Abstract: A camera module includes a housing, a reflection module including a reflective member, and supported on the housing, a lens module including a plurality of lenses arranged in an optical axis direction, and supported on the housing in a direction different from that of the reflection module, wherein the reflection module is configured to be rotatable with respect to the housing using an optical axis and a first axis perpendicular to the optical axis, as rotation axes, and the reflection module is supported on the housing in the optical axis direction.

Abstract: A reflective module includes a first lens module having a first optical axis; a holder on which a reflective member is disposed to reflect light passing through the first lens module; a guide member on which the holder is disposed; a housing accommodating the holder and the guide member; and a first ball member, disposed between the guide member and the housing, comprising a first ball group and a second ball group, spaced apart in a direction of a first rotation axis. The first lens module and the holder are configured to rotate together about the first rotation axis and a second rotation axis, perpendicular to each other and perpendicular to the first optical axis. The guide member is configured to rotate about the first rotation axis, together with the first lens module and the holder.

Abstract: The present invention relates to a positive electrode active material and a lithium secondary battery including the same, and more particularly, to a positive electrode active material capable of maintaining the electrochemical properties of a lithium secondary battery using a lithium composite oxide as a positive electrode active material while preventing and/or mitigating gas generation and swelling due to the positive electrode active material in a lithium secondary battery by suppressing the excessive growth of primary particles and improving the crystallinity of primary particles, and a lithium secondary battery including the same.

Abstract: A core body temperature measurement device includes a body and an operation unit. The body is fixed to an ear canal of user. The operation unit is combined with a front side of the body, and is configured to be exposed to the ear canal or to be concealed inside, and has a sensor part. the sensor part measures a core body temperature of user when the operation unit is exposed to the ear canal.

Abstract: Provided are a device, method, and computer-readable recording medium for detecting an earthquake in a microelectromechanical system (MEMS)-based auxiliary seismic observation network.

Abstract: The present disclosure relates to a hydrophilic modified polymer membrane and a method for fabricating the same, and more specifically, to a polymer membrane dip-coated with double bond-containing PVDF (DPVDF) and modified to be hydrophilic by reaction with a polymer or monomer containing an amine group, and a method of fabricating the same. The polymer membrane of the present disclosure is fabricated by physically coating a porous polymer substrate by dip coating with DPVDF, and then chemically modifying the surface of the dip-coated substrate to be hydrophilic using a polymer or monomer containing an amine group. That is, the polymer membrane is fabricated by performing both physical coating and chemical coating so that the dissolution of inorganic particles in the membrane can be further suppressed.

Abstract: Provided are a device, method, and computer-readable recording medium for detecting an earthquake in a microelectromechanical system (MEMS)-based auxiliary seismic observation network.

Abstract: Provided is an earthquake response system using a seismic motion sensor. The seismic motion sensor of the earthquake response system includes: a sensor unit measuring a sensor value including peak ground acceleration (PGA) of the ground due to shaking; a seismic motion sensing unit sensing seismic motion on the basis of a seismic motion sensing result value calculated from an artificial neural network that uses the peak ground acceleration as input when the peak ground acceleration satisfies a seismic motion sensing condition; a seismic motion determiner determining generation of final seismic motion on the basis of a seismic motion determination parameter calculated from the sensor value on the basis of the seismic motion sensing result; a shaking grade calculator calculating a shaking grade of the determined final seismic motion through the peak ground acceleration; and a communication unit notifying the shaking grade of the final seismic motion.

Abstract: The present invention relates to a skin attachment comprising light emitting elements and a storage apparatus therefor. According to one aspect of the invention, there is provided a skin attachment, comprising: an attachment unit attached to skin of a user, wherein the attachment unit is capable of being bent and attached along a curved surface of the skin of the user; a light emitting unit disposed in the attachment unit, wherein the light emitting unit comprises at least one light emitting element; a diffusion unit configured to diffuse light from the light emitting unit, wherein the diffusion unit comprises scattering particles or microlenses; and a control unit disposed in the attachment unit and configured to control the light emitting unit.

Abstract: Provided is an earthquake response system using a seismic motion sensor. The seismic motion sensor of the earthquake response system includes: a sensor unit measuring a sensor value including peak ground acceleration (PGA) of the ground due to shaking; a seismic motion sensing unit sensing seismic motion on the basis of a seismic motion sensing result value calculated from an artificial neural network that uses the peak ground acceleration as input when the peak ground acceleration satisfies a seismic motion sensing condition; a seismic motion determiner determining generation of final seismic motion on the basis of a seismic motion determination parameter calculated from the sensor value on the basis of the seismic motion sensing result; a shaking grade calculator calculating a shaking grade of the determined final seismic motion through the peak ground acceleration; and a communication unit notifying the shaking grade of the final seismic motion.

Abstract: A ship comprises: a hull; an engine for propelling the hull; a harmful substance reducing device for reducing harmful substances included in exhaust gas discharged from the engine; and a preheating device for the harmful substance reducing device, preliminarily heating the harmful substance reducing device when the hull is located at an emission control area (ECA) preliminary entry point close to an ECA in which the emission of the harmful substances is restricted. The ship comprises: the hull; the engine for propelling the hull; the harmful substance reducing device for reducing the harmful substances included in the exhaust gas discharged from the engine; and an engine output control device for controlling the output of the engine to be lowered so as to reduce the amount of the exhaust gas discharged from the engine when the hull is located in the ECA or at the ECA preliminary entry point.

Abstract: A ship comprises: a hull; an engine for propelling the hull; a harmful substance reducing device for reducing harmful substances included in exhaust gas discharged from the engine; and a preheating device for the harmful substance reducing device, preliminarily heating the harmful substance reducing device when the hull is located at an emission control area (ECA) preliminary entry point close to an ECA in which the emission of the harmful substances is restricted. The ship comprises: the hull; the engine for propelling the hull; the harmful substance reducing device for reducing the harmful substances included in the exhaust gas discharged from the engine; and an engine output control device for controlling the output of the engine to be lowered so as to reduce the amount of the exhaust gas discharged from the engine when the hull is located in the ECA or at the ECA preliminary entry point.

Abstract: A waveguide of a multi-layer metal structure and a manufacturing method thereof are provided, the method including applying a plurality of metal layers on a substrate and a plurality of insulating layers respectively between the respective metal layers. Accordingly, it is possible to minimize conductive loss by dispersing current uniformly through wide regions between a signal line and ground lines.

Abstract: A method for fabricating test structures on a wafer for integrated circuits. The method includes providing a semiconductor substrate, e.g., silicon wafer. The method includes forming a plurality of integrated circuit chip structures on the semiconductor substrate and forming a plurality of MOS devices on a scribe line formed between a first group and a second group of integrated circuit chip structures concurrently using one or more similar processes during forming the plurality of integrated circuit chip structures. The method includes forming a first contact structure and a second contact structure. The first contact structure is coupled to a first MOS device in the plurality of MOS devices and the second contact structure is coupled to an Nth MOS device in the plurality of MOS devices, where N is an integer greater than 1.

Abstract: A waveguide of a multi-layer metal structure and a manufacturing method thereof are provided, the method including applying a plurality of metal layers on a substrate and a plurality of insulating layers respectively between the respective metal layers. Accordingly, it is possible to minimize conductive loss by dispersing current uniformly through wide regions between a signal line and ground lines.

Abstract: A method for fabricating test structures on a wafer for integrated circuits. The method includes providing a semiconductor substrate, e.g., silicon wafer. The method includes forming a plurality of integrated circuit chip structures on the semiconductor substrate and forming a plurality of MOS devices on a scribe line formed between a first group and a second group of integrated circuit chip structures concurrently using one or more similar processes during forming the plurality of integrated circuit chip structures. The method includes forming a first contact structure and a second contact structure. The first contact structure is coupled to a first MOS device in the plurality of MOS devices and the second contact structure is coupled to an Nth MOS device in the plurality of MOS devices, where N is an integer greater than 1.

Abstract: A method for fabricating test structures on a wafer for integrated circuits. The method includes providing a semiconductor substrate, e.g., silicon wafer. The method includes forming a plurality of integrated circuit chip structures on the semiconductor substrate and forming a plurality of MOS devices on a scribe line formed between a first group and a second group of integrated circuit chip structures concurrently using one or more similar processes during forming the plurality of integrated circuit chip structures. The method includes forming a first contact structure and a second contact structure. The first contact structure is coupled to a first MOS device in the plurality of MOS devices and the second contact structure is coupled to an Nth MOS device in the plurality of MOS devices, where N is an integer greater than 1.

Abstract: Provided herein is a cancer detection and treatment instrument comprising: a first conductive plate; a second conductive plate which is opposed to the first conductive plate and has a first opening; a first signal line disposed between the first conductive plate and the second conductive plate; a first contact member of which one end is exposed through the first opening and of which the other end is connected to the first signal line; a dielectric portion filled between the first and second conductive plates and the first signal line; and a conductive layer surrounding both side surfaces and a front end surface of the dielectric portion which are exposed. Therefore, it is possible to accurately detect cancer by the use of the ultrahigh-frequency signal and to treat a diseased portion without damaging tissues around the diseased portion.

Abstract: A method for fabricating test structures on a wafer for integrated circuits. The method includes providing a semiconductor substrate, e.g., silicon wafer. The method includes forming a plurality of integrated circuit chip structures on the semiconductor substrate and forming a plurality of MOS devices on a scribe line formed between a first group and a second group of integrated circuit chip structures concurrently using one or more similar processes during forming the plurality of integrated circuit chip structures. The method includes forming a first contact structure and a second contact structure. The first contact structure is coupled to a first MOS device in the plurality of MOS devices and the second contact structure is coupled to an Nth MOS device in the plurality of MOS devices, where N is an integer greater than 1.