Abstract: Disclosed are a multilayer coating film made from a natural material and a method of producing the same. The multilayer coating film may be produced by forming a multilayer coating film through formation of a color coating film for providing adhesion and color to a cork on the cork material and a clear coating film for realizing texture and supplementing properties on the color coating film. As such, the multilayer coating film may be made from a natural material to diversify the color and gloss of cork as a natural material, to additionally increase marketability of an interior material and provide various appearance, to prevent discoloration due to light (e.g. UV light.) and water permeation, and to enhance durability against abrasion, scratches and the like.

Abstract: A clear paint composition for a hot stamping film and a painting method using the same is provided. More particularly, disclosed are a clear paint composition for a hot stamping film which may enhance adhesion by mixing an epoxy-denatured acrylic resin and two light absorber types with an acrylic resin and a polyester polyol resin, may increase weather resistance by simultaneously blocking short and long wavelengths and may enhance chipping resistance, fouling resistance and water resistance by mixing a hardener including reactive silicone therewith, and a painting method using the same.

Abstract: Provided are a pharmaceutical composition for preventing or treating skin cancer and a method of preventing or treating skin cancer in a subject by using the pharmaceutical composition, wherein the pharmaceutical composition includes a Panax spp. plant extract as an active ingredient.

Abstract: Polyarylene polymers formed from an aromatic dialkyne monomer having a solubility enhancing moiety and having relatively high weight average molecular weights and a relatively low polydispersity show improved solubility in certain organic solvents and are useful in forming relatively thick dielectric material layers in a single coating step.

Abstract: Polyarylene oligomer compositions having improved adhesion to surfaces as compared to conventional polyarylene oligomers are useful in forming dielectric material layers in electronics applications.

Abstract: Polyarylene oligomer compositions capable of curing at lower temperatures than conventional polyarylene oligomers are useful in forming dielectric material layers in electronics applications.

Abstract: Certain cyclopentadienone monomers having polar moieties are useful in forming polyarylene resins having improved solubility in certain organic solvents and are useful in forming polyarylene resin layers in electronics applications.

Abstract: Disclosed is a semiconductor device including a conductive shield layer formed within a cavity of a molding part and a manufacturing method thereof. Various aspects of the present invention, for example and without limitation, includes a semiconductor device including a conductive shield layer formed along the wall of a cavity to of a molding part to improve EMI shielding performance, and a manufacturing method thereof.

Abstract: A computing system includes a processor that operates a plurality of virtual machines in which a plurality of operating systems are respectively executed. The processor executes a hypervisor that groups the plurality of virtual machines into a normal virtual machine group and a privilege virtual machine group, and that controls hardware accesses requested by the normal virtual machine group and the privilege virtual machine group. The processor executes a normal application in the normal virtual machine group, and executes a secure application in the privilege virtual machine group.

Abstract: Disclosed are a multilayer coating film made from a natural material and a method of producing the same. The multilayer coating film may be produced by forming a multilayer coating film through formation of a color coating film for providing adhesion and color to a cork on the cork material and a clear coating film for realizing texture and supplementing properties on the color coating film. As such, the multilayer coating film may be made from a natural material to diversify the color and gloss of cork as a natural material, to additionally increase marketability of an interior material and provide various appearance, to prevent discoloration due to light (e.g. UV light.) and water permeation, and to enhance durability against abrasion, scratches and the like.

Abstract: Provided is a battery protection circuit package capable of effectively preventing overcurrent and overheating and of being implemented at low costs in a compact size, the battery protection circuit package including a first terminal and a second terminal electrically connected to electrode terminals of a battery bare cell, a third terminal and a fourth terminal electrically connected to a charger or an electronic device, a first protection circuit module including one or more first transistors connected between at least one of the first and second terminals and at least one of the third and fourth terminals, and a first protection integrated circuit (IC) for controlling the one or more first transistors, and a second protection circuit module including one or more second transistors connected between at least one of the first and second terminals and at least one of the third and fourth terminals and connected in series to the one or more first transistors, and a second protection IC for controlling the one

Abstract: A coating composition for one-coat-one bake coating includes a resin, a pigment, a solvent, and a general additive. The resin is an acryl modified urethane resin manufactured by polymerizing polycarbonate diol, polyester diol, an acryl resin, and an isocyanate monomer. The coating composition using one-coat-one bake coating can provide soft texture, excellent chemical resistance, and adhesion.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.

Abstract: Certain polyarylene oligomers having improved solubility are useful in forming dielectric material layers in electronics applications.

Abstract: A protection IC includes a bias output terminal connected to a back gate of a MOS transistor, a load side terminal connected to a power supply path between a load and the MOS transistor, a load side switch inserted in an electric current path connecting the bias output terminal and the load side terminal, and a control circuit configured to control the load side switch based on a state of a secondary battery and thereby cause a back gate control signal for controlling a voltage of the back gate to be output from the bias output terminal. The load side switch is formed on an N-type silicon substrate and includes at least two NMOS transistors whose drains are connected to each other, and the control circuit is configured to simultaneously turn on or turn off the two NMOS transistors based on the state of the secondary battery.

Abstract: A super junction MOSFET includes a substrate having a first conductive type, an epitaxial layer formed on the substrate, a set of pillars extending from the substrate through the epitaxial layer, the set of pillars being spaced apart from each other, a set of first wells, the set of first wells formed in the epitaxial layer to extend to an upper face of the epitaxial layer, and each of the set of first wells connected to at least one corresponding pillar of the set of pillars, a set of second wells of the first conductive type formed in the set of first wells, and a plurality of gate structures formed on the epitaxial layer, each extending in a first direction to have a stripe shape such that the gate structures are spaced apart from each other. Thus, the gate structure has a relatively small area to reduce an input capacitance of the super junction MOSFET.

Abstract: A secondary battery protection circuit includes a first terminal connected to a power supply path between a secondary battery and a MOS transistor, a second terminal connected to the power supply path between a load and the MOS transistor, a third terminal connected to a gate of the MOS transistor, a fourth terminal connected to a back gate of the MOS transistor, a control circuit that outputs a switch control signal based on a detected abnormal state of the secondary battery, and a switch control circuit including a first switch for connecting the fourth terminal with the first terminal and a second switch for connecting the fourth terminal with the second terminal. At least one of the resistance between the fourth terminal and the first terminal and the resistance between the fourth terminal and the second terminal is greater than the on resistance value of the MOS transistor.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.

Abstract: Disclosed is a battery protection module package (PMP). The battery PMP according to an embodiment of the present invention includes a lead frame provided with a plurality of external terminals thereon, a printed circuit board stacked on the lead frame, and a plurality of internal terminals, a protection integrated chip (IC), a field effect transistor (FET), resistors, and capacitors disposed on the printed circuit board and electrically connected to each other, wherein the resistors and the capacitors are mounted on a pattern of the printed circuit board using surface mount technology (SMT), and wherein the plurality of internal terminals are electrically connected to the plurality of external terminals.