Abstract: An electronic device includes: a first panel including a first bonding pad and a first edge adjacent to the first bonding pad; a second panel overlapped with the first panel and including a second bonding pad; a circuit board electrically connected to the first panel and used to provide a first signal; and a first conductive connector electrically connected to the first panel and the second panel, wherein the first signal is input to the first bonding pad of the first panel through the circuit board, and input to the second bonding pad of the second panel through the first conductive connector, wherein the first bonding pad is between the second bonding pad and the first edge in a top view direction.

Abstract: An electronic device includes: a first substrate, wherein the first substrate is flexible; a second substrate disposed corresponding to the first substrate, wherein the second substrate is flexible; and a first conductive layer disposed on the first substrate. The first conductive layer includes: a first conductive pattern for receiving a first electrode signal and including a first bonding part; and a second conductive pattern for receiving a second electrode signal and including a second bonding part. The electronic device further includes: a second conductive layer disposed on the second substrate and electrically connected to the second conductive pattern; and a first metal layer disposed between the first substrate and at least one of the first bonding part and the second bonding part and is electrically connected to the at least one of the first bonding part and the second bonding part.

Abstract: A display device has a transmissive area and a reflective area. The transmissive area corresponds to a first sub-pixel, and the reflective area corresponds to a second sub-pixel. The display device includes a backlight module, a liquid crystal module, and an anti-reflective layer. The liquid crystal module is disposed on the backlight module and includes a first substrate, a component layer, and a reflective layer. The component layer is disposed on the first substrate and includes a first transistor and a second transistor. The first transistor is configured to drive the first sub-pixel, and the second transistor is configured to drive the second sub-pixel. The reflective layer is disposed on the component layer and corresponds to the reflective area. The anti-reflective layer is disposed on the liquid crystal module.

Abstract: A display device is provided. The display device includes a display module for displaying pictures and a viewing angle control module adjacent to the display module. The viewing angle control module includes a first substrate, a second substrate opposite to the first substrate, a viewing angle control medium disposed between the first substrate and the second substrate, and a touch layer disposed between the viewing angle control medium and the first substrate. The touch layer includes a bridge electrode and first touch electrodes disposed on the first substrate, and an insulation layer disposed between the bridge electrode and the first touch electrodes. The insulation layer has openings, and the first touch electrodes are electrically connected to the bridging electrode through the openings.

Abstract: An electronic structure includes a substrate, a plurality of electronic units disposed on the substrate, a circuit structure electrically connected with at least one of the plurality of electronic units, and a support element disposed under the substrate. The substrate has a first flat part and a curved part connected with the first flat part. At least two adjacent ones of the plurality of electronic units on the first flat part have a first pitch. A least another two adjacent ones of the plurality of electronic units on the curved part have a second pitch different from the first pitch. In a normal direction of the first flat part, at least a portion of the circuit structure overlaps a region between the at least two adjacent ones of the plurality of electronic units on the first flat part. The circuit structure is disposed under the support element.

Abstract: An electronic structure includes a substrate, a plurality of electronic units disposed on the substrate, and a circuit structure electrically connected with at least one of the plurality of electronic units. The substrate has a first flat part and a curved part connected with the first flat part. Two adjacent ones of the plurality of electronic units on the first flat part have a first pitch in a first direction parallel to a surface of the first flat part Another two adjacent ones of the plurality of electronic units on the curved part have a second pitch different from the first pitch in a second direction parallel to a surface of the curved part. In a normal direction of the first flat part, at least a portion of the circuit structure overlaps a region between another two of the plurality of electronic units on the first flat part.

Abstract: An electronic structure includes a substrate, a plurality of electronic units disposed on the substrate, and a circuit structure electrically connected with at least one of the plurality of electronic units. The substrate has a first flat part and a curved part connected with the first flat part. Two adjacent ones of the plurality of electronic units on the first flat part have a first pitch in a first direction parallel to a surface of the first flat part Another two adjacent ones of the plurality of electronic units on the curved part have a second pitch different from the first pitch in a second direction parallel to a surface of the curved part. In a normal direction of the first flat part, at least a portion of the circuit structure overlaps a region between another two of the plurality of electronic units on the first flat part.

Abstract: An electronic device, including a light emitting unit, a first viewing angle control unit, and a circuit control unit, is provided. The light emitting unit has a first side and a second side opposite to the first side. The first viewing angle control unit is disposed at the first side. The circuit control unit is disposed at the second side. The light emitting unit and the first viewing angle control unit are electrically connected to the circuit control unit. A portion of the first viewing angle control unit is bendable towards the second side.

Abstract: An electromagnetic wave emitting structure is provided in this disclosure. The electromagnetic wave emitting structure includes a substrate and a plurality of electromagnetic wave emitting units. The substrate has a first flat part and a foldable part connected with the first flat part. The plurality of electromagnetic wave emitting units are disposed on the substrate. Two adjacent ones of the plurality of electromagnetic wave emitting units on the first flat part have a first pitch in a first direction parallel to a surface of the first flat part, and another two adjacent ones of the plurality of electromagnetic wave emitting units on the foldable part have a second pitch in a second direction parallel to a surface of the foldable part. The second pitch is different from the first pitch.

Abstract: An electronic device includes a panel with an operation region and an extended circuit region. The panel includes a first substrate and a first polarizing element. The first polarizing element is disposed on the first substrate. The first substrate extends from the operation region to the extended circuit region, and the first polarizing element extends from the operation region to the extended circuit region.

Abstract: The present disclosure provides a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.

Abstract: An electromagnetic wave emitting structure is provided in this disclosure. The electromagnetic wave emitting structure includes a substrate and a plurality of electromagnetic wave emitting units. The substrate has a first flat part and a foldable part connected with the first flat part. The plurality of electromagnetic wave emitting units are disposed on the substrate. Two adjacent ones of the plurality of electromagnetic wave emitting units on the first flat part have a first pitch in a first direction parallel to a surface of the first flat part, and another two adjacent ones of the plurality of electromagnetic wave emitting units on the foldable part have a second pitch in a second direction parallel to a surface of the foldable part. The second pitch is different from the first pitch.

Abstract: A display device is provided and includes a first polymer substrate, a plurality of thin-film transistors, a second polymer substrate, and a liquid crystal layer. The thin-film transistors are disposed on the first polymer substrate. The second polymer substrate is disposed opposite to the first polymer substrate. The liquid crystal layer is disposed between the first polymer substrate and the second polymer substrate. The first polymer substrate has a first thickness, the second polymer substrate has a second thickness, and the first thickness is greater than the second thickness.

Abstract: The present disclosure provides an electronic device including a first metal layer, a first insulating layer, a second insulating layer, a second metal layer and a first transparent electrode. The first insulating layer is disposed on the first metal layer. The second insulating layer is disposed on the first insulating layer. The second metal layer is disposed between the first metal layer and the second insulating layer. A first via hole penetrates through the first insulating layer and the second insulating layer and exposes a portion of the first metal layer. A second via hole penetrates through the second insulating layer and exposes a portion of the second metal layer. The first transparent electrode is disposed on the second insulating layer and electrically connected to the first metal layer through the first via hole and electrically connected to the second metal layer through the second via hole.

Abstract: An electronic device is provided in this disclosure. The electronic device includes a panel and an electromagnetic wave emitting structure. The panel has a first curved portion. The electromagnetic wave emitting structure has a second curved portion, and the second curved portion is corresponding to the first curved portion. The electromagnetic wave emitting structure includes a substrate and a plurality of electromagnetic wave emitting units. The plurality of electromagnetic wave emitting units are disposed on the substrate, and at least one of the plurality of electromagnetic wave emitting units is in the second curved portion.

Abstract: The present disclosure provides a flexible display device including a substrate, a first metal layer, a first insulating layer and a second insulating layer. The substrate includes an active region and a peripheral region adjacent to the active region. The first metal layer is disposed on the substrate. The first insulating layer is disposed on the first metal layer, and the first insulating layer includes a first via hole disposed in the peripheral region. The second insulating layer is disposed on the first insulating layer, and the second insulating layer includes a second via hole. In a top view direction of the flexible display device, the first via hole is disposed within the second via hole, and the second via hole exposes a portion of a top surface of the first insulating layer.

Abstract: The present disclosure provides a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.

Abstract: A method of preparing tunable inorganic patterned nanofeatures by infiltration of a block copolymer scaffold having a plurality of self-assembled periodic polymer microdomains. The method may be used sequential infiltration synthesis (SIS), related to atomic layer deposition (ALD). The method includes selecting a metal precursor that is configured to selectively react with the copolymer unit defining the microdomain but is substantially non-reactive with another polymer unit of the copolymer. A tunable inorganic features is selectively formed on the microdomain to form a hybrid organic/inorganic composite material of the metal precursor and a co-reactant. The organic component may be optionally removed to obtain an inorganic feature s with patterned nanostructures defined by the configuration of the microdomain.

Abstract: The present disclosure provides a flexible display device and a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.

Abstract: A liquid crystal device comprises a first polymer substrate, a first buffer layer, thin film transistors, a liquid crystal layer and a second polymer substrate. The first buffer layer is disposed on the first polymer substrate. The thin film transistors are disposed on the first buffer layer. The liquid crystal layer is disposed on the thin film transistors. The second polymer substrate is disposed on the liquid crystal layer.