Abstract: Provided are an auxiliary alloy casting piece, a high-remanence and high-coercive force NdFeB permanent magnet, and preparation methods thereof. The method for preparing the auxiliary alloy casting piece includes the following steps: providing an auxiliary alloy material including, by mass percentage, 40% to 45% of Pr, 1% to 2% of Co, 0.5% to 1% of Ga, 0.6% to 0.8% of B, 0.1% to 0.2% of V, 0.3% to 0.7% of Ti, and a balance of Fe; smelting the auxiliary alloy material to obtain a smelted material; and subjecting the smelted material to a quick-setting casting to obtain the auxiliary alloy casting piece; where the quick-setting casting includes a refining and a casting in sequence.

Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.

Abstract: Embodiments of the present invention disclose a magnetic resonance system and a power supply device for the magnetic resonance system, the device including: a DC power source; a full-bridge circuit coupled to the DC power source and having a first bridge arm and a second bridge arm, the full-bridge circuit being used to output a periodic voltage signal through the first bridge arm and the second bridge arm; a resonant circuit, having a symmetrical circuit structure, two symmetric input terminals thereof being connected to the first bridge arm and the second bridge arm, respectively, so as to receive the periodic voltage signal; and a boost circuit, connected to two symmetric output terminals of the resonant circuit so as to receive the periodic voltage signal modulated by the resonant circuit, the boost circuit being used to provide a boosted voltage, and the boosted voltage having an amplitude greater than the amplitude of the periodic voltage signal.

Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.

Abstract: Semiconductor devices and methods of manufacturing the semiconductor devices are presented. In embodiments the methods of manufacturing include depositing a first bonding layer on a first substrate, wherein the first substrate comprises a semiconductor substrate and a metallization layer. The first bonding layer and the semiconductor substrate are patterned to form first openings. A second substrate is bonded to the first substrate. After the bonding the second substrate, the second substrate is patterned to form second openings, at least one of the second openings exposing at least one of the first openings. After the patterning the second substrate, a third substrate is bonded to the second substrate, and after the bonding the third substrate, the third substrate is patterned to form third openings, at least one of the third openings exposing at least one of the second openings.

Abstract: The present application discloses a power supply redundancy control system for a GPU server, comprising a power supply redundancy module, a BMC, a CPLD and a GPU module. The power supply redundancy module comprises a first PSU and a second PSU, and the GPU module comprises several GPUs, the first PSU is connected to the CPLD by means of a first bus. The second PSU is connected to the CPLD by means of a second bus. The BMC is connected to the CPLD by means of a first I2C bus and a second I2C bus, and sends heartbeat information to the CPLD. The CPLD is connected to the BMC by means of a third bus and a fourth bus, and the CPLD is connected to the several GPUs by means of a third I2C bus. In the present application, when the BMC is abnormalous or restarted, the CPLD can control the overall power consumption of the server, and can also ensure that the server will not go down, reducing the loss brought to a user due to the BMC being abnormalous or restarted.

Abstract: A semiconductor structure including a substrate, a first dielectric layer disposed on the substrate, a second dielectric layer disposed on the first dielectric layer and in physical contact with the first dielectric layer, an opening on the substrate and having a lower portion through the first dielectric layer and an upper portion through the second dielectric layer, an conductive layer disposed on the second dielectric layer at two sides of the opening and in physical contact with the second dielectric layer, a contact structure disposed in the lower portion of the opening, and a passivation layer covering a top surface of the contact structure, a sidewall of the second dielectric layer, and a sidewall of the conductive layer.

Abstract: A communication receiver includes a first signal processing circuit and a second signal processing circuit. The first signal processing circuit includes a first feedforward equalizer and a decision circuit. The first feedforward equalizer processes a received signal to generate a first equalized signal. The decision circuit performs hard decision upon the first equalized signal to generate a first symbol decision signal. The second signal processing circuit includes a second feedforward equalizer, a decision feedforward equalizer, and a first decision feedback equalizer. The second feedforward equalizer processes the first equalized signal to generate a second equalized signal. The decision feedforward equalizer processes the first symbol decision signal to generate a third equalized signal. The first decision feedback equalizer generates a second symbol decision signal according to the second equalized signal and the third equalized signal.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: A display module (10) includes: a display panel (12) and a circuit board (14) coupled to the display panel (12). The display panel (12) includes a driving chip (122) and a display unit (124); and the circuit board (14) includes a first filter element (142), wherein the first filter element (142) is coupled to the driving chip (122) and the display unit (124), and a direct current signal output by the driving chip (122) is filtered by the first filter element (142) and then transmitted to the display unit (124). The present disclosure also provides a display apparatus (100).

