Patents by Inventor Young Rae Kim

Young Rae Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240142575
    Abstract: A method including clustering second point clouds comprised in second point cloud data of a second timepoint, obtaining output data corresponding to one or more second clusters generated as a result of the clustering by applying the second point clouds to a pretrained neural network, determining whether at least one of the one or more second clusters is a target object based on a reliability factor, tracking first clusters corresponding to the target object in first point cloud data of one or more first timepoints prior to the second timepoint, and training of the pretrained neural network based on the output data corresponding to the first clusters and the first point clouds for each first cluster determined according to a result of the tracking.
    Type: Application
    Filed: April 10, 2023
    Publication date: May 2, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sungdo CHOI, Jong-Sok KIM, Seung Tae KHANG, Jinyong JEON, Young Rae CHO
  • Publication number: 20240142605
    Abstract: Disclosed is a sign apparatus for displaying a sign for traffic or a vehicle, where the sign apparatus includes a display configured to display the sign and to permit a radar signal radiated from a source to pass, a filter configured to attenuate a signal of at least one frequency in the radar signal passing through the display and to allow a signal of a remaining frequency to pass, and a reflector configured to reflect the signal passing through the filter, wherein the reflected signal includes encoded identification information of the sign.
    Type: Application
    Filed: May 31, 2023
    Publication date: May 2, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: JINYONG JEON, SEUNG TAE KHANG, SUNGDO CHOI, JONG-SOK KIM, YOUNG RAE CHO
  • Publication number: 20240123760
    Abstract: A method for manufacturing a vehicle wheel includes: a casting process of manufacturing the wheel in a one-piece body having a forming end and a temporary flange protruding at inner and outer sides of the wheel, respectively, wherein the one-piece body further includes a resonance chamber forming groove; a primary shape machining process of forming a stepped part at an outer circumferential side of the resonance chamber forming groove; a flow forming process of bending the forming end to be seated on the stepped part; a friction stir welding process of integrally bonding a portion where the forming end and the stepped part are in close contact with each other; a fine machining process of removing the temporary flange; and a sound-absorbing hole machining process of forming a sound-absorbing hole for communicating between the resonance chamber and an interior space of a tire in the forming end.
    Type: Application
    Filed: December 26, 2023
    Publication date: April 18, 2024
    Applicants: Hyundai Motor Company, KIA CORPORATION, Hyundai Sungwoo Casting Co., Ltd.
    Inventors: Jun Min LEE, Young Chan KIM, Min Soo KIM, Young Rae JO, Young Il KIM, Sang Bum PARK, Chang Hak YOO
  • Publication number: 20240125923
    Abstract: A method and device for object recognition for information collected from a sensor of a moving object are disclosed. The method may include identifying a target with a confidence level of recognition accuracy less than a threshold, based on first sensing information collected from a moving object, obtaining second sensing information on the target from an interworking moving object, synchronizing the first sensing information and the second sensing information based on time information included in the first sensing information and time information included in the second sensing information, and training a neural network for estimating recognition information of the target from the first synchronized sensing information by using information on the target included in the second synchronized sensing information as ground truth data.
    Type: Application
    Filed: March 14, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-Sok KIM, Sungdo CHOI, Seung Tae KHANG, Jinyong JEON, Young Rae CHO
  • Publication number: 20240125925
    Abstract: A method of predicting a movement of a cut-in object, including separating a Doppler velocity corresponding to at least one wheel of the cut-in object from radar data based on a velocity of the cut-in object, determining a position of the at least one wheel of the cut-in object based on the Doppler velocity, generating at least one of first movement information related to a horizontal movement of the cut-in object or second movement information related to a moving direction of the cut-in object based on the position of the at least one wheel, and determining a position of the cut-in object based on at least one of the first movement information or the second movement information.
    Type: Application
    Filed: May 22, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sungdo CHOI, Seung Tae KHANG, Jong-Sok KIM, Jinyong JEON, Young Rae CHO
  • Publication number: 20240113403
    Abstract: The present disclosure relates to an electrolyte injection system, and the electrolyte injection system is a system for injecting an electrolyte solution into a pouch in which an electrode assembly is embedded, the electrolyte injection system comprising: an injection pipe for injecting an electrolyte solution; an electrolyte solution supply portion supplying an electrolyte solution; and a manifold portion connecting an injection pipe and an electrolyte solution supply portion to prevent a reverse flow of the electrolyte solution and ensure precision of injection amount so that a large amount of electrolyte solution may be accurately and rapidly injected.
