Abstract: A layout of a semiconductor memory device includes a substrate and a ternary content addressable memory (TCAM). The TCAM is disposed on the substrate and includes a plurality of TCAM bit cells, where at least two of the TCAM bit cells are mirror-symmetrical along an axis of symmetry, and each of the TCAM bit cells includes two storage units electrically connected to two word lines respectively, and a logic circuit electrically connected to the storage units. The logic circuit includes two first reading transistors, and two second reading transistors, where each of the second reading transistors includes a gate and source and drain regions, the source and drain regions of the second reading transistors are electrically connected to two matching lines and the first reading transistors, respectively, where the word lines are disposed parallel to and between the matching lines.

Abstract: An electronic structure includes a substrate, a plurality of electronic units disposed on the substrate, and a circuit structure electrically connected with at least one of the plurality of electronic units. The substrate has a first flat part and a curved part connected with the first flat part. Two adjacent ones of the plurality of electronic units on the first flat part have a first pitch in a first direction parallel to a surface of the first flat part Another two adjacent ones of the plurality of electronic units on the curved part have a second pitch different from the first pitch in a second direction parallel to a surface of the curved part. In a normal direction of the first flat part, at least a portion of the circuit structure overlaps a region between another two of the plurality of electronic units on the first flat part.

Abstract: An electronic device, including a light emitting unit, a first viewing angle control unit, and a circuit control unit, is provided. The light emitting unit has a first side and a second side opposite to the first side. The first viewing angle control unit is disposed at the first side. The circuit control unit is disposed at the second side. The light emitting unit and the first viewing angle control unit are electrically connected to the circuit control unit. A portion of the first viewing angle control unit is bendable towards the second side.

Abstract: An electromagnetic wave emitting structure is provided in this disclosure. The electromagnetic wave emitting structure includes a substrate and a plurality of electromagnetic wave emitting units. The substrate has a first flat part and a foldable part connected with the first flat part. The plurality of electromagnetic wave emitting units are disposed on the substrate. Two adjacent ones of the plurality of electromagnetic wave emitting units on the first flat part have a first pitch in a first direction parallel to a surface of the first flat part, and another two adjacent ones of the plurality of electromagnetic wave emitting units on the foldable part have a second pitch in a second direction parallel to a surface of the foldable part. The second pitch is different from the first pitch.

Abstract: An electronic device includes a panel with an operation region and an extended circuit region. The panel includes a first substrate and a first polarizing element. The first polarizing element is disposed on the first substrate. The first substrate extends from the operation region to the extended circuit region, and the first polarizing element extends from the operation region to the extended circuit region.

Abstract: The present disclosure provides a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.

Abstract: An electromagnetic wave emitting structure is provided in this disclosure. The electromagnetic wave emitting structure includes a substrate and a plurality of electromagnetic wave emitting units. The substrate has a first flat part and a foldable part connected with the first flat part. The plurality of electromagnetic wave emitting units are disposed on the substrate. Two adjacent ones of the plurality of electromagnetic wave emitting units on the first flat part have a first pitch in a first direction parallel to a surface of the first flat part, and another two adjacent ones of the plurality of electromagnetic wave emitting units on the foldable part have a second pitch in a second direction parallel to a surface of the foldable part. The second pitch is different from the first pitch.

Abstract: A display device is provided and includes a first polymer substrate, a plurality of thin-film transistors, a second polymer substrate, and a liquid crystal layer. The thin-film transistors are disposed on the first polymer substrate. The second polymer substrate is disposed opposite to the first polymer substrate. The liquid crystal layer is disposed between the first polymer substrate and the second polymer substrate. The first polymer substrate has a first thickness, the second polymer substrate has a second thickness, and the first thickness is greater than the second thickness.

Abstract: The present disclosure provides an electronic device including a first metal layer, a first insulating layer, a second insulating layer, a second metal layer and a first transparent electrode. The first insulating layer is disposed on the first metal layer. The second insulating layer is disposed on the first insulating layer. The second metal layer is disposed between the first metal layer and the second insulating layer. A first via hole penetrates through the first insulating layer and the second insulating layer and exposes a portion of the first metal layer. A second via hole penetrates through the second insulating layer and exposes a portion of the second metal layer. The first transparent electrode is disposed on the second insulating layer and electrically connected to the first metal layer through the first via hole and electrically connected to the second metal layer through the second via hole.

Abstract: An electronic device is provided in this disclosure. The electronic device includes a panel and an electromagnetic wave emitting structure. The panel has a first curved portion. The electromagnetic wave emitting structure has a second curved portion, and the second curved portion is corresponding to the first curved portion. The electromagnetic wave emitting structure includes a substrate and a plurality of electromagnetic wave emitting units. The plurality of electromagnetic wave emitting units are disposed on the substrate, and at least one of the plurality of electromagnetic wave emitting units is in the second curved portion.

Abstract: The present disclosure provides a flexible display device including a substrate, a first metal layer, a first insulating layer and a second insulating layer. The substrate includes an active region and a peripheral region adjacent to the active region. The first metal layer is disposed on the substrate. The first insulating layer is disposed on the first metal layer, and the first insulating layer includes a first via hole disposed in the peripheral region. The second insulating layer is disposed on the first insulating layer, and the second insulating layer includes a second via hole. In a top view direction of the flexible display device, the first via hole is disposed within the second via hole, and the second via hole exposes a portion of a top surface of the first insulating layer.

Abstract: The present disclosure provides a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.

Abstract: A method of preparing tunable inorganic patterned nanofeatures by infiltration of a block copolymer scaffold having a plurality of self-assembled periodic polymer microdomains. The method may be used sequential infiltration synthesis (SIS), related to atomic layer deposition (ALD). The method includes selecting a metal precursor that is configured to selectively react with the copolymer unit defining the microdomain but is substantially non-reactive with another polymer unit of the copolymer. A tunable inorganic features is selectively formed on the microdomain to form a hybrid organic/inorganic composite material of the metal precursor and a co-reactant. The organic component may be optionally removed to obtain an inorganic feature s with patterned nanostructures defined by the configuration of the microdomain.

Abstract: The present disclosure provides a flexible display device and a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.

Abstract: A liquid crystal device comprises a first polymer substrate, a first buffer layer, thin film transistors, a liquid crystal layer and a second polymer substrate. The first buffer layer is disposed on the first polymer substrate. The thin film transistors are disposed on the first buffer layer. The liquid crystal layer is disposed on the thin film transistors. The second polymer substrate is disposed on the liquid crystal layer.

Abstract: An electronic device is provided in this disclosure. The electronic device includes a panel and an electromagnetic wave emitting structure. The panel has a first curved portion. The electromagnetic wave emitting structure has a second curved portion, and the second curved portion is corresponding to the first curved portion. The electromagnetic wave emitting structure includes a substrate and a plurality of electromagnetic wave emitting units. The plurality of electromagnetic wave emitting units are disposed on the substrate, and at least one of the plurality of electromagnetic wave emitting units is in the second curved portion.

Abstract: A reflective flexible display device includes a liquid crystal layer disposed between a first flexible substrate and a second flexible substrate, and a reflective pixel electrode disposed on the first flexible substrate. A CIELAB b* coordinate of the second flexible substrate is less than or equal to a CIELAB b* coordinate of the first flexible substrate.

Abstract: The present disclosure provides a flexible display device and a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.

Abstract: A liquid crystal display device including a first flexible substrate, a plurality of first spacers, a second flexible substrate, a plurality of second spacers, and a liquid crystal layer is provided. The first spacers are disposed on the first flexible substrate, the second flexible substrate is disposed opposite to the first flexible substrate, the second spacers are disposed on the second flexible substrate, and the liquid crystal layer is disposed between the first flexible substrate and the second flexible substrate.

Abstract: The present invention provides a solder for nickel based superalloy soldering. The solder includes 11 wt % to 13 wt % chromium, 5.0 wt % to 7.0 wt % aluminum, 3.5 wt % to 5.0 wt % molybdenum, 1.5 wt % to 2.5 wt % niobium, 0.4 wt % to 1.0 wt % titanium, 0.03 wt % to 0.07 wt % carbon, 0.05 wt %-0.15 wt % zirconium, 0.001 wt % to 0.1 wt % boron and remainder nickel or other inevitable impurities, thereby reducing occurrence of soldering hot cracking and insufficient weld bead strength in nickel based superalloy raw materials during soldering.