Abstract: A method of manufacturing common mode filter having heterogeneous laminates, the method includes steps of providing a nonmagnetic insulating substrate; forming a magnetic layer; forming a first lead; forming a first insulating layer; forming a first through hole; forming a first coil; forming a second insulating layer; forming a second coil; forming a third insulating layer; forming a second through hole; forming a second lead; forming a fourth insulating layer; and depositing a first magnetic material.

Abstract: An optical device includes a gallium nitride substrate member having an m-plane nonpolar crystalline surface region characterized by an orientation of about ?1 degree towards (000-1) and less than about +/?0.3 degrees towards (11-20). The device also has a laser stripe region formed overlying a portion of the m-plane nonpolar crystalline orientation surface region. In a preferred embodiment, the laser stripe region is characterized by a cavity orientation that is substantially parallel to the c-direction, the laser stripe region having a first end and a second end. The device includes a first cleaved c-face facet, which is coated, provided on the first end of the laser stripe region. The device also has a second cleaved c-face facet, which is exposed, provided on the second end of the laser stripe region.

Abstract: A common mode filter with a multi-spiral layer structure includes a first coil, a first insulating layer, a second coil, a second insulating layer, a third coil, a third insulating layer, and a fourth coil, wherein the first coil serially connects with the fourth coil, and the second coil serially connects with the third coil. A first conductive pillar is configured to connect the first coil and the fourth coil, and a second conductive pillar is configured to connect the second coil and the third coil, wherein the first conductive pillar and the second conductive pillar are internally diagonally disposed relatively within a corner or the same side of corners of the rectangular spiral.

Abstract: A method and device for emitting electromagnetic radiation using semipolar or nonpolar gallium containing substrates is described where the backside of the substrate includes multiple scribes that reduce stray light leaking.

Abstract: A wide-band common mode filtering apparatus includes at least two cascaded common mode filters with different noise-filtering responses, wherein the cut-off frequency of the wide-band common mode filtering apparatus is at the lowest cut-off frequency of the common mode filters, and the noise-filtering response of the wide-band common mode filtering apparatus is the superposition of the noise-filtering responses of the common mode filters. In one embodiment of the present invention, the wide-band common mode filtering apparatus includes a first common mode filter having a first filtering band, and a second common mode filter having a second filtering band different from the first filtering band. The disclosure of the present technique allows the cascaded common mode filters with different filtering bands to form the wide-band common mode filtering apparatus having an overall filtering band to meeting a new demand.

Abstract: A system and method for providing laser diodes with broad spectrum is described. GaN-based laser diodes with broad or multi-peaked spectral output operating are obtained in various configurations by having a single laser diode device generating multiple-peak spectral outputs, operate in superluminescene mode, or by use of an RF source and/or a feedback signal. In some other embodiments, multi-peak outputs are achieved by having multiple laser devices output different lasers at different wavelengths.

Abstract: An over-voltage protection device includes a substrate, an insulation layer having a depression over the substrate, a conductor layer having a first electrode and a second electrode over the insulation layer, wherein the first electrode and the second electrode form a discharge path, and the depression is under the discharge path. A method for preparing the over-voltage protection device includes the steps of forming an insulation layer over a substrate; forming a depression in the insulation layer; forming a photoresist pattern filling the depression and protruding the insulation layer; forming a conductor layer over the insulation layer; and removing the photoresist pattern, wherein the photoresist pattern divides the conductor layer into a first electrode and a second electrode that form a discharge path, and the depression is under the discharge path after the removal of the photoresist pattern.

Abstract: An optical device includes a gallium nitride substrate member having an m-plane nonpolar crystalline surface region characterized by an orientation of about ?1 degree towards (000-1) and less than about +/?0.3 degrees towards (11-20). The device also has a laser stripe region formed overlying a portion of the m-plane nonpolar crystalline orientation surface region. In a preferred embodiment, the laser stripe region is characterized by a cavity orientation that is substantially parallel to the c-direction, the laser stripe region having a first end and a second end. The device includes a first cleaved c-face facet, which is coated, provided on the first end of the laser stripe region. The device also has a second cleaved c-face facet, which is exposed, provided on the second end of the laser stripe region.

Abstract: A tunable antenna including a first radiating element, a second radiating element, a connection circuit and a switch circuit is provided. The first radiating element includes a coupling portion and a first feeding portion. The second radiating element includes a second feeding portion, a grounding portion and a radiation portion. The grounding portion is electrically connected to a ground plane, and the radiation portion surrounds the coupling portion to form a first coupling gap and the second coupling gap. The connection circuit is electrically connected to the radiation portion and a state of the connection circuit is changed according to a control signal, so as to adjust a length of the resonant path of the radiation portion. A feeding signal is transmitted to the first feeding portion or the second feeding portion by the switch circuit.

Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.

Abstract: A common mode filter includes a first coil, a second coil, a first insulating layer separating the first coil from the second coil, a third coil serially connected with the first coil, a second insulating layer separating the second coil from the third coil, a fourth coil serially connected with the second coil, and a third insulating layer separating the third coil from the fourth coil. The second coil is between the first and third coils, and the third coil is between the second and fourth coils. At least one of the first insulating layer, the second insulating layer and the third insulating layer may include magnetic material.

Abstract: A common mode filter with a multi-spiral layer structure includes a first coil, a first insulating layer, a second coil, a second insulating layer, a third coil, a third insulating layer, and a fourth coil, wherein the first coil serially connects with the fourth coil, and the second coil serially connects with the third coil. A first conductive pillar is configured to connect the first coil and the fourth coil, and a second conductive pillar is configured to connect the second coil and the third coil, wherein the first conductive pillar and the second conductive pillar are internally diagonally disposed relatively within a corner or the same side of corners of the rectangular spiral.

Abstract: An electronic structure includes a substrate body, an electronic package structure and a conductive unit. The electronic package structure is disposed on the substrate body. The electronic package structure includes a first inner electrode portion, a second inner electrode portion, a first outer electrode portion electrically connected to the first inner electrode portion, and a second outer electrode portion electrically connected to the second inner electrode portion. The conductive unit includes a first conductive body and a second conductive body respectively electrically contacting the first and the second outer electrode portions. The electronic package structure has a first notch and a second notch, the first outer electrode portion is extended into the first notch to contact the top surface of the first inner electrode portion, and the second outer electrode portion is extended into the second notch to contact the top surface of the second inner electrode portion.

Abstract: An over-voltage protection device includes a substrate, an insulation layer having a depression over the substrate, a conductor layer having a first electrode and a second electrode over the insulation layer, wherein the first electrode and the second electrode form a discharge path, and the depression is under the discharge path. A method for preparing the over-voltage protection device includes the steps of forming an insulation layer over a substrate; forming a depression in the insulation layer; forming a photoresist pattern filling the depression and protruding the insulation layer; forming a conductor layer over the insulation layer; and removing the photoresist pattern, wherein the photoresist pattern divides the conductor layer into a first electrode and a second electrode that form a discharge path, and the depression is under the discharge path after the removal of the photoresist pattern.

Abstract: A mobile communication device with a human body recognition function includes sensing pad and a sensor. The sensing pad is electrically connected to the sensor. When a target object approaches the mobile communication device, an induction signal is generated between the sensing pad and the target object. The sensor receives the induction signal, and the sensor includes a first sensitivity and a second sensitivity. When no target object approaches the mobile communication device, the sensor is set at the first sensitivity. When the sensor receives the induction signal, the first sensitivity is switched to the second sensitivity. The induction signal is converted into a first signal and the first sensitivity is compared with a default value. If the first signal is greater than the default value, the target object is determined as a human body and a power adjustment unit is adjusted to reduce an output power.

Abstract: A method and device for emitting electromagnetic radiation using semipolar or nonpolar gallium containing substrates is described where the backside of the substrate includes multiple scribes that reduce stray light leaking.

Abstract: A multifunction semiconductor package structure includes a substrate unit, a circuit unit, a support unit, a semiconductor unit, a package unit and an electrode unit. The substrate unit includes a substrate body and a first electronic element having a plurality of conductive contact portions. The circuit unit includes a plurality of first conductive layers disposed on the substrate body. The semiconductor unit includes a plurality of second electronic elements. Each second electronic element is electrically connected between two corresponding first conductive layers. The package unit includes a package body disposed on the substrate body to enclose the second electronic elements. The electrode unit includes a plurality of top electrodes, a plurality of bottom electrodes, and a plurality of lateral electrodes electrically connected between the top electrodes and the bottom electrodes.

Abstract: An optical device includes a gallium nitride substrate member having an m-plane nonpolar crystalline surface region characterized by an orientation of about ?1 degree towards (000-1) and less than about +/?0.3 degrees towards (11-20). The device also has a laser stripe region formed overlying a portion of the m-plane nonpolar crystalline orientation surface region. In a preferred embodiment, the laser stripe region is characterized by a cavity orientation that is substantially parallel to the c-direction, the laser stripe region having a first end and a second end. The device includes a first cleaved c-face facet, which is coated, provided on the first end of the laser stripe region. The device also has a second cleaved c-face facet, which is exposed, provided on the second end of the laser stripe region.

Abstract: A system and method for providing laser diodes with broad spectrum is described. GaN-based laser diodes with broad or multi-peaked spectral output operating are obtained in various configurations by having a single laser diode device generating multiple-peak spectral outputs, operate in superluminescene mode, or by use of an RF source and/or a feedback signal. In some other embodiments, multi-peak outputs are achieved by having multiple laser devices output different lasers at different wavelengths.

Abstract: A semiconductor package structure includes a chip unit, a package unit and an electrode unit. The chip unit includes at least one semiconductor chip. The semiconductor chip has an upper surface, a lower surface, and a surrounding peripheral surface connected between the upper and the lower surfaces, and the semiconductor chip has a first conductive pad and a second conductive pad disposed on the lower surface thereof. The package unit includes a package body covering the upper surface and the surrounding peripheral surface of the semiconductor chip. The package body has a first lateral portion and a second lateral portion respectively formed on two opposite lateral sides thereof. The electrode unit includes a first electrode structure covering the first lateral portion and a second electrode structure covering the second lateral portion. The first and the second electrode structures respectively electrically contact the first and the second conductive pads.