Abstract: A greenhouse-linked air conditioning system includes a first greenhouse through which sunlight is transmitted and in which plants are grown, a second greenhouse through which sunlight is not transmitted and in which plants are grown, an indoor space excluding the first and second greenhouses in a building, a sunlight panel formed outside the first greenhouse and generating power using the sunlight, an auxiliary light source connected to the sunlight panel to provide light to the second greenhouse, and an air conditioning unit configured to connect the first and second greenhouses and the indoor space and selectively exchange air, humidity, and energy between the first and second greenhouses and the indoor space.

Abstract: An electronic device includes: a fingerprint input unit located in one area of the electronic device to receive a fingerprint of a user; and a controller configured to control a display unit to display information on a fingerprint registration progress situation in correspondence to a plurality of fingerprints that are sequentially input to the fingerprint input unit, determine whether a fingerprint of the user is to be registered according to the fingerprint registration progress situation information, and register a fingerprint of the user by using at least some of the plurality of fingerprints. A fingerprint registration progress situation can be identified when a fingerprint is registered.

Abstract: An electronic device includes: a fingerprint input unit located in one area of the electronic device to receive a fingerprint of a user; and a controller configured to control a display unit to display information on a fingerprint registration progress situation in correspondence to a plurality of fingerprints that are sequentially input to the fingerprint input unit, determine whether a fingerprint of the user is to be registered according to the fingerprint registration progress situation information, and register a fingerprint of the user by using at least some of the plurality of fingerprints. A fingerprint registration progress situation can be identified when a fingerprint is registered.

Abstract: An electronic device includes: a fingerprint input unit located in one area of the electronic device to receive a fingerprint of a user; and a controller configured to control a display unit to display information on a fingerprint registration progress situation in correspondence to a plurality of fingerprints that are sequentially input to the fingerprint input unit, determine whether a fingerprint of the user is to be registered according to the fingerprint registration progress situation information, and register a fingerprint of the user by using at least some of the plurality of fingerprints. A fingerprint registration progress situation can be identified when a fingerprint is registered.

Abstract: An electronic device includes: a fingerprint input unit located in one area of the electronic device to receive a fingerprint of a user; and a controller configured to control a display unit to display information on a fingerprint registration progress situation in correspondence to a plurality of fingerprints that are sequentially input to the fingerprint input unit, determine whether a fingerprint of the user is to be registered according to the fingerprint registration progress situation information, and register a fingerprint of the user by using at least some of the plurality of fingerprints. A fingerprint registration progress situation can be identified when a fingerprint is registered.

Abstract: An electronic device includes: a fingerprint input unit located in one area of the electronic device to receive a fingerprint of a user; and a controller configured to control a display unit to display information on a fingerprint registration progress situation in correspondence to a plurality of fingerprints that are sequentially input to the fingerprint input unit, determine whether a fingerprint of the user is to be registered according to the fingerprint registration progress situation information, and register a fingerprint of the user by using at least some of the plurality of fingerprints. A fingerprint registration progress situation can be identified when a fingerprint is registered.

Abstract: An electronic device includes: a fingerprint input unit located in one area of the electronic device to receive a fingerprint of a user; and a controller configured to control a display unit to display information on a fingerprint registration progress situation in correspondence to a plurality of fingerprints that are sequentially input to the fingerprint input unit, determine whether a fingerprint of the user is to be registered according to the fingerprint registration progress situation information, and register a fingerprint of the user by using at least some of the plurality of fingerprints. A fingerprint registration progress situation can be identified when a fingerprint is registered.

Abstract: An electronic device includes: a fingerprint input unit located in one area of the electronic device to receive a fingerprint of a user; and a controller configured to control a display unit to display information on a fingerprint registration progress situation in correspondence to a plurality of fingerprints that are sequentially input to the fingerprint input unit, determine whether a fingerprint of the user is to be registered according to the fingerprint registration progress situation information, and register a fingerprint of the user by using at least some of the plurality of fingerprints. A fingerprint registration progress situation can be identified when a fingerprint is registered.

Abstract: There is provided a power module package. The power module package includes: a base substrate provided with a pattern; a heat spreader formed by being stacked on an upper surface of the base substrate; and at least one first semiconductor device mounted on an upper surface of the heat spreader, wherein an outer circumferential surface of the heat spreader is provided with a coil.

Abstract: Disclosed herein is an all-in-one power semiconductor module including a plurality of first semiconductor devices formed on a substrate; a housing molded and formed to include bridges formed across upper portions of the plurality of first semiconductor devices; and a plurality of lead members integrally formed with the housing and electrically connecting the plurality of first semiconductor devices and the substrate. According to the present invention, reliability can be improved by increasing bonding areas and bonding strength of semiconductor devices as well as processibilty can be enhanced and failure is reduced by adjusting a step difference with respect to an arrangement and height of the semiconductor devices. Further, a processing time resulting from an omission of a wire bonding process is reduced.

