Abstract: Provided are a device, method, and computer-readable recording medium for detecting an earthquake in a microelectromechanical system (MEMS)-based auxiliary seismic observation network.

Abstract: The present disclosure relates to a hydrophilic modified polymer membrane and a method for fabricating the same, and more specifically, to a polymer membrane dip-coated with double bond-containing PVDF (DPVDF) and modified to be hydrophilic by reaction with a polymer or monomer containing an amine group, and a method of fabricating the same. The polymer membrane of the present disclosure is fabricated by physically coating a porous polymer substrate by dip coating with DPVDF, and then chemically modifying the surface of the dip-coated substrate to be hydrophilic using a polymer or monomer containing an amine group. That is, the polymer membrane is fabricated by performing both physical coating and chemical coating so that the dissolution of inorganic particles in the membrane can be further suppressed.

Abstract: Provided are a device, method, and computer-readable recording medium for detecting an earthquake in a microelectromechanical system (MEMS)-based auxiliary seismic observation network.

Abstract: Provided is an earthquake response system using a seismic motion sensor. The seismic motion sensor of the earthquake response system includes: a sensor unit measuring a sensor value including peak ground acceleration (PGA) of the ground due to shaking; a seismic motion sensing unit sensing seismic motion on the basis of a seismic motion sensing result value calculated from an artificial neural network that uses the peak ground acceleration as input when the peak ground acceleration satisfies a seismic motion sensing condition; a seismic motion determiner determining generation of final seismic motion on the basis of a seismic motion determination parameter calculated from the sensor value on the basis of the seismic motion sensing result; a shaking grade calculator calculating a shaking grade of the determined final seismic motion through the peak ground acceleration; and a communication unit notifying the shaking grade of the final seismic motion.

Abstract: The present invention relates to a skin attachment comprising light emitting elements and a storage apparatus therefor. According to one aspect of the invention, there is provided a skin attachment, comprising: an attachment unit attached to skin of a user, wherein the attachment unit is capable of being bent and attached along a curved surface of the skin of the user; a light emitting unit disposed in the attachment unit, wherein the light emitting unit comprises at least one light emitting element; a diffusion unit configured to diffuse light from the light emitting unit, wherein the diffusion unit comprises scattering particles or microlenses; and a control unit disposed in the attachment unit and configured to control the light emitting unit.

Abstract: Provided is an earthquake response system using a seismic motion sensor. The seismic motion sensor of the earthquake response system includes: a sensor unit measuring a sensor value including peak ground acceleration (PGA) of the ground due to shaking; a seismic motion sensing unit sensing seismic motion on the basis of a seismic motion sensing result value calculated from an artificial neural network that uses the peak ground acceleration as input when the peak ground acceleration satisfies a seismic motion sensing condition; a seismic motion determiner determining generation of final seismic motion on the basis of a seismic motion determination parameter calculated from the sensor value on the basis of the seismic motion sensing result; a shaking grade calculator calculating a shaking grade of the determined final seismic motion through the peak ground acceleration; and a communication unit notifying the shaking grade of the final seismic motion.

Abstract: A ship comprises: a hull; an engine for propelling the hull; a harmful substance reducing device for reducing harmful substances included in exhaust gas discharged from the engine; and a preheating device for the harmful substance reducing device, preliminarily heating the harmful substance reducing device when the hull is located at an emission control area (ECA) preliminary entry point close to an ECA in which the emission of the harmful substances is restricted. The ship comprises: the hull; the engine for propelling the hull; the harmful substance reducing device for reducing the harmful substances included in the exhaust gas discharged from the engine; and an engine output control device for controlling the output of the engine to be lowered so as to reduce the amount of the exhaust gas discharged from the engine when the hull is located in the ECA or at the ECA preliminary entry point.

Abstract: A ship comprises: a hull; an engine for propelling the hull; a harmful substance reducing device for reducing harmful substances included in exhaust gas discharged from the engine; and a preheating device for the harmful substance reducing device, preliminarily heating the harmful substance reducing device when the hull is located at an emission control area (ECA) preliminary entry point close to an ECA in which the emission of the harmful substances is restricted. The ship comprises: the hull; the engine for propelling the hull; the harmful substance reducing device for reducing the harmful substances included in the exhaust gas discharged from the engine; and an engine output control device for controlling the output of the engine to be lowered so as to reduce the amount of the exhaust gas discharged from the engine when the hull is located in the ECA or at the ECA preliminary entry point.

Abstract: A waveguide of a multi-layer metal structure and a manufacturing method thereof are provided, the method including applying a plurality of metal layers on a substrate and a plurality of insulating layers respectively between the respective metal layers. Accordingly, it is possible to minimize conductive loss by dispersing current uniformly through wide regions between a signal line and ground lines.

Abstract: A method for fabricating test structures on a wafer for integrated circuits. The method includes providing a semiconductor substrate, e.g., silicon wafer. The method includes forming a plurality of integrated circuit chip structures on the semiconductor substrate and forming a plurality of MOS devices on a scribe line formed between a first group and a second group of integrated circuit chip structures concurrently using one or more similar processes during forming the plurality of integrated circuit chip structures. The method includes forming a first contact structure and a second contact structure. The first contact structure is coupled to a first MOS device in the plurality of MOS devices and the second contact structure is coupled to an Nth MOS device in the plurality of MOS devices, where N is an integer greater than 1.

Abstract: A waveguide of a multi-layer metal structure and a manufacturing method thereof are provided, the method including applying a plurality of metal layers on a substrate and a plurality of insulating layers respectively between the respective metal layers. Accordingly, it is possible to minimize conductive loss by dispersing current uniformly through wide regions between a signal line and ground lines.

Abstract: A method for fabricating test structures on a wafer for integrated circuits. The method includes providing a semiconductor substrate, e.g., silicon wafer. The method includes forming a plurality of integrated circuit chip structures on the semiconductor substrate and forming a plurality of MOS devices on a scribe line formed between a first group and a second group of integrated circuit chip structures concurrently using one or more similar processes during forming the plurality of integrated circuit chip structures. The method includes forming a first contact structure and a second contact structure. The first contact structure is coupled to a first MOS device in the plurality of MOS devices and the second contact structure is coupled to an Nth MOS device in the plurality of MOS devices, where N is an integer greater than 1.

Abstract: A method for fabricating test structures on a wafer for integrated circuits. The method includes providing a semiconductor substrate, e.g., silicon wafer. The method includes forming a plurality of integrated circuit chip structures on the semiconductor substrate and forming a plurality of MOS devices on a scribe line formed between a first group and a second group of integrated circuit chip structures concurrently using one or more similar processes during forming the plurality of integrated circuit chip structures. The method includes forming a first contact structure and a second contact structure. The first contact structure is coupled to a first MOS device in the plurality of MOS devices and the second contact structure is coupled to an Nth MOS device in the plurality of MOS devices, where N is an integer greater than 1.

Abstract: Provided herein is a cancer detection and treatment instrument comprising: a first conductive plate; a second conductive plate which is opposed to the first conductive plate and has a first opening; a first signal line disposed between the first conductive plate and the second conductive plate; a first contact member of which one end is exposed through the first opening and of which the other end is connected to the first signal line; a dielectric portion filled between the first and second conductive plates and the first signal line; and a conductive layer surrounding both side surfaces and a front end surface of the dielectric portion which are exposed. Therefore, it is possible to accurately detect cancer by the use of the ultrahigh-frequency signal and to treat a diseased portion without damaging tissues around the diseased portion.

Abstract: A method for fabricating test structures on a wafer for integrated circuits. The method includes providing a semiconductor substrate, e.g., silicon wafer. The method includes forming a plurality of integrated circuit chip structures on the semiconductor substrate and forming a plurality of MOS devices on a scribe line formed between a first group and a second group of integrated circuit chip structures concurrently using one or more similar processes during forming the plurality of integrated circuit chip structures. The method includes forming a first contact structure and a second contact structure. The first contact structure is coupled to a first MOS device in the plurality of MOS devices and the second contact structure is coupled to an Nth MOS device in the plurality of MOS devices, where N is an integer greater than 1.

Abstract: A gateway enables mutual data communication between two or more networks by connecting the networks and forming a bypass path between the two networks to enable data communication therebetween when the gateway does not support a normal data communication mode. The gateway can form at least one physical communication path between the networks through the gateway even if the gateway cannot support a normal communication mode and/or power is interrupted to the gateway. Further, in spite of abnormal conditions, such as abnormal power supply to the gateway, if the bypass path is not formed, a user can compulsorily form the bypass path, thus improving reliability of a network system.

Abstract: The present invention relates to a beam steering system. The system includes an array of a plurality of antenna elements, each antenna element being electrically and mechanically controlled for steering a beam in a specific direction, and a millimeter wave subsystem quasi-optically integrated with a 3-dimensional beam steering device and an MMIC-type active circuit. The antenna element is controlled in real time by an electrical driving method so as to be moved in 2-dimensional space. That is, in the 3-dimensional system of the present invention, the beam is electrically controlled by a phase shifter, and each antenna element is physically moved by a mechanical driving mechanism. The 3-dimensional beam steering antenna and the associated devices are monolithically integrated on a substrate using MEMS technology, and the active circuit elements such as a mixer, a power amplifier (PA), a low noise amplifier (LNA), a VCO, etc. are integrated in an MMIC active array.

Abstract: The present invention is concerning an element antenna to construct an efficient antenna system, which is able to control mechanical movement of micro-strip patch antenna and to control electrical phase of signal. The movement of an element antenna is come from movement of a platform on which the element antenna is formed. The platform is made of dielectric material and able to move independently from base. The element antenna can be controlled to any direction. An antenna patch has magnetic material layer such as nickel on the backside. The antenna patch is driven by magnetic force.

Abstract: A gateway enables mutual data communication between two or more networks by connecting the networks and forming a bypass path between the two networks to enable data communication therebetween when the gateway does not support a normal data communication mode. The gateway can form at least one physical communication path between the networks through the gateway even if the gateway cannot support a normal communication mode and/or power is interrupted to the gateway. Further, in spite of abnormal conditions, such as abnormal power supply to the gateway, if the bypass path is not formed, a user can compulsorily form the bypass path, thus improving reliability of a network system.