Abstract: A coplanar waveguide (CPW) probe includes at least one center probe element, each having a respective center probe contact point and at least one peripheral probe element, each having a respective peripheral contact point. The pitch between the at least one center contact point and the at least one peripheral contact point is adjustable.

Abstract: Testing is performed on an amplifier wafer housing a transimpedance amplifier prior to packaging the transimpedance amplifier with an external photodetector, wherein the transimpedance amplifier includes a small, auxiliary, integrated silicon photodetector provided at the input of the transimpedance, in parallel with external photodetector attachment points. Totest the transimpedance amplifier, the transimpedance amplifier is stimulated by optically exciting the small auxiliary photodetector, wherein the small auxiliary photodetector is excited using short wavelength light, whereby advantages such as higher efficiency may be obtained. The testing method includes placing the amplifier wafer in a testing system, probing the power and ground connections on the amplifier wafer, illuminating the small auxiliary photodetector on the amplifier wafer, and detecting the output of the transimpedance amplifier housed on the amplifier wafer.

Abstract: Testing is performed on an amplifier wafer housing a transimpedance amplifier prior to packaging the transimpedance amplifier with an external photodetector, wherein the transimpedance amplifier includes a small, auxiliary, integrated silicon photodetector provided at the input of the transimpedance, in parallel with external photodetector attachment points. To test the transimpedance amplifier, the transimpedance amplifier is stimulated by optically exciting the small auxiliary photodetector, wherein the small auxiliary photodetector is excited using short wavelength light, whereby advantages such as higher efficiency may be obtained. The testing method includes placing the amplifier wafer in a testing system, probing the power and ground connections on the amplifier wafer, illuminating the small auxiliary photodetector on the amplifier wafer, and detecting the output of the transimpedance amplifier housed on the amplifier wafer.

Abstract: A mapping system and method. The mapping system comprises an electromagnetic field generator, a layer of electromagnetic field absorbing material over an object, and an infrared camera. The electromagnetic field generator is adapted to generate an electromagnetic field and expose the electromagnetic field absorbing material and object to the electromagnetic field. The layer of electromagnetic field absorbing material is adapted to absorb the electromagnetic field and generate areas of thermal differences within the electromagnetic field absorbing material. The infrared camera is adapted to detect the areas of thermal differences.

Abstract: A coplanar waveguide (CPW) probe includes at least one center probe element, each having a respective center probe contact point and at least one peripheral probe element, each having a respective peripheral contact point. The pitch between the at least one center contact point and the at least one peripheral contact point is adjustable.

Abstract: A coplanar waveguide (CPW) probe includes at least one center probe element, each having a respective center probe contact point and at least one peripheral probe element, each having a respective peripheral contact point. The pitch between the at least one center contact point and the at least one peripheral contact point is adjustable.

Abstract: A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers interspersed between the non-conductive layers, vias extending through the non-conductive layers and the conductive layers, radio frequency absorbing material within each of the vias, where the radio frequency absorbing material is at a conductive layer within the printed circuit board at which a conductive trace is not connected to a via, an insulating layer over each radio frequency absorbing material, and a cylindrical conductive material within via and over each insulating layer.

Abstract: A circuit includes an input signal line, a high performance resonant element connected to the input signal line, and an output signal line connected to the high performance resonant element. The high performance resonant element is a via.

Abstract: A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.

Abstract: A system and method for measuring circuits on an integrated circuit substrate includes a measurement circuit formed on the integrated circuit substrate that measures at least one characteristic of an integrated circuit. The measurement circuit has a power transfer device including a power transfer component, which receives energy from a source where the source does not make physical contact with the integrated circuit substrate to transfer power to the measurement circuit. Measurements are taken to provide feedback for in-situ adjustments to circuit parameters and responses.

Abstract: A coplanar waveguide (CPW) probe includes at least one center probe element, each having a respective center probe contact point and at least one peripheral probe element, each having a respective peripheral contact point. The pitch between the at least one center contact point and the at least one peripheral contact point is adjustable.

Abstract: An interposer includes an array of buttons on a carrier having a proximity to each other that allows contact between two adjacent buttons to occur when at least one of the two adjacent buttons is axially compressed above a predetermined threshold. The chip package includes a chip having a first surface and a second surface, a printed circuit board having a first surface and a second surface, and an interposer having an array of buttons between the chip and the printed circuit board. The first surfaces are closer to each other than the second surfaces.

Abstract: The invention relates to an apparatus and method to determine contact dynamics between conductive surfaces, and more particularly to determine the dynamics of contact closure in mechanical switches and analysis of the dynamics of other mechanical systems, in general. A log amp is in electrical communication with the RF synthesizer via a transmission line. The log amp outputs a voltage converted from an envelope of an RF waveform to determine a capacitance between at least two conductive surfaces.

Abstract: In an illustrative embodiment, the AC power line network simulator includes an enclosure for containing elements of the system. An AC coupling network coupled to the network simulator implements the functions relating to a particular simulation. A distribution panel connected to a power feed distributes power and includes outgoing circuits and circuit breakers for protecting the outgoing circuits. A plurality of outlets are connected to the breakers of the panel. Through the use of the simulator, with the AC coupling network, simulation of an AC power line network, such as measuring electrical signals, recording electrical signals, simulating electrical signals and inserting electrical signals, can be easily performed. The measured, recorded, simulated and inserted signals correspond to electrical characteristics of elements found in an AC power line network, and can be stored for later analysis. In addition, once simulation information has been stored, it can be reproduced as desired.

Abstract: A cordless modem comprises a radio pair interfaced to a standard data/fax modem which allows a user of a personal computer to wirelessly connect to a telephone line. One end of the radio pair is a remote unit interfaced to the modem contained within the PC while the other end is a base unit connected to a standard telephone wall jack. The base unit can selectively discriminate and adjust for signals received from a telephone voice handset or data signals received from the cordless modem remote unit. Upon receiving an off-hook signal or an incoming call signal, the base unit identifies the type of data (i.e., voice or computer modem data) and adapts accordingly by placing an FM modulator in either of a narrow band deviation or a wide band deviation covering the required range of the particular signal combined with local echo. That is, when voice data is present, a low deviation, narrow filter combination is selected.

Abstract: A method of channel selection between a remote and a base for a cordless or wireless communication system includes the steps of creating a history table having channels assigned to columns and intervals assigned to rows, scanning the channels to determine if interference exists, recording the channels having interference for a given interval in the history table and determining which channel has the least amount of interference over a predetermined number of intervals to select the best channel for communications.

Abstract: A cordless modem comprises a radio pair interfaced to a standard data/fax modem which allows a user of a personal computer to wirelessly connect to a telephone line. One end of the radio pair is a remote unit interfaced to the modem contained within the PC while the other end is a base unit connected to a standard telephone wall jack. This arrangement allows the user the convenience and freedom of using a PC, laptop, personal digital assistant, etc., within several hundred feet of a phone jack without being encumbered by a cord. A warning alarm on the remote unit informs the user when the signal strength between the radio pair is below a threshold value. Additionally, the base unit may be equipped with two spatially separated antennas to help mitigate the effects of signal fading.