Patents by Inventor Yu-Chin Lin

Yu-Chin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240138098
    Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 25, 2024
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Wei-Chin Chen, Yu-Ming Lin
  • Patent number: 11968800
    Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: April 23, 2024
    Assignee: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Sheng-Yan Chen
  • Patent number: 11948938
    Abstract: In some embodiments, the present disclosure relates to a semiconductor device comprising a source and drain region arranged within a substrate. A conductive gate is disposed over a doped region of the substrate. A gate dielectric layer is disposed between the source region and the drain region and separates the conductive gate from the doped region. A bottommost surface of the gate dielectric layer is below a topmost surface of the substrate. First and second sidewall spacers are arranged along first and second sides of the conductive gate, respectively. An inner portion of the first sidewall spacer and an inner portion of the second sidewall spacer respectively cover a first and second top surface of the gate dielectric layer. A drain extension region and a source extension region respectively separate the drain region and the source region from the gate dielectric layer.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Hsiao-Chin Tuan, Alexander Kalnitsky, Kong-Beng Thei, Shi-Chuang Hsiao, Yu-Hong Kuo
  • Patent number: 11943936
    Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a first transistor, a first resistive random access memory (RRAM) resistor, and a second RRAM resistor. The first resistor includes a first resistive material layer, a first electrode shared by the second resistor, and a second electrode. The second resistor includes the first electrode, a second resistive material layer, and a third electrode. The first electrode is electrically coupled to the first transistor.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yu-Der Chih, May-Be Chen, Yun-Sheng Chen, Jonathan Tsung-Yung Chang, Wen Zhang Lin, Chrong Jung Lin, Ya-Chin King, Chieh Lee, Wang-Yi Lee
  • Patent number: 11933849
    Abstract: The present disclosure provides an inductance detection method includes steps of: (a) acquiring a stator resistance of the reluctance motor; (b) injecting a high-frequency sinusoidal signal in the d-axis or q-axis direction; (c) injecting an align signal command in the q-axis or d-axis direction; (d) receiving a dq-axes signal generated through injecting the high-frequency sinusoidal signal and the align signal command; (e) sampling a motor feedback signal generated through receiving the dq-axes signal; (f) in the direction of injecting the high-frequency sinusoidal signal, calculating an amplitude difference between the high-frequency sinusoidal signal and the motor feedback signal, and adjusting an amplitude of the high-frequency sinusoidal signal according to the amplitude difference for regulating a feedback amplitude of the motor feedback signal; and (g) when the feedback amplitude reaching an expected amplitude, calculating an apparent inductance of the reluctance motor based on the dq-axes signal, the
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: March 19, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yu-Shian Lin, Tung-Chin Hsieh, Ming-Tsung Chen
  • Publication number: 20240087947
    Abstract: A semiconductor device and method of manufacture are provided. In some embodiments isolation regions are formed by modifying a dielectric material of a dielectric layer such that a first portion of the dielectric layer is more readily removed by an etching process than a second portion of the dielectric layer. The modifying of the dielectric material facilitates subsequent processing steps that allow for the tuning of a profile of the isolation regions to a desired geometry based on the different material properties of the modified dielectric material.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 14, 2024
    Inventors: Chung-Ting Ko, Yu-Cheng Shiau, Li-Jung Kuo, Sung-En Lin, Kuo-Chin Liu
  • Patent number: 11913472
    Abstract: A centrifugal heat dissipation fan including a housing and an impeller disposed in the housing on an axis is provided. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions. A heat dissipation system of an electronic device is also provided.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: February 27, 2024
    Assignee: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Chun-Chieh Wang, Shu-Hao Kuo
  • Patent number: 11848601
    Abstract: A ripple reduction circuit for use with an AC/DC power supply providing an output voltage to a load is presented. The ripple reduction circuit includes an input terminal for receiving the output voltage and a low pass filter. The low pass filter is used to filter an AC component of the output voltage to obtain a filtered DC voltage. The ripple reduction circuit generates a reference current based on the filtered DC voltage and a control voltage having an AC component in phase with the AC component of the output voltage.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: December 19, 2023
    Assignee: Renesas Design (UK) Limited
    Inventor: Yu-Chin Lin
  • Publication number: 20230387788
    Abstract: A ripple reduction circuit for use with an AC/DC power supply providing an output voltage to a load is presented. The ripple reduction circuit includes an input terminal for receiving the output voltage and a low pass filter. The low pass filter is used to filter an AC component of the output voltage to obtain a filtered DC voltage. The ripple reduction circuit generates a reference current based on the filtered DC voltage and a control voltage having an AC component in phase with the AC component of the output voltage.
    Type: Application
    Filed: May 31, 2022
    Publication date: November 30, 2023
    Applicant: Dialog Semiconductor (UK) Limited
    Inventor: Yu-Chin LIN
  • Publication number: 20230307347
    Abstract: The present disclosure provides an electronic device including a substrate, a first pad, an insulating layer, a second pad, a conductive element and a chip. The first pad is disposed on the substrate. The insulating layer is disposed on the first pad and has a plurality of first openings. The second pad is electrically connected to the first pad through the first openings. The conductive particle is disposed on the second pad. The chip is electrically connected to the second pad through the conductive element. In a top view of the electronic device, the first openings are arranged along a long edge of the first pad, and an outline of at least one first opening has a curved shape.
