Abstract: A method of forming an electric wiring includes forming a trench on a substrate and ejecting first ink and second ink into the trench. The second ink contains a conductive material. The method includes heating the substrate to sinter the second ink such that a tunnel is formed in a lower portion of the trench by evaporation of the first ink, and the conductive material forms the electric wiring in an upper portion of the trench.

Abstract: Disclosed is a method of forming an electric wiring using inkjet printing. The method includes forming a main trench and first and second guide trenches on a substrate. The first and second guide trenches are disposed at opposite sides of the main trench. The method includes ejecting ink into the main trench, the ink including a conductive material. The method also includes heating the substrate to sinter the ink such that the electric wiring is formed an upper portion of the main trench, and contract the ink such that a tunnel is formed in a lower portion of the main trench.

Abstract: A method of forming a conductive pattern includes forming a first partition and a second partition which are spaced apart from each other on a substrate, the first and second partitions defining a trench. The method includes discharging ink into the trench to form ink droplets pinned in a boundary region of the first and second partitions. The method further includes the boundary region including a region between a top side and an outer side of the first and second partitions, the ink including conductive particles. The method includes performing drying and sintering processes to form the conductive pattern in the trench, the conductive pattern including the conductive particles.

Abstract: Provided is an inkjet printing device. The inkjet printing device includes a passage forming substrate having a plurality of pressure chambers and a nozzle substrate. The nozzle substrate includes a plurality of nozzle blocks extending in a first direction, a plurality of nozzles connected to the pressure chambers and penetrating the nozzle blocks, and a plurality of trenches. Each of the trenches is disposed in a second direction perpendicular to the first direction with respect to the nozzle blocks, recessed from a bottom surface of the nozzle blocks, and extends in the first direction.

Abstract: According to one embodiment of the present invention, a portion of a light-emitting polymer material or a conductive polymer material can be irradiated with a focused electron beam, so that the physical properties of that portion can be modified. For this purpose, one embodiment of the present invention comprises an apparatus for modifying the physical properties of a nanostructure using a focused electron beam, the apparatus comprising: a nanostructure; a focused electron beam-irradiating unit that serves to irradiate a nanoscale electron beam such that it is focused on the nanostructure; and a focused electron beam-controlling unit that serves to control the irradiation position of the nanoscale electron beam so as to modify the physical property of a portion of the nanostructure.

Abstract: An inkjet printing device includes: a flow path plate, a piezoelectric actuator and an electrostatic force applicator. The flow path plate includes an ink inlet, a pressure chamber and a nozzle. The piezoelectric actuator is configured to provide a first driving force, and the electrostatic force applicator is configured to provide a second driving force. The disclosed inkjet printing devices and methods combine piezoelectric and electrostatic techniques.

Abstract: Provided is a nozzle plate and methods of manufacturing the nozzle plate. The nozzle plate may include a substrate having a nozzle. The nozzle plate may also include a permittivity reducing area in an upper portion of the substrate around the nozzle, wherein the permittivity reducing area includes a plurality of porosities and a plurality of walls between the plurality of porosities. Additionally, the nozzle plate may include a protection layer on the substrate, wherein the protection layer covers the plurality of porosities and the plurality of walls.

Abstract: A method of driving a hybrid inkjet printing apparatus includes applying an electrostatic voltage to ink contained in a nozzle, applying a waveform voltage to ink contained in the nozzle, the waveform voltage being applied by a piezoelectric driving device, and applying an ejection voltage so as to eject the ink.

Abstract: A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate, except on the first wire; forming a surface treatment film on the material layer; and forming a second wire on the first wire. The surface treatment film has physical properties opposite to the first wire. A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate and the first wire; removing a portion of the material layer from the first wire; forming a surface treatment film on the material layer and the first wire; removing a portion of the surface treatment film from the first wire; and forming a second wire on the first wire. A thickness of the material layer on the substrate is greater than a thickness of the first wire on the substrate.

Abstract: A printing apparatus includes a first nozzle substrate having a first tapered nozzle unit aligned with a pressure chamber and a second nozzle substrate having a second tapered nozzle unit aligned with the first tapered nozzle unit and attached to the bottom of the first nozzle substrate.

Abstract: A method of forming patterns on a substrate, the method including: placing a mask having an opening defining a portion of one surface of a substrate on which patterns are to be formed on the substrate; forming a first modification layer in the opening by ejecting a surface modification ink onto a surface of the substrate through the opening; ejecting a target ink having droplets of sizes larger than those of a surface modification ink such that the target ink is distributed on the first modification layer in the opening; and removing the mask.

Abstract: A printing apparatus includes: a flow channel plate including, a pressure chamber, a nozzle including an outlet through which ink contained in the pressure chamber is ejected, and a trench disposed around the nozzle, and the outlet extending into the trench; a piezoelectric actuator configured to provide a change in pressure to eject the ink contained in the pressure chamber; and an electrostatic actuator configured to provide an electrostatic driving force to the ink contained in the nozzle.

Abstract: A method of manufacturing a thin film transistor includes sequentially forming a gate and at least one insulation layer on a substrate, forming a source electrode and a drain electrode on the at least one insulation layer, and forming a channel layer formed of a semiconductor on a part of the source electrode and the drain electrode, wherein the gate, the source electrode, and the drain electrode are formed by using a hybrid inkjet printing apparatus.

Abstract: Methods of adjusting ink ejection characteristics of an inkjet printing apparatus and driving the inkjet printing apparatus are provided. A method of adjusting ink ejection characteristics of an inkjet printing apparatus may include adjusting at least one of a voltage and an application duration of a driving signal applied to a plurality of piezoelectric actuators that provide ejection pressures to a plurality of nozzles so that volumes of a plurality of ink droplets ejected from the plurality of nozzles are uniform, and displacing an application starting time of the driving signal applied to the plurality of piezoelectric actuators so that the plurality of ink droplets ejected from the plurality of nozzles reach a printing medium at a same time.

Abstract: Thin film transistors (TFT) and methods of manufacturing the same. A TFT includes a line-shaped gate of uniform thickness. A cross-section of the gate is curved where a side surface and a top surface meet. The gate includes one, or two or more gate lines.

Abstract: According to an example embodiment, a thin film transistor (TFT) printing apparatus includes a stage having a TFT substrate loaded thereon, a stage moving device configured to move the stage according to a printing vector set to correspond to a print pattern, and a print head on an upper side of the stage and including a plurality of nozzles in a matrix shape.

Abstract: An inkjet printing apparatus according to example embodiments may include a flow channel plate including an ink inlet for introducing ink, a pressure chamber containing the introduced ink, and a nozzle connected to the pressure chamber and configured to eject ink. A piezoelectric voltage applier may apply a piezoelectric driving voltage to the piezoelectric actuator in such a way that the volume of the pressure chamber is reduced so as to eject an ink droplet. An electrohydrodynamic voltage applier may apply a first electrohydrodynamic driving voltage and a second electrohydrodynamic driving voltage to the electrohydrodynamic actuator. The first electrohydrodynamic driving voltage may generate a jet from the ink droplet such that the jet is ejected towards a printing medium, and the second electrohydrodynamic driving voltage (which has an opposite polarity to that of the first electrohydrodynamic driving voltage) may restore the ink droplet to the nozzle.

Abstract: A method may include providing a surface modification inkjet head and a target inkjet head to be movable on a substrate, and forming a surface modification printed pattern by moving the surface modification inkjet head and ejecting surface modification ink onto the substrate. A target printed pattern may be formed by ejecting a target ink from the target inkjet head to the surface modification printed pattern and a metal wiring pattern may be formed on the substrate by removing the surface modification printed pattern.

Abstract: According to one embodiment of the present invention, a portion of a light-emitting polymer material or a conductive polymer material can be irradiated with a focused electron beam, so that the physical properties of that portion can be modified. For this purpose, one embodiment of the present invention comprises an apparatus for modifying the physical properties of a nanostructure using a focused electron beam, the apparatus comprising: a nanostructure; a focused electron beam-irradiating unit that serves to irradiate a nanoscale electron beam such that it is focused on the nanostructure; and a focused electron beam-controlling unit that serves to control the irradiation position of the nanoscale electron beam so as to modify the physical property of a portion of the nanostructure.

Abstract: A method of manufacturing a thin film transistor includes sequentially forming a gate and at least one insulation layer on a substrate, forming a source electrode and a drain electrode on the at least one insulation layer, and forming a channel layer formed of a semiconductor on a part of the source electrode and the drain electrode, wherein the gate, the source electrode, and the drain electrode are formed by using a hybrid inkjet printing apparatus.