Patents by Inventor Young Ki Hong

Young Ki Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080007598
    Abstract: A piezoelectric inkjet printhead that includes a flow channel plate; an ink flow channel that is formed in the flow channel plate and includes an ink inlet through which ink enters, a plurality of pressure chambers to which ink to be ejected is filled, a manifold which is a path for supplying ink from the ink inlet to the pressure chambers, a plurality of restrictors that connect the manifold to the pressure chambers, and a plurality of nozzles to eject ink from the pressure chambers to the outside; and a plurality of piezoelectric actuators formed on the flow channel plate to provide a driving power to each of the pressure chambers to eject ink to the outside, wherein the manifold includes a plurality of individual manifolds defined by a plurality of first barrier ribs, which respectively correspond to the pressure chambers.
    Type: Application
    Filed: May 31, 2007
    Publication date: January 10, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Young-ki Hong, Jae-woo Chung
  • Publication number: 20070171265
    Abstract: An ink supply apparatus of an inkjet printing system includes an ink tank including a pressure port and an ink supply opening connected to a print head, a flexible ink package connected to the ink supply opening to accommodate ink, and a pressure supply device to supply a purging pressure to the ink package by supplying a pressure fluid to the ink tank.
    Type: Application
    Filed: September 12, 2006
    Publication date: July 26, 2007
    Applicant: SAMSUNG Electronics Co., Ltd.
    Inventors: Young-ki Hong, Tae-gyun Kim
  • Patent number: 7238225
    Abstract: In a plasma air dust collector, the plasma air dust collector includes a first electrode fixing unit and a second electrode fixing unit respectively having a power terminal; at least two dust collecting electrodes; a discharge electrode arranged between the dust collecting electrodes; a terminal protrusion formed at the bottom end of each dust collecting electrode in the length direction; a terminal protrusion insertion hole formed at a side of the first electrode fixing unit; a combining protrusion formed at a side of the first electrode fixing unit and the second electrode fixing unit; and a combining groove formed at the both ends of each dust collecting electrode.
    Type: Grant
    Filed: December 8, 2003
    Date of Patent: July 3, 2007
    Assignee: LG Electronics Inc.
    Inventors: Young-Ki Hong, Sung-Hwa Lee, Jeong-Ho Park
  • Patent number: 7168479
    Abstract: Provided is a highly efficient, slim heat transfer apparatus, including a main body connected to an end of a condensing zone through a liquid coolant reservoir. An extension of the main body is connected to the other end of the condensing zone. The main body has a coolant reservoir that stores liquid coolant supplied from the condensing zone, a vaporization zone in which the liquid coolant supplied from the coolant reservoir is vaporized, and a channel region connecting the coolant reservoir to the vaporization zone. The channel region acts as a channel for supplying the liquid coolant from the coolant reservoir to the vaporization zone.
    Type: Grant
    Filed: December 11, 2003
    Date of Patent: January 30, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-ki Hong, Kyung-il Cho, Byeoung-ju Ha, Jong-beom Kim, Hye-jung Cho
  • Publication number: 20060176347
    Abstract: An inkjet printhead assembly including an inkjet printhead chip having an ink inflow hole, a frame having an ink supply hole, and an ink supply apparatus having a preheater and an ink supply outlet, wherein the frame is disposed between the inkjet printhead chip and the ink supply apparatus, the inkjet printhead chip is attached to the frame, and the ink supply hole is disposed between the ink supply outlet and the ink inflow hole, so as to channel ink between the ink supply apparatus and the inkjet printhead chip.
    Type: Application
    Filed: February 2, 2006
    Publication date: August 10, 2006
    Inventors: Young-ki Hong, Jae-woo Chung, You-seop Lee
  • Publication number: 20060170735
    Abstract: A piezoelectric inkjet printhead having a channel forming plate including an ink channel having a pressure chamber coupled to a nozzle, a piezoelectric actuator including a lower electrode on the channel forming plate, a piezoelectric element on the lower electrode, and an upper electrode on the piezoelectric element, the piezoelectric actuator corresponding to the pressure chamber, an insulation element on the lower electrode and spaced apart from the piezoelectric element, a first electrode on the insulation element, and a temperature sensor on the first electrode, and a method of making the same.
