Patents by Inventor Yu-Chin Lin
Yu-Chin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240138098Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.Type: ApplicationFiled: October 12, 2023Publication date: April 25, 2024Applicant: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Wei-Chin Chen, Yu-Ming Lin
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Patent number: 11968800Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.Type: GrantFiled: May 23, 2023Date of Patent: April 23, 2024Assignee: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Sheng-Yan Chen
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Patent number: 11948938Abstract: In some embodiments, the present disclosure relates to a semiconductor device comprising a source and drain region arranged within a substrate. A conductive gate is disposed over a doped region of the substrate. A gate dielectric layer is disposed between the source region and the drain region and separates the conductive gate from the doped region. A bottommost surface of the gate dielectric layer is below a topmost surface of the substrate. First and second sidewall spacers are arranged along first and second sides of the conductive gate, respectively. An inner portion of the first sidewall spacer and an inner portion of the second sidewall spacer respectively cover a first and second top surface of the gate dielectric layer. A drain extension region and a source extension region respectively separate the drain region and the source region from the gate dielectric layer.Type: GrantFiled: July 18, 2022Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Hsiao-Chin Tuan, Alexander Kalnitsky, Kong-Beng Thei, Shi-Chuang Hsiao, Yu-Hong Kuo
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Patent number: 11943936Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a first transistor, a first resistive random access memory (RRAM) resistor, and a second RRAM resistor. The first resistor includes a first resistive material layer, a first electrode shared by the second resistor, and a second electrode. The second resistor includes the first electrode, a second resistive material layer, and a third electrode. The first electrode is electrically coupled to the first transistor.Type: GrantFiled: August 12, 2021Date of Patent: March 26, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Yu-Der Chih, May-Be Chen, Yun-Sheng Chen, Jonathan Tsung-Yung Chang, Wen Zhang Lin, Chrong Jung Lin, Ya-Chin King, Chieh Lee, Wang-Yi Lee
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Patent number: 11933849Abstract: The present disclosure provides an inductance detection method includes steps of: (a) acquiring a stator resistance of the reluctance motor; (b) injecting a high-frequency sinusoidal signal in the d-axis or q-axis direction; (c) injecting an align signal command in the q-axis or d-axis direction; (d) receiving a dq-axes signal generated through injecting the high-frequency sinusoidal signal and the align signal command; (e) sampling a motor feedback signal generated through receiving the dq-axes signal; (f) in the direction of injecting the high-frequency sinusoidal signal, calculating an amplitude difference between the high-frequency sinusoidal signal and the motor feedback signal, and adjusting an amplitude of the high-frequency sinusoidal signal according to the amplitude difference for regulating a feedback amplitude of the motor feedback signal; and (g) when the feedback amplitude reaching an expected amplitude, calculating an apparent inductance of the reluctance motor based on the dq-axes signal, theType: GrantFiled: May 19, 2022Date of Patent: March 19, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Yu-Shian Lin, Tung-Chin Hsieh, Ming-Tsung Chen
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Publication number: 20240087947Abstract: A semiconductor device and method of manufacture are provided. In some embodiments isolation regions are formed by modifying a dielectric material of a dielectric layer such that a first portion of the dielectric layer is more readily removed by an etching process than a second portion of the dielectric layer. The modifying of the dielectric material facilitates subsequent processing steps that allow for the tuning of a profile of the isolation regions to a desired geometry based on the different material properties of the modified dielectric material.Type: ApplicationFiled: January 10, 2023Publication date: March 14, 2024Inventors: Chung-Ting Ko, Yu-Cheng Shiau, Li-Jung Kuo, Sung-En Lin, Kuo-Chin Liu
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Patent number: 11913472Abstract: A centrifugal heat dissipation fan including a housing and an impeller disposed in the housing on an axis is provided. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions. A heat dissipation system of an electronic device is also provided.Type: GrantFiled: April 6, 2021Date of Patent: February 27, 2024Assignee: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Chun-Chieh Wang, Shu-Hao Kuo
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Patent number: 11848601Abstract: A ripple reduction circuit for use with an AC/DC power supply providing an output voltage to a load is presented. The ripple reduction circuit includes an input terminal for receiving the output voltage and a low pass filter. The low pass filter is used to filter an AC component of the output voltage to obtain a filtered DC voltage. The ripple reduction circuit generates a reference current based on the filtered DC voltage and a control voltage having an AC component in phase with the AC component of the output voltage.Type: GrantFiled: May 31, 2022Date of Patent: December 19, 2023Assignee: Renesas Design (UK) LimitedInventor: Yu-Chin Lin
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Publication number: 20230387788Abstract: A ripple reduction circuit for use with an AC/DC power supply providing an output voltage to a load is presented. The ripple reduction circuit includes an input terminal for receiving the output voltage and a low pass filter. The low pass filter is used to filter an AC component of the output voltage to obtain a filtered DC voltage. The ripple reduction circuit generates a reference current based on the filtered DC voltage and a control voltage having an AC component in phase with the AC component of the output voltage.Type: ApplicationFiled: May 31, 2022Publication date: November 30, 2023Applicant: Dialog Semiconductor (UK) LimitedInventor: Yu-Chin LIN
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Publication number: 20230307347Abstract: The present disclosure provides an electronic device including a substrate, a first pad, an insulating layer, a second pad, a conductive element and a chip. The first pad is disposed on the substrate. The insulating layer is disposed on the first pad and has a plurality of first openings. The second pad is electrically connected to the first pad through the first openings. The conductive particle is disposed on the second pad. The chip is electrically connected to the second pad through the conductive element. In a top view of the electronic device, the first openings are arranged along a long edge of the first pad, and an outline of at least one first opening has a curved shape.Type: ApplicationFiled: June 1, 2023Publication date: September 28, 2023Applicant: InnoLux CorporationInventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu
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Patent number: 11753568Abstract: An adhesive composition includes 0.1 to 1 part by weight of nano panicles, 50 to 95 parts by weight of acrylate resin, and 5 to 50 parts by weight of a monomer or oligomer of acrylate or acrylic acid containing multi-functional groups, and the acrylate resin and the monomer or oligomer of acrylate or acrylic acid containing multi-functional groups have a total weight of 100 parts by weight, in which the acrylate resin has a weight average molecular weight of 100,000 to 1,500,000. The nano particle has a shell covering parts of the surface of the core, and acrylate groups grafted to the surface of the core.Type: GrantFiled: February 28, 2022Date of Patent: September 12, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ming-Tzung Wu, Te-Yi Chang, Yao-Jheng Huang, Yu-Chin Lin, Chen-Cheng Yu, Yu-Ying Hsu, Shuang-Huei Chen
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Patent number: 11722020Abstract: A stator of a brushless motor has an iron core, a bobbin, and a winding assembly. The iron core has multiple stator poles mounted on an interior annular surface of a core body and spaced apart from each other. The bobbin is mounted on one of two open ends of the core body and has a substrate, at least one neutral connector mounted on an upper surface of the substrate, and at least one neutral solder pad mounted in the at least one neutral connector. The winding assembly is formed by one wire wound on multiple stator poles and the connectors. The winding assembly is electrically connected to the at least one neutral solder pad.Type: GrantFiled: April 26, 2021Date of Patent: August 8, 2023Assignee: Techway Industrial Co., Ltd.Inventors: Fu Hsiang Chung, Hong Fang Chen, Shih Wei Hung, Wei Ting Chen, Yu Chin Lin
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Patent number: 11705392Abstract: The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.Type: GrantFiled: March 10, 2022Date of Patent: July 18, 2023Assignee: InnoLux CorporationInventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu
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Publication number: 20230183533Abstract: An adhesive composition includes 0.1 to 1 part by weight of nano panicles, 50 to 95 parts by weight of acrylate resin, and 5 to 50 parts by weight of a monomer or oligomer of acrylate or acrylic acid containing multi-functional groups, and the acrylate resin and the monomer or oligomer of acrylate or acrylic acid containing multi-functional groups have a total weight of 100 parts by weight, in which the acrylate resin has a weight average molecular weight of 100,000 to 1,500,000. The nano particle has a shell covering parts of the surface of the core, and acrylate groups grafted to the surface of the core.Type: ApplicationFiled: February 28, 2022Publication date: June 15, 2023Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ming-Tzung WU, Te-Yi CHANG, Yao-Jheng HUANG, Yu-Chin LIN, Chen-Cheng YU, Yu-Ying HSU, Shuang-Huei CHEN
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Patent number: 11611284Abstract: An isolated switching power converter is presented. The isolated switching converter includes a transformer, a secondary-side switch and a secondary-side controller. The transformer has a primary winding coupled to an input, a first secondary winding coupled to a first output for providing a first output voltage, and a second secondary winding coupled to a second output for providing a second output voltage. The secondary-side switch is coupled to the second secondary winding. The secondary-side controller compares the second output voltage with a first reference voltage and generates a control signal based on the comparison to operate the secondary-side switch.Type: GrantFiled: June 10, 2021Date of Patent: March 21, 2023Assignee: Dialog Semiconductor (UK) LimitedInventor: Yu-Chin Lin
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Publication number: 20220399822Abstract: An isolated switching power converter is presented. The isolated switching converter includes a transformer, a secondary-side switch and a secondary-side controller. The transformer has a primary winding coupled to an input, a first secondary winding coupled to a first output for providing a first output voltage, and a second secondary winding coupled to a second output for providing a second output voltage. The secondary-side switch is coupled to the second secondary winding. The secondary-side controller compares the second output voltage with a first reference voltage and generates a control signal based on the comparison to operate the secondary-side switch.Type: ApplicationFiled: June 10, 2021Publication date: December 15, 2022Inventor: Yu-Chin Lin
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Publication number: 20220227771Abstract: An androgen receptor (AR) binding molecule has the structure of Formula (I) shown in the following: wherein E and G independently are CH2 or CH, is OH, NH2, OTf or C?C, X is CF3 or trifluorophenyl, and Y and Z independently are CH2 or CH; or is absent, X is CF3, and Y and Z independently are CH2.Type: ApplicationFiled: December 23, 2021Publication date: July 21, 2022Applicant: Industrial Technology Research InstituteInventors: Chih-Wei FU, Hao-Hsuan LIU, Chiu-Lien HUNG, Yu-Chin LIN, Tsan-Lin HU, Chien-Chin HUANG
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Publication number: 20220199514Abstract: The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.Type: ApplicationFiled: March 10, 2022Publication date: June 23, 2022Applicant: InnoLux CorporationInventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu
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Patent number: 11318153Abstract: A method of using Neoandrographolide for lowering blood sugar, lowering blood lipid, improving liver function and improving renal function. The method includes preparing a composition comprising Neoandrographolide as the active ingredient, and administering the composition to lower the blood sugar or blood lipid of a user, to prevent a decrease in liver function of a user, or to improve the renal function of a user. The Neoandrographolide is the only active ingredient in the composition.Type: GrantFiled: June 22, 2019Date of Patent: May 3, 2022Assignee: Bialpha International Sdn. Bhd.Inventors: Yu-Chin Lin, Ching-Wen Chang
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Patent number: 11302622Abstract: The present disclosure provides an electronic device including a substrate, a first pad, a second pad and an integrated circuit chip. The first pad is disposed on the substrate. The second pad is disposed on the first pad and electrically connected to the first pad. The integrated circuit chip is disposed on the second pad and is electrically connected to the second pad. The second pad has a plurality of curved corners.Type: GrantFiled: May 11, 2020Date of Patent: April 12, 2022Assignee: InnoLux CorporationInventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu