Patents by Inventor Young Hoon Kwark

Young Hoon Kwark has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10967372
    Abstract: An apparatus for an electro-fluidic flow probe includes a body portion including an electro-fluidic bias tee for receiving (i) a fluid electrolyte and (ii) an electrical connection for providing an electrical potential to the fluid electrolyte; a first inlet including a tube extending from the first inlet to an outlet through the electro-fluidic bias tee; and a second inlet including the electrical connection having a wire that extends from the second inlet to the outlet through the electro-fluidic bias tee to transfer the electrical potential to a device under test.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: April 6, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Yann Andre Nicolas Astier, Jingwei Bai, Young Hoon Kwark, Stanislav Polonsky, Joshua T. Smith
  • Patent number: 10967373
    Abstract: An apparatus for an electro-fluidic flow probe includes a body portion including an electro-fluidic bias tee for receiving (i) a fluid electrolyte and (ii) an electrical connection for providing an electrical potential to the fluid electrolyte; a first inlet including a tube extending from the first inlet to an outlet through the electro-fluidic bias tee; and a second inlet including the electrical connection having a wire that extends from the second inlet to the outlet through the electro-fluidic bias tee to transfer the electrical potential to a device under test.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: April 6, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Yann Andre Nicolas Astier, Jingwei Bai, Young Hoon Kwark, Stanislav Polonsky, Joshua T. Smith
  • Patent number: 10818572
    Abstract: An electrical circuit device includes a circuit board including a cavity extending from a top surface of the circuit board to an embedded conductor, an integrated circuit chip in the cavity, an electrical connection between the integrated circuit chip and the embedded conductor, a thermal slug disposed over a top surface of the integrated circuit chip, and a heat sink mounted to an outer surface of the thermal slug for transferring a thermal energy away from the circuit board, the heat sink extending above a top surface of the circuit board.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: October 27, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Young Hoon Kwark
  • Publication number: 20200168524
    Abstract: A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, electrically connecting the integrated circuit chip to the embedded conductor, and disposing a heat sink over a surface of the integrated circuit chip. The electrically connecting the integrated circuit chip to the embedded conductor includes flip chip mounting of the integrated circuit chip within the cavity.
    Type: Application
    Filed: January 28, 2020
    Publication date: May 28, 2020
    Inventor: Young Hoon Kwark
  • Publication number: 20200168525
    Abstract: A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit hoard to an embedded conductor, electrically connecting the integrated circuit chip to the embedded conductor, and disposing a heat sink over a surface of the integrated circuit chip.
    Type: Application
    Filed: January 28, 2020
    Publication date: May 28, 2020
    Inventor: Young Hoon Kwark
  • Patent number: 10600715
    Abstract: A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, and electrically connecting the integrated circuit chip to the embedded conductor.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: March 24, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Young Hoon Kwark
  • Publication number: 20170243802
    Abstract: An electrical circuit device includes a circuit board including a cavity extending from a top surface of the circuit board to an embedded conductor, an integrated circuit chip in the cavity, an electrical connection between the integrated circuit chip and the embedded conductor, a thermal slug disposed over a top surface of the integrated circuit chip, and a heat sink mounted to an outer surface of the thermal slug for transferring a thermal energy away from the circuit board, the heat sink extending above a top surface of the circuit board.
    Type: Application
    Filed: May 8, 2017
    Publication date: August 24, 2017
    Inventor: Young Hoon Kwark
  • Publication number: 20170243816
    Abstract: A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, and electrically connecting the integrated circuit chip to the embedded conductor.
    Type: Application
    Filed: May 8, 2017
    Publication date: August 24, 2017
    Inventor: Young Hoon Kwark
  • Patent number: 9713258
    Abstract: An electrical circuit device that includes a circuit board with an integrated circuit chip in a cavity that extends from a surface of the circuit board to an embedded conductor, and an electrical connection between the integrated circuit chip and the embedded conductor.
    Type: Grant
    Filed: April 27, 2006
    Date of Patent: July 18, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Young Hoon Kwark
  • Publication number: 20150300973
    Abstract: An apparatus for an electro-fluidic flow probe includes a body portion including an electro-fluidic bias tee for receiving (i) a fluid electrolyte and (ii) an electrical connection for providing an electrical potential to the fluid electrolyte; a first inlet including a tube extending from the first inlet to an outlet through the electro-fluidic bias tee; and a second inlet including the electrical connection having a wire that extends from the second inlet to the outlet through the electro-fluidic bias tee to transfer the electrical potential to a device under test.
