Abstract: Disclosed is an antenna device having a substrate, an antenna element for transceiving a wireless signal, an antenna signal feeding line for feeding the wireless signal, and an ion-implanted resonant pattern, which includes a first coupling pattern implanted in the substrate by an Ion-implantation process and a second coupling pattern formed at a position corresponding to the first coupling pattern with a predetermined distance therebetween, formed at an adjacent position with respect to the antenna element. As the antenna element transceives the wireless signal of the predetermined radiation frequency and generates an induction voltage, the first coupling pattern and the second coupling pattern each generates a coupled induction voltage and a capacitance therebetween, hence forming a resonance with the antenna element.

Abstract: This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste heat generated from the chip. The cover can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this heat conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on the metal surface and also can be mixed into the metal.

Abstract: A dual-band antenna is provided, which includes a signal resonance unit, a grounding unit, a connection unit, and a signal line. The grounding unit is disposed opposite to the signal resonance unit. The connection unit has a first connection element and a second connection element, wherein one end of the first connection element is connected to the signal resonance unit and the other end of the first connection element is connected to the grounding unit, while one end of the second connection element is connected to one side of the first connection element. The signal line has a signal feeding end and a circuit connection end, wherein the signal feeding end is electrically connected to the second connection element, and the circuit connection end is electrically connected to a wireless circuit device.

Abstract: Disclosed is an antenna device arranged inside a display module of an electronic device with a conductive portion. The antenna device includes an antenna element with a ground plane and a signal feeding end for transceiving a wireless signal, an antenna signal feeding line coupled to the signal feeding end of the antenna element for feeding the wireless signal transceived by the antenna element.

Abstract: Disclosed is an antenna device for transceiving a wireless signal with an insert-molded antenna pattern embedded inside a casing of an electronic device. The insert-molded antenna pattern is connected to an antenna module of a motherboard of the electronic device in order to feed the wireless signal transceived by the insert-molded antenna pattern through an antenna signal feeding line connected to the insert-molded antenna pattern and the antenna module, or by an antenna coupling element coupled with the insert-molded antenna pattern.

Abstract: Disclosed is an antenna device arranged inside a display module of an electronic device with an anti-EMI plate. The antenna device includes an antenna element with a ground connecting end and a signal feeding end for transceiving a wireless signal, a ground connecting line coupled to the ground connecting end of the antenna element and the anti-EMI plate, and an antenna signal feeding line coupled to the signal feeding end of the antenna element for feeding the wireless signal transceived by the antenna element.

Abstract: Disclosed is an antenna device with an antenna element with a predetermined shorten length, and a resonance circuit coupled to the antenna element, having a predetermined resonance frequency for matching the shorten length of the antenna element to adaptively make the antenna element in response to and transceive a wireless signal with a predetermined frequency.

Abstract: An electronic device includes a helical resilient member serving as an electrical inductance element. The electronic device also includes an antenna, a signal feeding line, and a transmitting/receiving module. The helical resilient member has first and second ends with a predetermined number of turns of coil arranged therebetween the first and second ends, and is made of electrically conductive materials so that the turns of coil defines an electrical inductance. The signal feeding line is connected between the helical resilient member and a signal feed point of the antenna. The transmitting/receiving module is connected to the helical resilient member so as to couple the inductance of the helical resilient member to the transmitting/receiving module.

Abstract: Disclosed is an antenna device for transceiving a wireless signal. The antenna device includes an antenna element adapted to establish a radiation pattern during transceiving the wireless signal; an antenna signal feeding line coupling to the antenna element for feeding the wireless signals transceived by the antenna element; and at least one radiation pattern adjustment element arranged at an adjacent position with respect to the antenna element and within the established radiation pattern of the antenna element to adjust the radiation pattern of the antenna element.

Abstract: Disclosed is an antenna device for transceiving a wireless signal with an ion-implanted antenna pattern implanted inside a casing of an electronic device. The ion-implanted antenna pattern is connected to an antenna module of a motherboard of the electronic device in order to feed the wireless signal transceived by the ion-implanted antenna pattern, while the connection could be either by an antenna signal feeding line connected to the ion-implanted antenna pattern and the antenna module, or by an antenna coupling element coupled with the ion-implanted antenna pattern and connected to an antenna signal feeding line.

Abstract: Disclosed is an antenna device having a substrate, an antenna element for transceiving a wireless signal, an antenna signal feeding line for feeding the wireless signal, and an ion-implanted resonant pattern, which includes a first coupling pattern implanted in the substrate by an Ion-implantation process and a second coupling pattern formed at a position corresponding to the first coupling pattern with a predetermined distance therebetween, formed at an adjacent position with respect to the antenna element. As the antenna element transceives the wireless signal of the predetermined radiation frequency and generates an induction voltage, the first coupling pattern and the second coupling pattern each generates a coupled induction voltage and a capacitance therebetween, hence forming a resonance with the antenna element.

