Abstract: Provided is a flexible multilayer thin film capacitor using a flexible metal substrate, including: a metal substrate; a metal oxide layer formed on the whole surface of the metal substrate; a plurality of first internal electrode layers selectively applied on a first surface of the metal substrate using a metal material; a plurality of dielectric layers formed to be sequentially multi-layered on the whole surface of the first internal electrode layers using a dielectric material; a plurality of second internal electrode layers selectively applied on the dielectric layers using a metal material; a protecting layer applied on a surface of one of the plurality of second internal electrode layers; and a single pair of external electrodes connected to contact with the plurality of first internal electrode layers and the plurality of second internal electrode layers, respectively, and soldered on conductive inter-layer pads of a printed circuit board.

Abstract: Provided is a package type multilayer thin film capacitor for a high capacitance, including: a capacitance block 110; a pair of clamp members 120 and 130 being installed on one side and another side of the capacitance block 110, respectively; a pair of lead members 140 and 150 being installed on the clam members 120 and 130, respectively; and a molding member 160 filling in the capacitance block 110 to partially expose each of the pair of lead members 140 and 150. The capacitance block may be configured by adhering at least two of a ceramic sintered member 111, a metal capacitance member 112, and a thin film capacitance member 113 using an insulating adhesive member and thereby disposing the at least two members in a multilayered form. Accordingly, capacitance may increase and mechanical strength may be enhanced.

Abstract: A titanium oxide composite, a titanium oxide composite manufacturing method, and a super capacitor using the same are provided. The titanium oxide composite is prepared to surround graphene on a surface of granule type titanium oxide. One of a granule type LixTiyOz and a granule type HxTiyOz is selected and thereby used for the granule type titanium oxide, the granule type LixTiyOz satisfies 1?x?4, 1?y?5, and 1?z?12, and the granule type HxTiyOz satisfies 1?x?2, 1?y?12, and 1?z?25.

Abstract: Provided is a package type multi-layer thin film capacitor for large capacitance, including: a ceramic sintered body formed with slots on one side and another side thereof, respectively; a plurality of first internal electrode layers formed within the ceramic sintered body; a plurality of second internal electrode layers formed within the ceramic sintered body to be positioned between the plurality of first internal electrode layers; a pair of first main connection electrode members inserted into the slots to be connected to the first internal electrode layers or the second internal electrode layers, respectively; a pair of first main lead members inserted into the slots and to be connected to the first main connection electrode members, respectively; and a sealing member sealing the ceramic sintered body to partially expose each of the pair of first main lead members.

Abstract: A direct current (DC) link capacitor module includes a printed circuit board (PCB) formed by sequentially disposing a first electrode substrate, an insulation substrate, a second electrode substrate, a third electrode substrate; a plurality of DC link capacitors connected in parallel to each of the first electrode substrate and the second electrode substrate; a plurality of first Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the DC link capacitors; and a plurality of second Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the first Y-capacitors, thereby achieving a miniaturization and facilitating a fabrication by connecting the plurality of DC link capacitors using the PCB.

Abstract: Disclosed are a glass composition and a dielectric composition enabling low temperature sintering, and a high capacitance multilayer ceramic capacitor using the same. In the glass composition used for sintering, the glass composition may be formed of a formula, aR2O-bCaO-cZnO-dBaO-eB2O3-fAl2O3-gSiO2, and the formula may satisfy a+b+c+d+e+f+g=100, 0?a?7, 1?b?3, 1?c?15, 10?d?20, 3?e?10, 0?f?3, and 55?g?72. Through this, when manufacturing the high capacity multilayer ceramic capacitor, the dielectric substance may enable the lower temperature sintering, thereby enhancing a capacitance and a reliability of the high capacitance multilayer ceramic capacitor.