Abstract: Disclosed herein is a power semiconductor module. The power semiconductor module includes: a printed circuit board (PCB); first and second heat spreaders mounted on the PCB and having one surface arranged with terminal slots; power devices mounted on the first heat spreader and connected to one another in parallel and electrically connected to the second heat spreader; and first and second terminals provided with protrusion inserted into the terminal slots and provided with connection terminals for connecting external terminals. Therefore, it is possible to improve heat radiating properties of the power semiconductor module and improve a reliability problem such as solder crack or delamination in connection with terminal connection.

Abstract: An electronic device includes: a fingerprint input unit located in one area of the electronic device to receive a fingerprint of a user; and a controller configured to control a display unit to display information on a fingerprint registration progress situation in correspondence to a plurality of fingerprints that are sequentially input to the fingerprint input unit, determine whether a fingerprint of the user is to be registered according to the fingerprint registration progress situation information, and register a fingerprint of the user by using at least some of the plurality of fingerprints. A fingerprint registration progress situation can be identified when a fingerprint is registered.

Abstract: A heat radiation sheet for a board including: composite fillers including metal particles and ceramic particles disposed on surfaces of the metal particles; and a base resin, and a manufacturing method of a heat radiation sheet for a board may include: preparing metal particles and ceramic particles; disposing the ceramic particles on surfaces of the metal particles by mixing the metal particles and the ceramic particles with each other; forming oxidized layers on exposed surfaces of the metal particles; and forming a prepreg by mixing composite fillers including the metal particles and the ceramic particles and a base resin with each other.

Abstract: Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one surface of the first substrate; a third substrate contacting one side of the other surface of the first substrate; a first lead frame contacting the other side of the other surface of the first substrate; and a second lead frame electrically connected to the third substrate.

Abstract: Disclosed herein are a power module package and a method of manufacturing the same. According to a preferred embodiment of the present invention, the power module package includes: a lead frame on which a power device and a control IC electrically connected to the power device and controlling the power device are mounted; and a thermal sheet bonded to one surface of the lead frame, wherein the thermal sheet includes first and second resin layers which include a thermal conductive inorganic filler and are added with a mixture of phenyl glycidyl ether (PGE) and alkyl glycidyl ether (Alkyl (C12 to C14) glycidyl ether), and a thermal spreader of a metal material disposed at a bonded interface which is formed between the first and second resin layers. Therefore, it is possible to easily improve a thermal property of the power module package by a thermal spreading effect due to the thermal spreader.

Abstract: There is provided a power module package. The power module package includes: a base substrate provided with a pattern; a heat spreader formed by being stacked on an upper surface of the base substrate; and at least one first semiconductor device mounted on an upper surface of the heat spreader, wherein an outer circumferential surface of the heat spreader is provided with a coil.

Abstract: There is provided a semiconductor module package including: a base substrate formed by mounting one or more first semiconductor devices thereon; a lead frame formed to have an end portion of one side connected to the base substrate and an end portion of the other side protruded to the outside; a supporting frame formed on a top surface of the first semiconductor device and having a first adjusting member formed to protrude to a lower portion thereof; and a mold part sealing the base substrate, the lead frame, and a portion of the supporting frame, wherein one or more of the first semiconductor devices are formed to have different steps from each other.

Abstract: Disclosed herein are a power module package and a method of manufacturing the same. According to a preferred embodiment of the present invention, the power module package includes: a lead frame on which a power device and a control IC electrically connected to the power device and controlling the power device are mounted; and a thermal sheet bonded to one surface of the lead frame, wherein the thermal sheet includes first and second resin layers which include a thermal conductive inorganic filler and are added with a mixture of phenyl glycidyl ether (PGE) and alkyl glycidyl ether (Alkyl (C12 to C14) glycidyl ether), and a thermal spreader of a metal material disposed at a bonded interface which is formed between the first and second resin layers. Therefore, it is possible to easily improve a thermal property of the power module package by a thermal spreading effect due to the thermal spreader.

Abstract: Disclosed herein is a power semiconductor module. The power semiconductor module includes: a printed circuit board (PCB); first and second heat spreaders mounted on the PCB and having one surface arranged with terminal slots; power devices mounted on the first heat spreader and connected to one another in parallel and electrically connected to the second heat spreader; and first and second terminals provided with protrusion inserted into the terminal slots and provided with connection terminals for connecting external terminals. Therefore, it is possible to improve heat radiating properties of the power semiconductor module and improve a reliability problem such as solder crack or delamination in connection with terminal connection.

Abstract: Disclosed herein is a power semiconductor module including a module housing comprising an accommodation space formed therein and fixing portions formed on an external surface thereof, a printed circuit board included in the module housing, exposed through the accommodation space, and comprising circuit patterns (Cu patterns) on which power devices are arranged, and a terminal fixedly coupled to the fixing portion, and comprising an input end for receiving power and leads adhered to a circuit pattern between the power devices and for distribution of supplied current. Accordingly, stray inductance may be effectively reduced, and thus, current distribution between power devices may be balanced, thereby effectively preventing a surge voltage from increasing.