    Type: Application
    Filed: January 30, 2006
    Publication date: August 3, 2006
    Inventors: Young-Ki Hong, Tae-Gyun Kim, Jae-Woo Chung
  • Patent number: 7074725
    Abstract: An improved method of manufacturing a capacitor on a semiconductor substrate is disclosed. A portion of an insulation film on a semiconductor substrate is etched to form a first opening in the insulation film. A passivation film is formed on the insulation film and within the first opening thereof. A portion of the passivation film on a bottom of the first opening is thinner than portions of the passivation film on the insulation film and on a sidewall of the first opening. The passivation film is etched to expose the bottom of the first opening.
    Type: Grant
    Filed: August 14, 2003
    Date of Patent: July 11, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Sik Hong, Young-Ki Hong, Tae-Hyuk Ahn, Jong-Seo Hong
  • Patent number: 7044201
    Abstract: A substantially flat heat transferring device and a method of fabricating the same are provided. The device includes a lower plate, an upper plate, a wick plate, and a liquid-phase coolant, while the lower plate contacts a heat source at its bottom. The upper plate is hermetically coupled with the lower plate along its edge to form a void therebetween. The wick plate is provided between the upper plate and the lower plate and is maintained in position relative to the lower plate by surface tension of the liquid-phase coolant. The liquid-phase coolant transfers heat by circulating between a vaporization part, where the heat source is located, to a condensing part. Here, the wick plate includes a plurality of holes and a plurality of planar wicks and makes the liquid-phase coolant flow from the condensing part to the vaporization part by capillary force between itself and the lower plate.
    Type: Grant
    Filed: August 21, 2003
    Date of Patent: May 16, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung-il Cho, Byeoung-ju Ha, Young-ki Hong, Tae-gyun Kim, Jong-beom Kim
  • Publication number: 20060078434
    Abstract: A simple structured thermal actuation pump for reducing energy loss is provided. The thermal actuation pump includes: a first chamber having at least one working fluid inlet and at least one working fluid outlet; a second chamber having at least one working fluid inlet and at least one working fluid outlet; and a thermoelectric element arranged between the first chamber and the second chamber and including one side being cooled and the other side being heated according to a direction of current for changing inside pressures of the first chamber and the second chamber.
    Type: Application
    Filed: September 12, 2005
    Publication date: April 13, 2006
    Inventors: Tae-gyun Kim, Young-ki Hong
  • Publication number: 20060070526
    Abstract: In a plasma air dust collector, the plasma air dust collector includes a first electrode fixing unit and a second electrode fixing unit respectively having a power terminal; at least two dust collecting electrodes; a discharge electrode arranged between the dust collecting electrodes; a terminal protrusion formed at the bottom end of each dust collecting electrode in the length direction; a terminal protrusion insertion hole formed at a side of the first electrode fixing unit; a combining protrusion formed at a side of the first electrode fixing unit and the second electrode fixing unit; and a combining groove formed at the both ends of each dust collecting electrode.
    Type: Application
    Filed: December 8, 2003
    Publication date: April 6, 2006
    Inventors: Young-Ki Hong, Sung-Hwa Lee, Jeong-Ho Park
  • Patent number: 6880625
    Abstract: A capillary pumped loop system includes an evaporator for vaporizing a refrigerant by absorbing heat from the periphery, a condenser for turning the vaporized refrigerant into a liquid by radiating heat from the vaporized refrigerant, a tube for forming a circulatory path connecting the evaporator to the condenser, and a capillary unit installed to form a plurality of gaps within the tube so that the refrigerant can move along the circulatory path due to capillary action caused by the gaps. Accordingly, when the refrigerant passes through the capillary unit due to the capillary action, bubbles in the tube can be reduced. In addition, a multi-path is formed for the movement of the liquid refrigerant, so discontinuation of the refrigerant can be prevented, thereby preventing the refrigerant in the evaporator from drying out.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: April 19, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Mun-cheol Choi, Byeoung Ju Ha, Young-ki Hong, Jong-beom Kim
  • Publication number: 20050051306
    Abstract: Provided is a highly efficient, slim heat transfer apparatus, including a main body connected to an end of a condensing zone through a liquid coolant reservoir. An extension of the main body is connected to the other end of the condensing zone. The main body has a coolant reservoir that stores liquid coolant supplied from the condensing zone, a vaporization zone in which the liquid coolant supplied from the coolant reservoir is vaporized, and a channel region connecting the coolant reservoir to the vaporization zone. The channel region acts as a channel for supplying the liquid coolant from the coolant reservoir to the vaporization zone.
    Type: Application
    Filed: December 11, 2003
    Publication date: March 10, 2005
    Inventors: Young-Ki Hong, Kyung-Il Cho, Byeoung-Ju Ha, Jong-Beom Kim, Hye-Jung Cho
  • Publication number: 20040048475
    Abstract: An improved method of manufacturing a capacitor on a semiconductor substrate is disclosed. A portion of an insulation film on a semiconductor substrate is etched to form a first opening in the insulation film. A passivation film is formed on the insulation film and within the first opening thereof. A portion of the passivation film on a bottom of the first opening is thinner than portions of the passivation film on the insulation film and on a sidewall of the first opening. The passivation film is etched to expose the bottom of the first opening.
    Type: Application
    Filed: August 14, 2003
    Publication date: March 11, 2004
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jun-Sik Hong, Young-Ki Hong, Tae-Hyuk Ahn, Jong-Seo Hong
  • Publication number: 20040040696
    Abstract: A substantially flat heat transferring device and a method of fabricating the same are provided. The device includes a lower plate, an upper plate, a wick plate, and a liquid-phase coolant, while the lower plate contacts a heat source at its bottom. The upper plate is hermetically coupled with the lower plate along its edge to form a void therebetween. The wick plate is provided between the upper plate and the lower plate and is maintained in position relative to the lower plate by surface tension of the liquid-phase coolant. The liquid-phase coolant transfers heat by circulating between a vaporization part, where the heat source is located, to a condensing part. Here, the wick plate includes a plurality of holes and a plurality of planar wicks and makes the liquid-phase coolant flow from the condensing part to the vaporization part by capillary force between itself and the lower plate.
    Type: Application
    Filed: August 21, 2003
    Publication date: March 4, 2004
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung-il Cho, Byeoung-ju Ha, Young-ki Hong, Tae-gyun Kim, Jong-beom Kim
  • Patent number: 6698503
    Abstract: A heat transferring device having an adiabatic unit is provided. The heat transferring device includes a lower plate including an evaporator which contacts a heating element and allows a liquid refrigerant to absorb heat transferred from the heating element to thus evaporate, a condenser in which gas flowing from the evaporator is condensed, a gas passage through which the gas flowing from the evaporator into condenser, a liquid refrigerant passage through which the liquid refrigerant flows from the condenser into the evaporator and which includes a portion used as a channel region bordering the evaporator, and an adiabatic unit provided between the liquid refrigerant passage and the gas passage so that elements hindering the flow of the liquid refrigerant can be prevented from being introduced from the gas passage into the liquid refrigerant passage; and an upper plate which contacts some members of the lower plate including the adiabatic unit.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: March 2, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-young Son, Mun-cheol Choi, Young-ki Hong, Hye-jung Cho, Byeoung Ju Ha
  • Patent number: 6607702
    Abstract: Photocatalyst filter, method for fabricating the same, and air cleaner thereof, the photocatalyst filter including a base material of a required shape, an enamel layer consisting of frit for forming an inorganic layer and additives for forming a porous surface layer as main composition coated on a surface of the base material, and a photocatalyst layer consisting of a photocatalyst solution consisting of a photocatalyst and a dispersion solvent and bonding agents as main composition coated on the enamel layer, and the method including the steps of (1) coating an enamel layer on a surface of a base material subjected to pretreatment for removal of foreign matters, the enamel layer consisting of frit for forming an inorganic layer on a surface of the base material and additives for forming a porous surface layer on the surface of the base material as main composition, and (2) coating a photocatalyst layer on the enamel layer; the photocatalyst layer consisting of a photocatalyst solution and bonding agents as m
    Type: Grant
    Filed: July 28, 1999
    Date of Patent: August 19, 2003
    Assignee: LG Electronics Inc.