    Type: Application
    Filed: June 1, 2023
    Publication date: September 28, 2023
    Applicant: InnoLux Corporation
    Inventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu
  • Patent number: 11753568
    Abstract: An adhesive composition includes 0.1 to 1 part by weight of nano panicles, 50 to 95 parts by weight of acrylate resin, and 5 to 50 parts by weight of a monomer or oligomer of acrylate or acrylic acid containing multi-functional groups, and the acrylate resin and the monomer or oligomer of acrylate or acrylic acid containing multi-functional groups have a total weight of 100 parts by weight, in which the acrylate resin has a weight average molecular weight of 100,000 to 1,500,000. The nano particle has a shell covering parts of the surface of the core, and acrylate groups grafted to the surface of the core.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: September 12, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ming-Tzung Wu, Te-Yi Chang, Yao-Jheng Huang, Yu-Chin Lin, Chen-Cheng Yu, Yu-Ying Hsu, Shuang-Huei Chen
  • Patent number: 11722020
    Abstract: A stator of a brushless motor has an iron core, a bobbin, and a winding assembly. The iron core has multiple stator poles mounted on an interior annular surface of a core body and spaced apart from each other. The bobbin is mounted on one of two open ends of the core body and has a substrate, at least one neutral connector mounted on an upper surface of the substrate, and at least one neutral solder pad mounted in the at least one neutral connector. The winding assembly is formed by one wire wound on multiple stator poles and the connectors. The winding assembly is electrically connected to the at least one neutral solder pad.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: August 8, 2023
    Assignee: Techway Industrial Co., Ltd.
    Inventors: Fu Hsiang Chung, Hong Fang Chen, Shih Wei Hung, Wei Ting Chen, Yu Chin Lin
  • Patent number: 11705392
    Abstract: The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: July 18, 2023
    Assignee: InnoLux Corporation
    Inventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu
  • Publication number: 20230183533
    Abstract: An adhesive composition includes 0.1 to 1 part by weight of nano panicles, 50 to 95 parts by weight of acrylate resin, and 5 to 50 parts by weight of a monomer or oligomer of acrylate or acrylic acid containing multi-functional groups, and the acrylate resin and the monomer or oligomer of acrylate or acrylic acid containing multi-functional groups have a total weight of 100 parts by weight, in which the acrylate resin has a weight average molecular weight of 100,000 to 1,500,000. The nano particle has a shell covering parts of the surface of the core, and acrylate groups grafted to the surface of the core.
    Type: Application
    Filed: February 28, 2022
    Publication date: June 15, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ming-Tzung WU, Te-Yi CHANG, Yao-Jheng HUANG, Yu-Chin LIN, Chen-Cheng YU, Yu-Ying HSU, Shuang-Huei CHEN
  • Patent number: 11611284
    Abstract: An isolated switching power converter is presented. The isolated switching converter includes a transformer, a secondary-side switch and a secondary-side controller. The transformer has a primary winding coupled to an input, a first secondary winding coupled to a first output for providing a first output voltage, and a second secondary winding coupled to a second output for providing a second output voltage. The secondary-side switch is coupled to the second secondary winding. The secondary-side controller compares the second output voltage with a first reference voltage and generates a control signal based on the comparison to operate the secondary-side switch.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: March 21, 2023
    Assignee: Dialog Semiconductor (UK) Limited
    Inventor: Yu-Chin Lin
  • Publication number: 20220399822
    Abstract: An isolated switching power converter is presented. The isolated switching converter includes a transformer, a secondary-side switch and a secondary-side controller. The transformer has a primary winding coupled to an input, a first secondary winding coupled to a first output for providing a first output voltage, and a second secondary winding coupled to a second output for providing a second output voltage. The secondary-side switch is coupled to the second secondary winding. The secondary-side controller compares the second output voltage with a first reference voltage and generates a control signal based on the comparison to operate the secondary-side switch.
    Type: Application
    Filed: June 10, 2021
    Publication date: December 15, 2022
    Inventor: Yu-Chin Lin
  • Publication number: 20220227771
    Abstract: An androgen receptor (AR) binding molecule has the structure of Formula (I) shown in the following: wherein E and G independently are CH2 or CH, is OH, NH2, OTf or C?C, X is CF3 or trifluorophenyl, and Y and Z independently are CH2 or CH; or is absent, X is CF3, and Y and Z independently are CH2.
    Type: Application
    Filed: December 23, 2021
    Publication date: July 21, 2022
    Applicant: Industrial Technology Research Institute
    Inventors: Chih-Wei FU, Hao-Hsuan LIU, Chiu-Lien HUNG, Yu-Chin LIN, Tsan-Lin HU, Chien-Chin HUANG
  • Publication number: 20220199514
    Abstract: The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.
    Type: Application
    Filed: March 10, 2022
    Publication date: June 23, 2022
    Applicant: InnoLux Corporation
    Inventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu
  • Patent number: 11318153
    Abstract: A method of using Neoandrographolide for lowering blood sugar, lowering blood lipid, improving liver function and improving renal function. The method includes preparing a composition comprising Neoandrographolide as the active ingredient, and administering the composition to lower the blood sugar or blood lipid of a user, to prevent a decrease in liver function of a user, or to improve the renal function of a user. The Neoandrographolide is the only active ingredient in the composition.
    Type: Grant
    Filed: June 22, 2019
    Date of Patent: May 3, 2022
    Assignee: Bialpha International Sdn. Bhd.
    Inventors: Yu-Chin Lin, Ching-Wen Chang
  • Patent number: 11302622
    Abstract: The present disclosure provides an electronic device including a substrate, a first pad, a second pad and an integrated circuit chip. The first pad is disposed on the substrate. The second pad is disposed on the first pad and electrically connected to the first pad. The integrated circuit chip is disposed on the second pad and is electrically connected to the second pad. The second pad has a plurality of curved corners.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: April 12, 2022
    Assignee: InnoLux Corporation
    Inventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu