Abstract: A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer to the interposer, filling a region between the semiconductor die and the interposer with an underfill, and encapsulating the reinforcement member, the semiconductor die and the underfill on the interposer using an encapsulant.

Abstract: A semiconductor device includes a low-density substrate, a high-density patch positioned inside a cavity in the low-density substrate, a first semiconductor die, and a second semiconductor die. The first semiconductor dies includes high-density bumps and low-density bumps. The second semiconductor die includes high-density bumps and low-density bumps. The high-density bumps of the first semiconductor die and the high-density bumps of the second semiconductor die are electrically connected to the high-density patch. The low-density bumps of the first semiconductor die and the low-density bumps of the second semiconductor die are electrically connected to the low-density substrate.

Abstract: A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer to the interposer, filling a region between the semiconductor die and the interposer with an underfill, and encapsulating the reinforcement member, the semiconductor die and the underfill on the interposer using an encapsulant.

Abstract: A semiconductor device includes a low-density substrate, a high-density patch positioned inside a cavity in the low-density substrate, a first semiconductor die, and a second semiconductor die. The first semiconductor dies includes high-density bumps and low-density bumps. The second semiconductor die includes high-density bumps and low-density bumps. The high-density bumps of the first semiconductor die and the high-density bumps of the second semiconductor die are electrically connected to the high-density patch. The low-density bumps of the first semiconductor die and the low-density bumps of the second semiconductor die are electrically connected to the low-density substrate.

Abstract: Provided is a question answering system with respect to a natural language question and a method thereof. The question answering system includes a candidate answer generating unit configured to extract a document mapped to an input natural language question, and generate candidate answers with respect to the natural language question from the extracted document, a text entailment recognizing unit configured to generate a text entailment recognition result representing a degree of association between multiple evidence sentences including the generated candidate answers and the natural language question, a list generating unit configured to generate a candidate answer list including the multiple evidence sentences in high association degree order on the basis of the text entailment recognition result, and an output unit configured to output the generated candidate answer list as a search result with respect to the natural language question.

Abstract: A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer to the interposer, filling a region between the semiconductor die and the interposer with an underfill, and encapsulating the reinforcement member, the semiconductor die and the underfill on the interposer using an encapsulant.

Abstract: A semiconductor device with enhanced interposer quality, and method of manufacturing thereof. For example and without limitation, various aspects of the present disclosure provide an interposer die that comprises a first signal distribution structure comprising at least a first dielectric layer and a first conductive layer, wherein the signal distribution structure is protected at lateral edges by a protective layer. Also for example, various aspects of the present disclosure provide a method of manufacturing a semiconductor device comprising such an interposer die.

Abstract: A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise connection verification for a first one or more mounted components prior to additional assembly.

Abstract: A semiconductor device with enhanced interposer quality, and method of manufacturing thereof. For example and without limitation, various aspects of the present disclosure provide an interposer die that comprises a first signal distribution structure comprising at least a first dielectric layer and a first conductive layer, wherein the signal distribution structure is protected at lateral edges by a protective layer. Also for example, various aspects of the present disclosure provide a method of manufacturing a semiconductor device comprising such an interposer die.

Abstract: A solder ball attachment apparatus including an open ball box configured to accommodate a plurality of solder balls, the open ball box including, a pocket portion at a bottom thereof, the pocket portion configured to accommodate the solder balls, and an inclined portion extending from the pocket portion toward an outer surface of the open ball box, a solder ball attachment tool configured to apply suction pressure to a lower surface thereof, the lower surface configured to face the open ball box, the lower surface configured to adsorb the solder balls accommodated in the ball box by moving between a first position and a second position, the first position being a standby position, the second position being a position for adsorbing the solder balls, and a vibration member connected to the open ball box may be provided.

Abstract: A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer to the interposer, filling a region between the semiconductor die and the interposer with an underfill, and encapsulating the reinforcement member, the semiconductor die and the underfill on the interposer using an encapsulant.

Abstract: A natural language question answering system and method, and a paraphrase module are provided. The natural language question answering system includes a conversion module configured to generate a plurality of modified questions by paraphrasing a user's question; a plurality of question answering engines configured to receive each of the user's question and the modified questions, and select candidate answers corresponding to each of the user's question and the modified questions; and a detection module configured to detect at least one among the selected candidate answers as an answer.

Abstract: A natural language question answering system and method, and a paraphrase module are provided. The natural language question answering system includes a conversion module configured to generate a plurality of modified questions by paraphrasing a user's question; a plurality of question answering engines configured to receive each of the user's question and the modified questions, and select candidate answers corresponding to each of the user's question and the modified questions; and a detection module configured to detect at least one among the selected candidate answers as an answer.

Abstract: Disclosed are an apparatus and a method for replying to a query. The apparatus for replying to a query includes: a query reply processing unit configured to generate candidates of correct answers by analyzing a question of a user who has inputted a query and searching knowledge database and document database based on a result of analyzing the question and configured to infer a final correct answer from the candidates of correct answers; an inference information generating unit configured to generate a reference corpus and a word inquiry, which are inference information for inferring a knowledge level of a user of little or no information; and a knowledge level inferring unit configured to generate knowledge level information by inferring the knowledge level of the user by use of the reference corpus and the word inquiry and provide the knowledge level information to the query reply processing unit.

Abstract: Various aspects of the present disclosure provide a semiconductor device and a method for manufacturing thereof, which can facilitate stacking of semiconductor die while saving manufacturing cost. In an example embodiment, the semiconductor device may comprise a first semiconductor die, a second semiconductor die bonded to a top surface of the first semiconductor die, and a redistribution layer electrically connecting the first semiconductor die to the second semiconductor die, wherein the redistribution layer is formed to extend along surrounding side portions of the second semiconductor die.

Abstract: Provided is a question answering system with respect to a natural language question and a method thereof. The question answering system includes a candidate answer generating unit configured to extract a document mapped to an input natural language question, and generate candidate answers with respect to the natural language question from the extracted document, a text entailment recognizing unit configured to generate a text entailment recognition result representing a degree of association between multiple evidence sentences including the generated candidate answers and the natural language question, a list generating unit configured to generate a candidate answer list including the multiple evidence sentences in high association degree order on the basis of the text entailment recognition result, and an output unit configured to output the generated candidate answer list as a search result with respect to the natural language question.

Abstract: A system for extending coverage of a wireless Internet service by using a mobile communication network is provided. The system includes a wireless access point, a combiner, and a distributor. The combiner is connected to the wireless access point. The combiner includes a filter that isolates a signal band of a wireless Internet signal corresponding to the wireless access point and a signal band of a mobile communication signal corresponding to the mobile communication network. After isolation, the combiner outputs the wireless Internet signal or the mobile communication signal. The distributor is connected to the combiner and at least one antenna. The distributor receives the wireless Internet signal from the combiner and outputs the received wireless Internet signal via the antenna.

Abstract: A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise connection verification for a first one or more mounted components prior to additional assembly.

Abstract: A method for forming a reduced thickness semiconductor package is disclosed and may include providing a first die with an active layer, a through-silicon via (TSV), and a pattern and an under bump metal (UBM) in a dielectric layer on the active layer. A carrier may be bonded to the dielectric layer and the UBM. The first die may be thinned to expose the TSV. A bump pad may be formed on the exposed TSV and a second die may be bonded to the bump pad. The first die, the second die, and an outer surface of the dielectric layer may be encapsulated utilizing a first encapsulant. The carrier may be removed from the dielectric layer and the UBM, and a solder ball may be formed on the UBM. A groove may be formed through the dielectric layer and into the first die.

Abstract: Various aspects of the present disclosure provide a semiconductor device and a method for manufacturing thereof, which can facilitate stacking of semiconductor die while saving manufacturing cost. In an example embodiment, the semiconductor device may comprise a first semiconductor die, a second semiconductor die bonded to a top surface of the first semiconductor die, and a redistribution layer electrically connecting the first semiconductor die to the second semiconductor die, wherein the redistribution layer is formed to extend along surrounding side portions of the second semiconductor die.