Abstract: An adhesive dispenser comprises a dispensing head. The dispensing head comprises an adhesive material applicator portion on a first level of the dispensing head. The adhesive material applicator portion corresponds to a periphery of a package. The dispensing head also comprises a thermal interface material (TIM) applicator portion on a second level of the dispensing head different from the first level. The TIM applicator portion corresponds to a die of the package. The dispensing head further comprises an adhesive material conduit configured to supply the adhesive material applicator portion with an adhesive material. The dispensing head additionally comprises a TIM conduit configured to supply the TIM applicator portion with a TIM.

Abstract: An apparatus for manufacturing a semiconductor device includes a holder for holding a carrier and a supporting base for receiving the holder comprising a recess for accommodating a plurality of balls mounted on a surface of the carrier. Furthermore, a method of manufacturing a semiconductor device includes providing a carrier, providing an apparatus comprising a supporting base including a recess, holding the carrier on the supporting base and accommodating a plurality of balls mounted on a surface of the carrier in the recess.

Abstract: A semiconductor package assembly process that includes attaching one or more dies to a substrate; applying an adhesive material on a periphery of the substrate by an adhesive dispenser having a stamp-type dispensing head; applying a thermal interface material (TIM) on a top surface of the die by a TIM dispenser having a stamp-type dispensing head; and positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier to encapsulate the one or more dies.

Abstract: Methods and apparatus for alignment in a flip chip bonding. A method includes attaching an integrated circuit having connector terminals to a bonding arm, the bonding arm having a chuck for attaching the integrated circuit at the backside surface, the bonding arm having a plurality of CCD imagers mounted thereon; receiving a substrate having pads corresponding to the connector terminals; using the bonding arm, positioning the integrated circuit proximal to the substrate; aligning the integrated circuit connector terminals with the pads on the substrate using the CCD imagers on the bonding arm; positioning the connector terminals in contact with the pads on the substrate; and performing a solder reflow to attach the integrated circuit to the substrate. An apparatus includes a bonding arm with a chuck for carrying a component and CCD imagers mounted on the arm for alignment.

Abstract: Methods and apparatus for die assembly. A method includes forming a trench extending from an active surface of a semiconductor substrate comprising a plurality of integrated circuit dies having connector terminals extending from the active surface, the trench extending into, but not through, the semiconductor substrate; forming a protective layer overlying the active surface of the semiconductor substrate and the trench, and covering the lower portion of the connector terminals; opening a pre-dicing opening in the protective layer and within the trench; applying a tape over the active surface of the semiconductor wafer, the protective layer and the connector terminals; and performing an operation on a backside of the semiconductor substrate to remove material until the pre-dicing opening is exposed on the backside of the semiconductor wafer. An apparatus includes a semiconductor substrate with integrated circuits and a protective layer surrounding connector terminals of integrated circuits.

Abstract: A package on package structure providing mechanical strength and warpage control includes a first package component, a second package component, and a first set of conductive elements coupling the first package component to the second package component. A first polymer-comprising material is molded on the first package component and surrounds the first set of conductive elements. The first polymer-comprising material has an opening therein exposing a top surface of the second package component. A third package component and a second set of conductive elements couples the second package component to the third package component.

Abstract: A semiconductor package assembly process that includes attaching one or more dies to a substrate; applying an adhesive material on a periphery of the substrate by an adhesive dispenser having a stamp-type dispensing head; applying a thermal interface material (TIM) on a top surface of the die by a TIM dispenser having a stamp-type dispensing head; and positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier to encapsulate the one or more dies.

Abstract: A system for and a method of curing a material is provided. A material, such as an underfill material, is rotated during a curing process. The curing system may include a chamber, a holder to support one or more workpieces, and a rotating mechanism. The rotating mechanism rotates the workpieces during the curing process. The chamber may include one or more heat sources and fans, and may further include a controller. The curing process may include varying the rotation speed, continuously rotating, periodically rotating, or the like.

Abstract: Methods and apparatus for die assembly. A method includes forming a trench extending from an active surface of a semiconductor substrate comprising a plurality of integrated circuit dies having connector terminals extending from the active surface, the trench extending into, but not through, the semiconductor substrate; forming a protective layer overlying the active surface of the semiconductor substrate and the trench, and covering the lower portion of the connector terminals; opening a pre-dicing opening in the protective layer and within the trench; applying a tape over the active surface of the semiconductor wafer, the protective layer and the connector terminals; and performing an operation on a backside of the semiconductor substrate to remove material until the pre-dicing opening is exposed on the backside of the semiconductor wafer. An apparatus includes a semiconductor substrate with integrated circuits and a protective layer surrounding connector terminals of integrated circuits.

Abstract: Methods and apparatus for alignment in a flip chip bonding. A method includes attaching an integrated circuit having connector terminals to a bonding arm, the bonding arm having a chuck for attaching the integrated circuit at the backside surface, the bonding arm having a plurality of CCD imagers mounted thereon; receiving a substrate having pads corresponding to the connector terminals; using the bonding arm, positioning the integrated circuit proximal to the substrate; aligning the integrated circuit connector terminals with the pads on the substrate using the CCD imagers on the bonding arm; positioning the connector terminals in contact with the pads on the substrate; and performing a solder reflow to attach the integrated circuit to the substrate. An apparatus includes a bonding arm with a chuck for carrying a component and CCD imagers mounted on the arm for alignment.

Abstract: A content-driven apparatus for controlling electronic devices integrates all control command functions for at least one controlled electronic device. Content information transmitted from one of the controlled electronic devices is received by a communication module, and is passed to a processing element for parsing the content information, including types of the content information, desired command actions to be proceeded, controlled electronic devices required to cooperate, and how to operate for a user. The processing element decides a user interface and an operation method for the user after the parsing, and issues corresponding control messages to the controlled electronic devices required to cooperate after the user uses the operation method to select specific control commands.

Abstract: A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner.

Abstract: A method for assembling a flip chip ball grid array package includes mounting solder spheres to a ball grid array substrate, applying flux to a plurality of flip chip solder bumps provided on a diced wafer, aligning the ball grid array substrate over a chip on the diced wafer, picking and separating the chip from the diced wafer by urging the chip upwards towards the ball grid array substrate until the flip chip solder bumps on the chip come in contact with the ball grid array substrate, whereby the chip attaches to the ball grid array substrate in an upside-down orientation, and subjecting the chip and the ball grid array substrate to a thermal process whereby the solder spheres reflow and form solder balls and the flip chip solder bumps reflow and form solder joints between the chip and the ball grid array.

Abstract: A computer system and a sleep control method thereof are provided. The method includes following steps: when a computer system enters a sleep mode, storing a system parameter into a dynamic random access memory (DRAM) via a central processing unit (CPU); storing the system parameter in the DRAM to a flash memory via a bridge unit; and entering the sleep mode or a power off mode. According to the disclosure, to wake up the computer system is more rapidly and power saving.

Abstract: Methods for making a substrate for semiconductor packaging with improved warpage and an apparatus. A method includes providing on a die side of a substrate at least one flip chip mounted integrated circuit die. The substrate may include through substrate vias (TSVs). An underfill is dispensed between the integrated circuit die and the substrate. Initially the underfill is left uncured. A thermal interface material is provided on the upper surface of the at least one integrated circuit die. A heat sink is mounted over the integrated circuit die and in thermal contact with the thermal interface material. A thermal cure is performed to simultaneously cure the underfill material and the thermal interface material. In another embodiment, the thermal cure may simultaneously cure an adhesive mounting the heat sink to the substrate. Solder balls are disposed on a board surface of the substrate to form a ball grid array package.

Abstract: The present invention discloses an image synthesis system for a vehicle to provide the driver with a downward-facing image of the car's 360° surrounding view. The system includes: a first camera, which is used to shoot a first image of the periphery of the vehicle; a second camera, which is used to shoot a second image of the periphery of said vehicle, wherein the second image and the first image have an overlap region; an image processing device comprising a defining component and a synthesis component, which is used to synthesize the first image and the second image and output a third image; a display device, which is used to display the third image.

Abstract: The present invention discloses an image synthesis system for a vehicle to provide the driver with a downward-facing image of the car's 360° surrounding view. The system includes: a first camera, which is used to shoot a first image of the periphery of the vehicle; a second camera, which is used to shoot a second image of the periphery of said vehicle, wherein the second image and the first image have an overlap region; an image processing device comprising a defining component and a synthesis component, which is used to synthesize the first image and the second image and output a third image; a display device, which is used to display the third image.

Abstract: A computer system with internet phone functionality is provided. The computer system keeps running application programs when it turns the processing rate and the voltage of the central processor unit down (e.g. enter to the sleep mode). When the internet phone or a traditional telephone has an incoming call, the computer would be waked up immediately to prevent missing any incoming call from the internet phone or the traditional telephone.

Abstract: A method for opening/closing a disk tray of a disk drive. The method includes the steps of when a first event occurs, sending a load/unload command to the disk drive, to which the disk drive responds with a second or third event, and resends the load/unload command to the disk drive when the disk drive responds to the previous load/unload command with the second event.

Abstract: A computer integrated with traditional telephone and VoIP includes a network module, a south bridge chip and a telecom adapter module. The network module is connected to the Internet for providing an Internet connection function to enable the computer to make or receive a VoIP call. The south bridge chip is connected to the network module. The telecom adapter module includes a first telecom port for connecting to a traditional phone, a second telecom port for connecting to a PSTN, and a connection interface. The telecom adapter module is connected to the south bridge chip via the connection interface to thereby enable the traditional phone to make or answer a VoIP call via the telecom adapter module, the south bridge and the network module.