    Inventors: Kwang Ok Kang, Young Ki Hong, Kyong Wook Heo, Sung Hwa Lee, Soo Yeon Shin, Jung Hun Kang, Yong Bok Choi, Ju Han Yoon
  • Patent number: 6576589
    Abstract: There is provided a method for preparing an anatase type titanium dioxide photocatalyst having a particle size of nano level without a need of the sintering process at high temperature, and an anatase type titanium dioxide photocatalyst having a particle size nano level. The method for preparing an anatase type titanium dioxide photocatalyst having a particle size of nano level includes adding a titanium-based starting material to a selected solvent and adding an acid or base catalyst to the resulting aqueous solution. Next, subjecting the catalyst-containing aqueous solution to heat treatment at about 80±20° C. to activate peptization thereby preparing an anatase type titanium dioxide sol solution. Finally, the anatase type titanium dioxide sol solution is coated onto a support to complete the preparation of the photocatalyst.
    Type: Grant
    Filed: September 19, 2000
    Date of Patent: June 10, 2003
    Assignee: LG Electronics Inc.
    Inventors: Hai Sub Na, Woo Suk Choi, Chul Han Kwon, Sung Hwa Lee, Young Ki Hong, Kyeong Wook Heo, Jin Ho Choy, Yang Su Han
  • Publication number: 20030079865
    Abstract: A heat transferring device having an adiabatic unit is provided. The heat transferring device includes a lower plate including an evaporator which contacts a heating element and allows a liquid refrigerant to absorb heat transferred from the heating element to thus evaporate, a condenser in which gas flowing from the evaporator is condensed, a gas passage through which the gas flowing from the evaporator into condenser, a liquid refrigerant passage through which the liquid refrigerant flows from the condenser into the evaporator and which includes a portion used as a channel region bordering the evaporator, and an adiabatic unit provided between the liquid refrigerant passage and the gas passage so that elements hindering the flow of the liquid refrigerant can be prevented from being introduced from the gas passage into the liquid refrigerant passage; and an upper plate which contacts some members of the lower plate including the adiabatic unit.
    Type: Application
    Filed: September 30, 2002
    Publication date: May 1, 2003
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang-Young Son, Mun-Cheol Choi, Young-Ki Hong, Hye-Jung Cho, Byeoung-Ju Ha
  • Publication number: 20020139517
    Abstract: A capillary pumped loop system includes an evaporator for vaporizing a refrigerant by absorbing heat from the periphery, a condenser for turning the vaporized refrigerant into a liquid by radiating heat from the vaporized refrigerant, a tube for forming a circulatory path connecting the evaporator to the condenser, and a capillary unit installed to form a plurality of gaps within the tube so that the refrigerant can move along the circulatory path due to capillary action caused by the gaps. Accordingly, when the refrigerant passes through the capillary unit due to the capillary action, bubbles in the tube can be reduced. In addition, a multi-path is formed for the movement of the liquid refrigerant, so discontinuation of the refrigerant can be prevented, thereby preventing the refrigerant in the evaporator from drying out.
    Type: Application
    Filed: March 29, 2002
    Publication date: October 3, 2002
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Mun-cheol Choi, Byeoung Ju Ha, Young-ki Hong, Jong-beom Kim
  • Patent number: 6343484
    Abstract: An air blowing apparatus of an air conditioner having an outdoor fan which includes a hub and vanes faced with a condenser at a predetermined distance, wherein the outdoor fan is assembled at a distance between the hub and the condenser no larger than 1.3 times the distance between the vanes and the condenser, thereby preventing a whirling phenomenon, in which air is infused toward the center of the hub in rotations of the outdoor fan and accomplishing smooth condensation by getting normal air flow to form at the center of the condenser faced with the hub.
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: February 5, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Ki Hong, Byung-Han Lim, Weon-Seok Choi