    Type: Application
    Filed: July 27, 2023
    Publication date: April 4, 2024
    Inventors: Jae Min RYU, Sang Jun PARK, Kang San KIM, Ji Eun AHN, Young Rae OH
  • Publication number: 20240104990
    Abstract: Disclosed herein is a method for user-centered visitor access management, which may include issuing, by a management office server, a digital certificate to a householder terminal; registering, by a wall-pad, a householder in response to a request to register the householder based on the digital certificate; requesting, by the householder terminal, the management office server to register a visitor based on a visit request from a visitor terminal and delegating the digital certificate to the visitor terminal; making an entry request to a management terminal based on the digital certificate; verifying, by the wall-pad, the digital certificate based on a request for verification for entry from a wall-pad management terminal and providing a verification result to the wall-pad management terminal when the management terminal is the wall-pad management terminal; and managing and controlling, by the wall-pad, permission to use home devices based on delegated permission information of the digital certificate.
    Type: Application
    Filed: March 22, 2023
    Publication date: March 28, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Seok-Hyun KIM, Young-Seob CHO, Soo-Hyung KIM, Geon-Woo KIM, Young-Sam KIM, Jong-Hyouk NOH, Kwan-Tae CHO, Sang-Rae CHO, Jin-Man CHO, Seung-Hun JIN
  • Publication number: 20240104115
    Abstract: Disclosed herein are a method and apparatus for converting a credential data schema.
    Type: Application
    Filed: July 11, 2023
    Publication date: March 28, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Seok-Hyun KIM, Soo-Hyung KIM, Young-Seob CHO, Geon-Woo KIM, Young-Sam KIM, Jong-Hyouk NOH, Kwan-Tae CHO, Sang-Rae CHO, Jin-Man CHO, Seung-Hun JIN
  • Patent number: 11837462
    Abstract: A solar spectral wavelength converting material with improved efficiency and a solar cell including the same. According to an embodiment, a solar spectral wavelength converting material includes an aluminum hydroxide precursor and an aromatic ring compound or a derivative including the same.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: December 5, 2023
    Assignee: HANWHA TOTAL PETROCHEMICAL CO., LTD.
    Inventors: Hyo Joo Shin, Young Rae Kim, Yeon Shick Yoo
  • Patent number: 11687183
    Abstract: A display device includes a first substrate, a display structure, a sensing structure, a sensing signal transmission film, and an image signal transmission film. The first substrate includes a display region and a non-display region at least partially surrounding the display region. The non-display region includes a first portion and a second portion facing the first portion. The display structure is disposed in the display region. The sensing structure is disposed on the display structure. The sensing signal transmission film is electrically connected to the sensing structure. The image signal transmission film is electrically connected to the display structure. The sensing signal transmission film is disposed in the first portion of the non-display region. The image signal transmission film is disposed in the second portion of the non-display region.
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: June 27, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Young Rae Kim, Jung Tae Kim, Kyung Min Park, Dong-Yoon So, Ji Hyeon Ryu
  • Publication number: 20220259493
    Abstract: The present invention relates to a solar wavelength conversion material with improved efficiency, and a solar cell comprising same. According to one embodiment of the present invention, the present invention provides a solar wavelength conversion material comprising an aluminum hydroxide precursor, and a lanthanide ion or a derivative containing same.
    Type: Application
    Filed: July 15, 2020
    Publication date: August 18, 2022
    Inventors: Ki Se KIM, Jae Hyuck HAN, Do Hoon LEE, Choon Ki KIM, Young Rae KIM, Taejong PAIK, Min Hye KIM, Hyo Joo SHIN
  • Publication number: 20220253170
    Abstract: A display device includes a first substrate, a display structure, a sensing structure, a sensing signal transmission film, and an image signal transmission film. The first substrate includes a display region and a non-display region at least partially surrounding the display region. The non-display region includes a first portion and a second portion facing the first portion. The display structure is disposed in the display region. The sensing structure is disposed on the display structure. The sensing signal transmission film is electrically connected to the sensing structure. The image signal transmission film is electrically connected to the display structure. The sensing signal transmission film is disposed in the first portion of the non-display region. The image signal transmission film is disposed in the second portion of the non-display region.
    Type: Application
    Filed: May 2, 2022
    Publication date: August 11, 2022
    Inventors: YOUNG RAE KIM, Jung Tae Kim, Kyung Min Park, Dong-Yoon So, Ji Hyeon Ryu
  • Patent number: 11366538
    Abstract: A display device includes a first substrate, a display structure, a sensing structure, a sensing signal transmission film, and an image signal transmission film. The first substrate includes a display region and a non-display region at least partially surrounding the display region. The non-display region includes a first portion and a second portion facing the first portion. The display structure is disposed in the display region. The sensing structure is disposed on the display structure. The sensing signal transmission film is electrically connected to the sensing structure. The image signal transmission film is electrically connected to the display structure. The sensing signal transmission film is disposed in the first portion of the non-display region. The image signal transmission film is disposed in the second portion of the non-display region.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: June 21, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Young Rae Kim, Jung Tae Kim, Kyung Min Park, Dong-Yoon So, Ji Hyeon Ryu
  • Publication number: 20220136995
    Abstract: An electric field variable gas sensor includes a semiconductor substrate, an insulating film disposed on the semiconductor substrate, a semiconductor thin film material disposed on a part of the semiconductor substrate and a part of the insulating film, a gas molecule adsorption inducing material disposed on the semiconductor thin film material, a first electrode disposed on the semiconductor substrate to be spaced apart from the semiconductor thin film material, and a second electrode disposed on the insulating film to be connected with the semiconductor thin film material.
    Type: Application
    Filed: September 27, 2021
    Publication date: May 5, 2022
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Woo Jong YU, Young Rae KIM, Thanh Luan PHAN
  • Publication number: 20220102594
    Abstract: A solar spectral wavelength converting material with improved efficiency and a solar cell including the same. According to an embodiment, a solar spectral wavelength converting material includes an aluminum hydroxide precursor and an aromatic ring compound or a derivative including the same.
    Type: Application
    Filed: March 22, 2021
    Publication date: March 31, 2022
    Inventors: Hyo Joo SHIN, Young Rae KIM, Yeon Shick YOO
  • Publication number: 20210398930
    Abstract: A semiconductor device includes a low-density substrate, a high-density patch positioned inside a cavity in the low-density substrate, a first semiconductor die, and a second semiconductor die. The first semiconductor dies includes high-density bumps and low-density bumps. The second semiconductor die includes high-density bumps and low-density bumps. The high-density bumps of the first semiconductor die and the high-density bumps of the second semiconductor die are electrically connected to the high-density patch. The low-density bumps of the first semiconductor die and the low-density bumps of the second semiconductor die are electrically connected to the low-density substrate.
    Type: Application
    Filed: May 24, 2021
    Publication date: December 23, 2021
    Inventors: Jae Hun Bae, Won Chul Do, Min Yoo, Young Rae Kim, Min Hwa Chang, Dong Hyun Kim, Ah Ra Jo, Seok Geun Ahn
  • Publication number: 20210191551
    Abstract: A display device includes a first substrate, a display structure, a sensing structure, a sensing signal transmission film, and an image signal transmission film. The first substrate includes a display region and a non-display region at least partially surrounding the display region. The non-display region includes a first portion and a second portion facing the first portion. The display structure is disposed in the display region. The sensing structure is disposed on the display structure. The sensing signal transmission film is electrically connected to the sensing structure. The image signal transmission film is electrically connected to the display structure. The sensing signal transmission film is disposed in the first portion of the non-display region. The image signal transmission film is disposed in the second portion of the non-display region.
    Type: Application
    Filed: August 17, 2020
    Publication date: June 24, 2021
    Inventors: Young Rae KIM, Jung Tae Kim, Kyung Min Park, Dong-Yoon So, Ji Hyeon Ryu
  • Patent number: 11018107
    Abstract: A semiconductor device includes a low-density substrate, a high-density patch positioned inside a cavity in the low-density substrate, a first semiconductor die, and a second semiconductor die. The first semiconductor dies includes high-density bumps and low-density bumps. The second semiconductor die includes high-density bumps and low-density bumps. The high-density bumps of the first semiconductor die and the high-density bumps of the second semiconductor die are electrically connected to the high-density patch. The low-density bumps of the first semiconductor die and the low-density bumps of the second semiconductor die are electrically connected to the low-density substrate.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: May 25, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jae Hun Bae, Won Chul Do, Min Yoo, Young Rae Kim, Min Hwa Chang, Dong Hyun Kim, Ah Ra Jo, Seok Geun Ahn
  • Publication number: 20200051944
    Abstract: A semiconductor device includes a low-density substrate, a high-density patch positioned inside a cavity in the low-density substrate, a first semiconductor die, and a second semiconductor die. The first semiconductor dies includes high-density bumps and low-density bumps. The second semiconductor die includes high-density bumps and low-density bumps. The high-density bumps of the first semiconductor die and the high-density bumps of the second semiconductor die are electrically connected to the high-density patch. The low-density bumps of the first semiconductor die and the low-density bumps of the second semiconductor die are electrically connected to the low-density substrate.
    Type: Application
    Filed: May 20, 2019
    Publication date: February 13, 2020
    Inventors: Jae Hun Bae, Won Chul Do, Min Yoo, Young Rae Kim, Min Hwa Chang, Dong Hyun Kim, Ah Ra Jo, Seok Geun Ahn
  • Patent number: 10388582
    Abstract: A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer to the interposer, filling a region between the semiconductor die and the interposer with an underfill, and encapsulating the reinforcement member, the semiconductor die and the underfill on the interposer using an encapsulant.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: August 20, 2019
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Young Rae Kim, Won Chul Do, Ji Hun Lee, Min Hwa Chang, Dong Hyun Kim, Wang Gu Lee, Jin Ryang Hwang, Mi Kyeong Choi