Abstract: Systems and methods are presented for inferring an embedding vector of an item of a first type into the embedding space. Upon receiving a first time for which there is no embedding vector, documents of a document corpus that include (co-occurrence) both the received item and other items of the same type are identified. Of those other items that have embedding vectors, those embedding vectors are retrieved and averaged. The resulting averaged embedding vector is established as an inferred embedding vector for the received item.

Abstract: A group of reductive 2D materials (R2D) with extended reactive vacancies and a method for making the R2D with extended reactive vacancies are provided, especially the example of the reductive boron nitride (RBN). To create defects such as vacancies, boron nitride (BN) powders are milled at cryogenic temperatures. Vacancies are produced by milling, and the vacancies can be used to reduce various metal nanostructures on RBN. Due to the thermal stability of the RBN and the enhanced catalytic performance of metal nanostructures, RBN-metals can be used for different catalysts, including electrochemical catalysts and high temperature catalysts.

Abstract: This disclosure provides an information receiving method, an information sending method, a terminal, and a network-side device. The information receiving method includes: performing SSB detection; determining, based on transmission configuration information for first information, a candidate SSB set quasi co-located with a detected first SSB, where the first information includes an SSB; and performing first processing based on the first SSB and the candidate SSB set, where the first processing includes one of the following: receiving system information scheduled by a physical control channel associated with the first SSB; performing radio link monitoring; and performing radio resource management measurement.

Abstract: Provided is an organic light-emitting diode display substrate, including: a source/drain layer, a planarization layer and an anode layer which are laminated in sequence, wherein the source/drain layer includes at least one pair of first signal lines; the anode layer includes a common power line, wherein the common power line is provided with vent holes; overlapping areas between two first signal lines in each pair of the first signal lines and a projection pattern of the vent hole are equal, the overlapping area being greater than 0, wherein the projection pattern of the vent hole is a pattern of an orthographic projection of the vent hole in the common power line on the source/drain layer. A display panel and a display device are also provided.

Abstract: A bracket and a terminal equipment are provided. The bracket is provided for a terminal device to be installed thereon and includes a bracket body, two installing elements, and at least one holding element. The two installing elements respectively protrude outward from two sides of the bracket body, and each of the two installing elements includes an engaging portion. The two installing elements are configured to be inserted into the terminal device so the terminal device is installed on the bracket, and each of the engaging portions is configured such that each of the installing elements is engaged with and retained in the terminal device. The holding element protrudes outward from the bracket body and is configured to be inserted into a loading hole of the terminal device.

Abstract: A chip package includes an application chip, a micro-electromechanical systems (MEMS) chip, a conductive element, a bonding wire, and a molding compound. The application chip has a conductive pad. The MEMS chip is located on the application chip, and includes a main body and a cap. The main body is located between the cap and the application chip. The main body has a conductive pad. The conductive element is located on the conductive pad of the main body of the MEMS chip. The bonding wire extends from the conductive element to the conductive pad of the application chip. The molding compound is located on the application chip and surrounds the MEMS chip. The conductive element and the bonding wire are located in the molding compound.

Abstract: Modified silicone rubber and a preparation method thereof are provided in the present disclosure. A composition of raw materials for preparing the modified silicone rubber may include a raw material that can form silicone rubber and a raw material that can form a modified material. The raw material that can form the silicone rubber may include a first component and a second component. The raw material that can form the modified material may include a third component and a fourth component. The preparation method of the modified silicone rubber may include mixing the composition of the raw materials for preparing the modified silicone rubber and obtaining the modified silicone rubber by curing and molding the mixture.

Abstract: A powered industrial truck includes a lateral movement assembly including four sliding members and four pivotal members both on a wheeled carriage, four links having a first end pivotably secured to the sliding member and a second end pivotably secured to either end of the pivotal member, a motor shaft having two ends pivotably secured to the pivotal members respectively, a first electric motor on one frame member, and four mounts attached to the sliding members respectively; two lift assemblies including a second electric motor, a shaft having two ends rotatably secured to the sliding members respectively, two gear trains at the ends of the shaft respectively, a first gear connected to the second electric motor, a second gear on the shaft, and a first roller chain on the first and second gears; two electric attachments on the platform and being laterally moveable, each attachment. The mount has rollers.

Abstract: A non-contact switch and a non-contact switch control system are provided. The non-contact switch control system includes multiple non-contact switches, each including an infrared light module, a brightness sensing unit, a second switch module and a processing unit. The infrared light module includes a first switch module, transmitting unit and receiving unit. The first switch module has a first switch state. The transmitting unit connected to the first switch module emits infrared light according to the first switch state. The receiving unit receives a reflected light of the infrared light. The brightness sensing unit generates brightness information according to an ambient light. The second switch module has a second switch state. The processing unit is connected with the infrared light module, the brightness sensing unit and the second switch module, and controls the second switch state according to the reflected light and the brightness information.