    Type: Application
    Filed: June 19, 2015
    Publication date: October 22, 2015
    Inventors: Yann Andre Nicolas Astier, Jingwei Bai, Young Hoon Kwark, Stanislav Polonsky, Joshua T. Smith
  • Publication number: 20150300984
    Abstract: An apparatus for an electro-fluidic flow probe includes a body portion including an electro-fluidic bias tee for receiving (i) a fluid electrolyte and (ii) an electrical connection for providing an electrical potential to the fluid electrolyte; a first inlet including a tube extending from the first inlet to an outlet through the electro-fluidic bias tee; and a second inlet including the electrical connection having a wire that extends from the second inlet to the outlet through the electro-fluidic bias tee to transfer the electrical potential to a device under test.
    Type: Application
    Filed: December 17, 2014
    Publication date: October 22, 2015
    Inventors: Yann Andre Nicolas Astier, Jingwei Bai, Young Hoon Kwark, Stanislav Polonsky, Joshua T. Smith
  • Patent number: 9076615
    Abstract: A method is provided to form an electromechanical relay. A magnetic layer is etched to form a substrate-metal structure having a pattern of conductive contacts. The substrate-metal structure is electroplated. The electroplated structure is attached to a printed circuit board (PCB). A portion of the electroplated structure is removed to electrically decouple the conductive contacts. The PCB includes a common contact terminal aligned to one end of each conductive contact. The PCB includes magnetic actuators each having a magnetic core with a first core part disposed within a via extending through layers of the PCB, and an electrical coil disposed around the first core part within layers of the PCB. Each conductive contact is aligned to an associated magnetic actuator to enable electrical contact between the common contact terminal and the conductive contact upon activation of the associated magnetic actuator.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: July 7, 2015
    Assignee: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
  • Publication number: 20130247362
    Abstract: Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.
    Type: Application
    Filed: May 21, 2013
    Publication date: September 26, 2013
    Applicant: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
  • Patent number: 8436701
    Abstract: Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: May 7, 2013
    Assignee: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
  • Publication number: 20120282749
    Abstract: A method of forming a semiconductor device for processing a signal includes providing a circuit board including an input signal line, providing a high performance resonant element connected to the input signal line, and providing an output signal line connected to the high performance resonant element. The high performance resonant element includes a via.
    Type: Application
    Filed: November 2, 2011
    Publication date: November 8, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Brian P. Gaucher, Young Hoon Kwark, Christian Schuster
  • Publication number: 20120188033
    Abstract: Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.
    Type: Application
    Filed: March 21, 2012
    Publication date: July 26, 2012
    Applicant: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
  • Patent number: 8089006
    Abstract: A circuit includes an input signal line, a high performance resonant element connected to the input signal line, and an output signal line connected to the high performance resonant element. The high performance resonant element is a via.
    Type: Grant
    Filed: June 12, 2006
    Date of Patent: January 3, 2012
    Assignee: International Business Machines Corporation
    Inventors: Brian P. Gaucher, Young Hoon Kwark, Christian Schuster
  • Publication number: 20110193661
    Abstract: Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.
    Type: Application
    Filed: February 8, 2010
    Publication date: August 11, 2011
    Applicant: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Richard A. John, Young Hoon Kwark
  • Patent number: 7977618
    Abstract: Testing is performed on an amplifier wafer housing a transimpedance amplifier prior to packaging the transimpedance amplifier with an external photodetector, wherein the transimpedance amplifier includes a small, auxiliary, integrated silicon photodetector provided at the input of the transimpedance, in parallel with external photodetector attachment points. To test the transimpedance amplifier, the transimpedance amplifier is stimulated by optically exciting the small auxiliary photodetector, wherein the small auxiliary photodetector is excited using short wavelength light, whereby advantages such as higher efficiency may be obtained. The testing method includes placing the amplifier wafer in a testing system, probing the power and ground connections on the amplifier wafer, illuminating the small auxiliary photodetector on the amplifier wafer, and detecting the output of the transimpedance amplifier housed on the amplifier wafer.
    Type: Grant
    Filed: August 21, 2009
    Date of Patent: July 12, 2011
    Assignee: International Business Machines Corporation
    Inventors: John Andrew Guckenberger, Young Hoon Kwark, Jeremy Daniel Schaub
  • Patent number: 7854368
    Abstract: A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: December 21, 2010
    Assignee: International Business Machines Corporation
    Inventors: Young Hoon Kwark, Christian Schuster