Abstract: A method of manufacturing a metal paste for an internal electrode according to the present invention includes preparing each of a metal powder and an organic vehicle; preparing a ceramic inhibitor powder in which a nano glass added with a rare-earth element is mixed; manufacturing a primary mixture by mixing the metal powder of 70 to 95 wt % and the ceramic inhibitor powder of 5 to 30 wt % when each of the metal powder, the organic vehicle, and the ceramic inhibitor powder in which the nano glass added with the rare-earth element is mixed is prepared; manufacturing a secondary mixture by mixing the primary mixture of 50 to 70 wt % and the organic vehicle of 30 to 50 wt % when the primary mixture is manufactured; and manufacturing the metal paste for the internal electrode by filtering the secondary mixture when the secondary mixture is manufactured.

Abstract: The present invention relates to a dielectric ceramic composition for multilayer ceramic capacitor (MLCC), including a first component of 91 to 98 wt % and a second component of 2 to 9 wt %, wherein the first component includes a main component BaTiO3 of 94 to 98 wt %, a first subcomponent of 0.5 to 2 wt % including a glass powder having a mesh structure, and a second subcomponent of 1 to 4 wt % including at least one of MgO, Cr2O3 and Mn3O4, and the second component includes (Ba1-y-xCaySrx)(ZryTi1-y)O3, and x satisfies 0.2?x?0.8 and y satisfies 0.03?y?0.15.

Abstract: Disclosed are a glass composition and a dielectric composition enabling low temperature sintering, and a high capacitance multilayer ceramic capacitor using the same. In the glass composition used for sintering, the glass composition may be formed of a formula, aR2O-bCaO-cZnO-dBaO-eB2O3-fAl2O3-gSiO2, and the formula may satisfy a+b+c+d+e+f+g=100, 0?a?7, 1?b?3, 1?c?15, 10?d?20, 3?e?10, 0?f?3, and 55?g?72. Through this, when manufacturing the high capacity multilayer ceramic capacitor, the dielectric substance may enable the lower temperature sintering, thereby enhancing a capacitance and a reliability of the high capacitance multilayer ceramic capacitor.

Abstract: Provided is a preparation method of a metal oxide doped monolith carbon aerogel for a high capacitance capacitor, the including: preparing a monolith carbon aerogel by performing a thermal decomposition of a moist gel dried in condition of a atmospheric pressure and a room temperature in a nitrogen atmosphere; impregnating the monolith carbon aerogel into alcohol where a metal precursor is dissolved; and calcinating the monolith carbon aerogel where the metal precursor is impregnated in an atmospheric atmosphere. By impregnating the metal oxide into the monolith carbon aerogel, a limit of capacitance may be enhanced using a pseudo capacitance effect by an interfacial oxidation reduction reaction.

Abstract: Provided is a package type multilayer thin film capacitor for a high capacitance, including: a capacitance block 110; a pair of clamp members 120 and 130 being installed on one side and another side of the capacitance block 110, respectively; a pair of lead members 140 and 150 being installed on the clam members 120 and 130, respectively; and a molding member 160 filling in the capacitance block 110 to partially expose each of the pair of lead members 140 and 150. The capacitance block may be configured by adhering at least two of a ceramic sintered member 111, a metal capacitance member 112, and a thin film capacitance member 113 using an insulating adhesive member and thereby disposing the at least two members in a multilayered form. Accordingly, capacitance may increase and mechanical strength may be enhanced.

Abstract: Provided is a package type multi-layer thin film capacitor for large capacitance, including: a ceramic sintered body formed with slots on one side and another side thereof, respectively; a plurality of first internal electrode layers formed within the ceramic sintered body; a plurality of second internal electrode layers formed within the ceramic sintered body to be positioned between the plurality of first internal electrode layers; a pair of first main connection electrode members inserted into the slots to be connected to the first internal electrode layers or the second internal electrode layers, respectively; a pair of first main lead members inserted into the slots and to be connected to the first main connection electrode members, respectively; and a sealing member sealing the ceramic sintered body to partially expose each of the pair of first main lead members.

Abstract: Provided is a high power super capacitor including: a bobbin; an electrode assembly being wound into the bobbin to be in a jellyroll type; a conductive connection member being formed in each of one end and another end of the electrode assembly using electric energy; and a plug being inserted into each of one end and another end of the bobbin, and being bonded with the conductive connection member using electric energy to be electrically connected to the electrode assembly.

