInventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
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Patent number: 8089006Abstract: A circuit includes an input signal line, a high performance resonant element connected to the input signal line, and an output signal line connected to the high performance resonant element. The high performance resonant element is a via.Type: GrantFiled: June 12, 2006Date of Patent: January 3, 2012Assignee: International Business Machines CorporationInventors: Brian P. Gaucher, Young Hoon Kwark, Christian Schuster
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Publication number: 20110193661Abstract: Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.Type: ApplicationFiled: February 8, 2010Publication date: August 11, 2011Applicant: International Business Machines CorporationInventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
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Patent number: 7977618Abstract: Testing is performed on an amplifier wafer housing a transimpedance amplifier prior to packaging the transimpedance amplifier with an external photodetector, wherein the transimpedance amplifier includes a small, auxiliary, integrated silicon photodetector provided at the input of the transimpedance, in parallel with external photodetector attachment points. To test the transimpedance amplifier, the transimpedance amplifier is stimulated by optically exciting the small auxiliary photodetector, wherein the small auxiliary photodetector is excited using short wavelength light, whereby advantages such as higher efficiency may be obtained. The testing method includes placing the amplifier wafer in a testing system, probing the power and ground connections on the amplifier wafer, illuminating the small auxiliary photodetector on the amplifier wafer, and detecting the output of the transimpedance amplifier housed on the amplifier wafer.Type: GrantFiled: August 21, 2009Date of Patent: July 12, 2011Assignee: International Business Machines CorporationInventors: John Andrew Guckenberger, Young Hoon Kwark, Jeremy Daniel Schaub
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Patent number: 7854368Abstract: A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.Type: GrantFiled: October 24, 2007Date of Patent: December 21, 2010Assignee: International Business Machines CorporationInventors: Young Hoon Kwark, Christian Schuster