Abstract: A display apparatus is provided. The display apparatus includes a display module and multiple light-emitting driving circuits. Each of the light-emitting driving circuits includes a timing control circuit and a driving circuit. The timing control circuit receives multiple clock signals and a previous light-emitting timing signal to provide a light-emitting timing signal and an internal voltage. The driving circuit receives a first phase signal among multiple phase signals and the internal voltage to provide a light-emitting driving signal to the display module based on the first phase signal and the internal voltage. The phase signals all present disabled levels during a vertical blank period.

Abstract: A method includes forming a dummy component, including: forming through-substrate vias (TSVs) in a substrate; forming a thermal structure over the TSVs, wherein the thermal structure includes metal lines in dielectric layers; forming a bonding layer over the thermal structure; and forming bond pads within the bonding layer; bonding the dummy component to a package component; and bonding a semiconductor die to the package component.

Abstract: A manufacturing method of a semiconductor package includes the following steps. A first lower semiconductor device and a second lower semiconductor device are provided. A plurality of first conductive pillars are formed on the first lower semiconductor device along a first direction parallel to a side of the first lower semiconductor device. A plurality of second conductive pillars are formed on the second lower semiconductor device along a second direction parallel to a side of the second lower semiconductor device, wherein the first direction is substantially collinear with the second direction. An upper semiconductor device is disposed on the first lower semiconductor device and the second lower semiconductor device and revealing a portion where the plurality of first conductive pillars and the plurality of second conductive pillars are disposed.

Abstract: A thermal power budget optimization method includes acquiring sensor log information from a plurality of sensors of a heating device, generating a virtual surface temperature of the heating device according to the sensor log information, setting a target surface temperature of the heating device, and dynamically adjusting a thermal power budget of the heating device according to the virtual surface temperature and the target surface temperature over time.

Abstract: An Oncidium plant extract and methods for treating diabetes mellitus, liver protection and preventing acute respiratory distress syndrome thereof are provided, the steps for extracting the Oncidium plant extract include taking an Oncidium plant sample, drying and grinding the sample to obtain a ground Oncidium plant sample, and then extracting the ground Oncidium plant sample in a solvent by an accelerated solvent extraction or an ultrasonic extraction to obtain an Oncidium plant extract.

Abstract: An electronic device includes a substrate, an electronic component, a first interposing layer and a second interposing layer. The substrate is non-planar and the substrate includes a first substrate pad and a second substrate pad. The electronic component includes a first component pad and a second component pad corresponding to the first substrate pad and the second substrate pad respectively. When the first component pad contacts the first substrate pad, a height difference exists between the second component pad and the second substrate pad. The first interposing layer connects between the first component pad and the first substrate pad. The second interposing layer connects between the second component pad and the second substrate pad. A thickness difference between the first interposing layer and the second interposing layer is 0.5 to 1 time the height difference.

Abstract: A light-emitting diode includes a semiconductor light-emitting stack and a distributed Bragg reflector (DBR) structure. The semiconductor light-emitting stack has a first surface and a second surface opposite to each other. The DBR structure is disposed on one of the first surface and the second surface of the semiconductor light-emitting stack, and includes at least one set of light-transmitting layers including at least two of the light-transmitting layers which have different refractive indices and roughened interface.

Abstract: A method for making a multi-chip package device includes: providing a lead frame unit having a plurality of lead frames, each of the lead frames having a base seat that has an upper surface and a bottom surface, and a plurality of leads; electrically attaching a transistor chip onto the base seat, the transistor chip having a plurality of electrode pads; attaching a circuit control chip to the base seat; covering the transistor chip with a main conducting part, and electrically connecting the main conducting part with at least one of the source electrode pads; electrically connecting the circuit control chip to another source electrode pad; encapsulating the transistor chip and the circuit control chip to expose a leg part; and bending the leg part that is exposed to form a planar conducting portion having a bottom surface coplanar with the bottom surface of the base seat.

Abstract: A multi-chip package device includes a lead frame, a transistor chip, a metallic frame, a circuit control chip, and an encapsulation layer. The lead frame has a base seat, and a plurality of leads. The transistor chip is disposed on the base seat, and includes a plurality of source electrode pads, a gate electrode and a drain electrode. The metallic frame has a main conducting part and a conducting leg having a first conducting section and a second conducting section. The circuit control chip is disposed on the base seat and electrically connected to the transistor chip and the leads. The encapsulation layer envelops the lead frame, the transistor chip, the main conducting part, the first conducting section, and the circuit control chip to expose the second conducting section of the conducting leg.

Abstract: A preformed unit of a fan-out chip-embedded packaging process and an application manufacturing method thereof include: preforming integrated circuit dies into implementation units including chips different in thickness and equipped with electrically conductive pillars of different heights respectively, each chip and the respective electrically conductive pillars being covered by an insulating gel to become the preformed unit; using a carrier to form carrying regions for the preformed units; forming an insulating layer to seal the preformed units; grinding to expose the electrically conductive pillars; arranging wires to connect each electrically conductive pillar with the adjacent chip; forming an insulating layer to cover the wires and making exposing guiding holes, accomplishing a frontside packaging process; removing the carrier to accomplish singulation. It may add another backside packaging process.

Abstract: Disclosed herein is a method of treating diseases and/or disorders associated with the dysregulated activation and recruitment of neutrophils. The method includes administering to a subject in need thereof an effective amount of an extract of Bletilla formosana. The Bletilla formosana extract includes, at least, compounds of 3,3?-dihydroxy-5-methoxybibenzyl (Batatacin III), 9,10-dihydro-1-[(4-hydroxyphenyl)methyl]-4-methoxy-2,7-phenanthrenediol (Orchidble), 3?,5-dimethoxy-3-hydroxybibenzyl (BF8-4-2), 3,5-dimethoxy-3?-hydroxybibenzyl (BF8-4-3) and 3-hydroxy-5-methoxybibenzyl (BF8-4-4).

Abstract: A frame rate control method is provided. A primary scenario and a non-primary scenario are identified according to two or more windows displayed on a screen. Each of the primary scenario and the non-primary scenario is performed by an individual application. A frame rate of the non-primary scenario is decreased when a performance index indicates that a first condition is present. The application corresponding to the non-primary scenario is disabled when the performance index indicates that a second condition is present after decreasing the frame rate of the non-primary scenario, so as to remove the window corresponding to the non-primary scenario from the screen.

Abstract: The present invention relates to a method for producing recombinant human prethrombin-2 protein and having human ?-thrombin activity by the plant-based expression systems.

Abstract: Synthetic amino acid-modified polymers and methods of making the same and using the same are disclosed. The synthetic amino acid-modified polymers possess distinct thermosensitive, improved water-erosion resistant, and enhanced mechanical properties, and are suitable of reducing or preventing formation of postoperative tissue adhesions. Additionally, the amino acid-modified polymers can also be used as a vector to deliver pharmaceutically active agents.

Abstract: The present invention relates to a method for producing recombinant human prethrombin-2 protein and having human ?-thrombin activity by the plant-based expression systems.

Abstract: The present invention relates to a coral composite extract, a composition including the same and a method of producing the same. The coral composite extract includes at least two briarane-type diterpenoid compounds from corals of Briareum violaceum, B. excavatum and B. stechei, thereby being applied as an effective ingredient of a skin external use composition, a cosmetic composition and a medicinal composition.

Abstract: A method for promoting chronic wound healing is provided, including administering an effective amount of Bletilla formosana (Hayata) Schltr. extract to a subject in need thereof, wherein the effective amount of Bletilla formosana (Hayata) Schltr. extract is 0.01 mg/kg-body weight to 100 mg/kg-body weight, and wherein the chronic wound including diabetic wound and Diabetic Foot Ulcer.

Abstract: Synthetic amino acid-modified polymers and methods of making the same and using the same are disclosed. The synthetic amino acid-modified polymers possess distinct thermosensitive, improved water-erosion resistant, and enhanced mechanical properties, and are suitable of reducing or preventing formation of postoperative tissue adhesions. Additionally, the amino acid-modified polymers can also be used as a vector to deliver pharmaceutically active agents.

Abstract: The present invention relates to a composition comprising an amino acid-modified polymer, a carboxypolysaccharide, and may further include a metal ion for anti-adhesion and vector application. More specifically, the invention relates to a thermosensitive composition having enhanced mechanical and improved water-erosion resistant properties for efficiently preventing tissue adhesions and can serve as a vector with bio-compatible, bio-degradable/absorbable, and in-vivo sustainable properties.

Abstract: A biometric monitoring device for an animal ear includes a male portion on a first side of the ear including a base having an upper surface towards the first side including openings and a protrusion having an upper portion for penetrating from the first side a second side of the ear, and a female portion for the second side of the ear including a housing having a bottom surface towards the second side of the ear including an internal opening configured to receive the upper portion of the protrusion, a retention portion configured to releasably retain the upper portion of the protrusion, a plurality of electronic components including a battery, a processor, and a temperature sensor, and a thermally conductive ring disposed upon on the bottom surface configured to be disposed against the second side, and wherein the thermally conductive ring is thermally coupled to the temperature sensor.