Abstract: Provided is a hybrid super capacitor using a composite electrode that may enhance equivalent series resistance (ESR) using a carbon nanotube chain. The hybrid super capacitor includes: an anode 11 including an anode oxide layer 11a and an activated carbon layer applied 11b on the anode oxide layer 11a; and a cathode 21 being disposed to face the anode 11. The cathode 21 may include a silicon oxide layer 21a, a lithium titanium oxide layer 21b disposed on the silicon oxide layer 21a, and a carbon nanotube chain CT formed to pass through the silicon oxide layer 21a and the lithium titanium oxide layer 21b to thereby be electrically connected to each other, thereby enhancing ESR and expanding an output density and a lifespan of the hybrid super capacitor.

Abstract: Provided is a flexible multilayer thin film capacitor using a flexible metal substrate, including: a metal substrate; a metal oxide layer formed on the whole surface of the metal substrate; a plurality of first internal electrode layers selectively applied on a first surface of the metal substrate using a metal material; a plurality of dielectric layers formed to be sequentially multi-layered on the whole surface of the first internal electrode layers using a dielectric material; a plurality of second internal electrode layers selectively applied on the dielectric layers using a metal material; a protecting layer applied on a surface of one of the plurality of second internal electrode layers; and a single pair of external electrodes connected to contact with the plurality of first internal electrode layers and the plurality of second internal electrode layers, respectively, and soldered on conductive inter-layer pads of a printed circuit board.

Abstract: A metal capacitor in which an electric conductivity is significantly improved is provided. The metal capacitor includes: a metal member 11 including a plurality of grooves 11a; a metal oxide film 12 being formed on the metal member 11; a sealing electrode member 13 being formed on the metal oxide film 12 to fill in the plurality of grooves 11a; and an insulating layer 14 being formed on the sealing electrode member 13 and the metal oxide film 12 to insulate the metal member 12 and the sealing electrode member 13.

Abstract: Provided is a surface mounting type high voltage ceramic capacitor with an array structure that may form a plurality of capacitors in an array structure to thereby simultaneously mount the plurality of capacitors on a printed circuit board, and thus may reduce a work procedure and enhance a work productivity. The surface mounting type high voltage ceramic capacitor with an array structure, may include: a ceramic member 11; a common electrode member 12 being formed on one surface of the ceramic member 11; a plurality of individual electrode members 13 being arranged on another surface of the ceramic member 11; a common lead terminal 14 being connected to the common electrode member 12; a plurality of individual lead terminals 15 being connected to the plurality of individual electrode members 13, respectively, to face the common lead terminal 14; and a molding member 16 sealing the ceramic member 11, the common electrode member 12, and the plurality of individual electrode members 13.

Abstract: A metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof is provided.

Abstract: Disclosed are a glass composition and a dielectric composition enabling low temperature sintering, and a high capacitance multilayer ceramic capacitor using the same. In the glass composition used for sintering, the glass composition may be formed of a formula, aR2O-bCaO-cZnO-dBaO-eB2O3-fAl2O3-gSiO2, and the formula may satisfy a+b+c+d+e+f+g=100, 0?a?7, 1?b?3, 1?c?15, 10?d?20, 3?e?10, 0?f?3, and 55?g?72. Through this, when manufacturing the high capacity multilayer ceramic capacitor, the dielectric substance may enable the lower temperature sintering, thereby enhancing a capacitance and a reliability of the high capacitance multilayer ceramic capacitor.

Abstract: A metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof is provided. The metal capacitor includes a terminal increase-type metal member; a metal oxide layer being formed on the terminal increase-type metal member; an insulating layer being formed on the main electrode layers and the terminal increase-type metal member to externally expose the first and the second electrode withdrawing portions of the terminal increase-type metal member; a main electrode layer being formed at the through-hole forming portion to fill in the plurality of through-holes formed on the through-hole forming portion of the terminal increase-type metal member; a first and a second lead terminals; and a sealing member sealing the terminal increase-type metal member connected to the first and the second lead terminals to externally expose the first and the second lead terminals.