Abstract: Disclosed is a coupling antenna device for transceiving a plurality of wireless signals with multiple radiation frequencies. The coupling antenna device includes an antenna pattern having a plurality of adjacent resonating sectors, each of the resonating sectors having a length determined by a specific radiation frequency responsive to one of the wireless signals.

Abstract: This invention discloses a manufacturing method and the structure for a heat sink fin. This heat sink fin structure includes an attachment and a plurality of heat sink fins. The plurality of heat sink fins is often used in conducting the waste heat from a chip. The plurality of heat sink fins and the attachment can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity, so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on a metal surface and can be mixed into the metal.

Abstract: This invention discloses a manufacturing method and the structure for a dissipation heat pipe. The dissipation heat pipe includes a hollow closed pipe, a column, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from the chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and also can be mixed into the metal.

Abstract: This invention discloses a manufacturing method and the structure for a dissipation heat pipe. This dissipation heat pipe includes a hollow closed pipe, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from a chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity, so as to improve the heat conduction efficiency. The corresponding manufacturing method for this heat conduction material can be made by chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and can also be mixed into the metal.

Abstract: This invention discloses a chip heat dissipation system for a chip in heat dissipating and a manufacturing method and a structure of heat dissipation device. The chip heat dissipation system includes a heat dissipation device, a heat exchange device, a pump assembly device and at least two pipes. This heat dissipation device is used for receiving waste heat generate from the chip, then heat exchange device is used for discharging waste heat. Moreover, the heat exchange device is composed of a thermal conduction material, including a metal material and a bracket structure of carbon element. Also, the pipes are used for connecting at least two connection ends of the heat dissipation device and the heat exchange device and then the pump assembly device is used for circulating a fluid between the heat dissipation device and the heat exchange device by the pipes. The bracket structure of carbon element has high thermal conductivity, so as to improve the heat conduction efficiency.

Abstract: This invention discloses a process method and structure for an adhesion material. The adhesion material is employed for a heat dissipation device that includes several heat sink fins, a heat dissipation slip and a heat pipe. The heat pipe connects several heat sink fins and a heat dissipation slip by the adhesion material. The metal is combed with a bracket structure of carbon element, which has high thermal conductivity, so as to improve the heat conduction efficiency; the adhesion material can be made. The corresponding process method for the adhesion material can be made with a mode of process to form melting stuff, including the metal and a bracket structure of carbon element, and then uses a mode of draw to form the adhesion material. The bracket structure of carbon element can be mixed into the metal.

Abstract: This invention discloses a chip heat dissipation system for chip heat dissipation and a manufacturing method and structure of heat dissipation device thereof. The chip heat dissipation system includes a heat dissipation device, a heat exchange device, a pump assembly device and at least two pipes. The heat dissipation device is used for receiving a waste heat from the chip, and the heat dissipation device is composed of a thermal conduction material, including a metal material and a bracket structure of carbon element; the heat exchange device is used for discharging the waste heat; the at least two pipes are used for connecting at least two joints of the heat dissipation device and the heat exchange device; and the pump assembly device is used for circulating a fluid between the heat dissipation device and the heat exchange device by the at least two pipes. The bracket structure of carbon element has high thermal conductivity, so as to improve the heat conduction efficiency.

Abstract: This invention discloses a manufacturing method and the structure for a surface coating film on a heat dissipation metal. The surface coating film structure on the heat dissipation metal includes a heat dissipation metal and a thin film. The surface coating film structure on the heat dissipation metal is often used in dissipation the waste heat from the electronic apparatuses. The thin film is composed of a bracket structure of carbon element which has high thermal conductivity, so as to improve the efficiency of heat dissipation of the heat dissipation metal. The corresponding manufacturing method for the thin film can be made with chemical vapor deposition, physical vapor deposition or the other material preparation methods.

Abstract: A multi-layer circuit board includes first, second, third, fourth, fifth, sixth and seventh insulating substrates; first, second, third, fourth and fifth signal wiring layers; first and second ground wiring layers; and a power wiring layer. Each of the first and seventh insulating substrates has a thickness ranging from 2.5 to 6.5 mil. Each of the second, fourth and sixth insulating substrates has a thickness ranging from 3 to 9 mil. Each of the third and fifth insulating substrates has a thickness ranging from 3 to 23 mil. The first signal wiring layer has a first resistance with respect to the first ground wiring layer. The second signal wiring layer has a second resistance with respect to the first ground wiring layer and the power wiring layer. The third signal wiring layer has a third resistance with respect to the first ground wiring layer and the power wiring layer. The fourth signal wiring layer has a fourth resistance with respect to the second ground wiring layer and the power wiring layer.