Patents by Inventor Yu-Chin Lin
Yu-Chin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12152035Abstract: An androgen receptor (AR) binding molecule has the structure of Formula (I) shown in the following: wherein E is CH2, G is CH, is OH, NH2, OTf or C?C, X is CF3 or trifluoromethylphenyl, is a single bond, and Y and Z are CH2; or is absent, X is CF3, is a double bond, and Y and Z are CH.Type: GrantFiled: December 23, 2021Date of Patent: November 26, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Wei Fu, Hao-Hsuan Liu, Chiu-Lien Hung, Yu-Chin Lin, Tsan-Lin Hu, Chien-Chin Huang
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Publication number: 20240332160Abstract: An electronic device includes a substrate, a conductive structure disposed on the substrate, a conductive pad disposed on the conductive structure and electrically connected to the conductive structure through an opening of an insulating layer disposed on the conductive structure. In a top view, the conductive structure has a first long edge and a second long edge, and the conductive pad has a third long edge and a fourth long edge adjacent to the first long edge and the second long edge respectively. In a direction perpendicular to the first long edge, a distance between the first long edge and the second long edge is less than a distance between the third long edge and the fourth long edge, and a distance between the first long edge and the third long edge is different from a distance between the second long edge and the fourth long edge.Type: ApplicationFiled: June 13, 2024Publication date: October 3, 2024Applicant: InnoLux CorporationInventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu
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Patent number: 12046547Abstract: The present disclosure provides an electronic device including a substrate, a first pad, an insulating layer, a second pad, a conductive element and a chip. The first pad is disposed on the substrate. The insulating layer is disposed on the first pad and has a plurality of first openings. The second pad is electrically connected to the first pad through the first openings. The conductive particle is disposed on the second pad. The chip is electrically connected to the second pad through the conductive element. In a top view of the electronic device, the first openings are arranged along a long edge of the first pad, and an outline of at least one first opening has a curved shape.Type: GrantFiled: June 1, 2023Date of Patent: July 23, 2024Assignee: InnoLux CorporationInventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu
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Patent number: 11848601Abstract: A ripple reduction circuit for use with an AC/DC power supply providing an output voltage to a load is presented. The ripple reduction circuit includes an input terminal for receiving the output voltage and a low pass filter. The low pass filter is used to filter an AC component of the output voltage to obtain a filtered DC voltage. The ripple reduction circuit generates a reference current based on the filtered DC voltage and a control voltage having an AC component in phase with the AC component of the output voltage.Type: GrantFiled: May 31, 2022Date of Patent: December 19, 2023Assignee: Renesas Design (UK) LimitedInventor: Yu-Chin Lin
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Publication number: 20230387788Abstract: A ripple reduction circuit for use with an AC/DC power supply providing an output voltage to a load is presented. The ripple reduction circuit includes an input terminal for receiving the output voltage and a low pass filter. The low pass filter is used to filter an AC component of the output voltage to obtain a filtered DC voltage. The ripple reduction circuit generates a reference current based on the filtered DC voltage and a control voltage having an AC component in phase with the AC component of the output voltage.Type: ApplicationFiled: May 31, 2022Publication date: November 30, 2023Applicant: Dialog Semiconductor (UK) LimitedInventor: Yu-Chin LIN
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Publication number: 20230307347Abstract: The present disclosure provides an electronic device including a substrate, a first pad, an insulating layer, a second pad, a conductive element and a chip. The first pad is disposed on the substrate. The insulating layer is disposed on the first pad and has a plurality of first openings. The second pad is electrically connected to the first pad through the first openings. The conductive particle is disposed on the second pad. The chip is electrically connected to the second pad through the conductive element. In a top view of the electronic device, the first openings are arranged along a long edge of the first pad, and an outline of at least one first opening has a curved shape.Type: ApplicationFiled: June 1, 2023Publication date: September 28, 2023Applicant: InnoLux CorporationInventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu
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Patent number: 11753568Abstract: An adhesive composition includes 0.1 to 1 part by weight of nano panicles, 50 to 95 parts by weight of acrylate resin, and 5 to 50 parts by weight of a monomer or oligomer of acrylate or acrylic acid containing multi-functional groups, and the acrylate resin and the monomer or oligomer of acrylate or acrylic acid containing multi-functional groups have a total weight of 100 parts by weight, in which the acrylate resin has a weight average molecular weight of 100,000 to 1,500,000. The nano particle has a shell covering parts of the surface of the core, and acrylate groups grafted to the surface of the core.Type: GrantFiled: February 28, 2022Date of Patent: September 12, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ming-Tzung Wu, Te-Yi Chang, Yao-Jheng Huang, Yu-Chin Lin, Chen-Cheng Yu, Yu-Ying Hsu, Shuang-Huei Chen
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Patent number: 11722020Abstract: A stator of a brushless motor has an iron core, a bobbin, and a winding assembly. The iron core has multiple stator poles mounted on an interior annular surface of a core body and spaced apart from each other. The bobbin is mounted on one of two open ends of the core body and has a substrate, at least one neutral connector mounted on an upper surface of the substrate, and at least one neutral solder pad mounted in the at least one neutral connector. The winding assembly is formed by one wire wound on multiple stator poles and the connectors. The winding assembly is electrically connected to the at least one neutral solder pad.Type: GrantFiled: April 26, 2021Date of Patent: August 8, 2023Assignee: Techway Industrial Co., Ltd.Inventors: Fu Hsiang Chung, Hong Fang Chen, Shih Wei Hung, Wei Ting Chen, Yu Chin Lin
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Patent number: 11705392Abstract: The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.Type: GrantFiled: March 10, 2022Date of Patent: July 18, 2023Assignee: InnoLux CorporationInventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu
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Publication number: 20230183533Abstract: An adhesive composition includes 0.1 to 1 part by weight of nano panicles, 50 to 95 parts by weight of acrylate resin, and 5 to 50 parts by weight of a monomer or oligomer of acrylate or acrylic acid containing multi-functional groups, and the acrylate resin and the monomer or oligomer of acrylate or acrylic acid containing multi-functional groups have a total weight of 100 parts by weight, in which the acrylate resin has a weight average molecular weight of 100,000 to 1,500,000. The nano particle has a shell covering parts of the surface of the core, and acrylate groups grafted to the surface of the core.Type: ApplicationFiled: February 28, 2022Publication date: June 15, 2023Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ming-Tzung WU, Te-Yi CHANG, Yao-Jheng HUANG, Yu-Chin LIN, Chen-Cheng YU, Yu-Ying HSU, Shuang-Huei CHEN
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Patent number: 11611284Abstract: An isolated switching power converter is presented. The isolated switching converter includes a transformer, a secondary-side switch and a secondary-side controller. The transformer has a primary winding coupled to an input, a first secondary winding coupled to a first output for providing a first output voltage, and a second secondary winding coupled to a second output for providing a second output voltage. The secondary-side switch is coupled to the second secondary winding. The secondary-side controller compares the second output voltage with a first reference voltage and generates a control signal based on the comparison to operate the secondary-side switch.Type: GrantFiled: June 10, 2021Date of Patent: March 21, 2023Assignee: Dialog Semiconductor (UK) LimitedInventor: Yu-Chin Lin
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Publication number: 20220399822Abstract: An isolated switching power converter is presented. The isolated switching converter includes a transformer, a secondary-side switch and a secondary-side controller. The transformer has a primary winding coupled to an input, a first secondary winding coupled to a first output for providing a first output voltage, and a second secondary winding coupled to a second output for providing a second output voltage. The secondary-side switch is coupled to the second secondary winding. The secondary-side controller compares the second output voltage with a first reference voltage and generates a control signal based on the comparison to operate the secondary-side switch.Type: ApplicationFiled: June 10, 2021Publication date: December 15, 2022Inventor: Yu-Chin Lin
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Publication number: 20220227771Abstract: An androgen receptor (AR) binding molecule has the structure of Formula (I) shown in the following: wherein E and G independently are CH2 or CH, is OH, NH2, OTf or C?C, X is CF3 or trifluorophenyl, and Y and Z independently are CH2 or CH; or is absent, X is CF3, and Y and Z independently are CH2.Type: ApplicationFiled: December 23, 2021Publication date: July 21, 2022Applicant: Industrial Technology Research InstituteInventors: Chih-Wei FU, Hao-Hsuan LIU, Chiu-Lien HUNG, Yu-Chin LIN, Tsan-Lin HU, Chien-Chin HUANG
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Publication number: 20220199514Abstract: The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.Type: ApplicationFiled: March 10, 2022Publication date: June 23, 2022Applicant: InnoLux CorporationInventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu
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Patent number: 11318153Abstract: A method of using Neoandrographolide for lowering blood sugar, lowering blood lipid, improving liver function and improving renal function. The method includes preparing a composition comprising Neoandrographolide as the active ingredient, and administering the composition to lower the blood sugar or blood lipid of a user, to prevent a decrease in liver function of a user, or to improve the renal function of a user. The Neoandrographolide is the only active ingredient in the composition.Type: GrantFiled: June 22, 2019Date of Patent: May 3, 2022Assignee: Bialpha International Sdn. Bhd.Inventors: Yu-Chin Lin, Ching-Wen Chang
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Patent number: 11302622Abstract: The present disclosure provides an electronic device including a substrate, a first pad, a second pad and an integrated circuit chip. The first pad is disposed on the substrate. The second pad is disposed on the first pad and electrically connected to the first pad. The integrated circuit chip is disposed on the second pad and is electrically connected to the second pad. The second pad has a plurality of curved corners.Type: GrantFiled: May 11, 2020Date of Patent: April 12, 2022Assignee: InnoLux CorporationInventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu
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Publication number: 20210351637Abstract: A stator of a brushless motor has an iron core, a bobbin, and a winding assembly. The iron core has multiple stator poles mounted on an interior annular surface of a core body and spaced apart from each other. The bobbin is mounted on one of two open ends of the core body and has a substrate, at least one neutral connector mounted on an upper surface of the substrate, and at least one neutral solder pad mounted in the at least one neutral connector. The winding assembly is formed by one wire wound on multiple stator poles and the connectors. The winding assembly is electrically connected to the at least one neutral solder pad.Type: ApplicationFiled: April 26, 2021Publication date: November 11, 2021Inventors: Fu Hsiang Chung, Hong Fang Chen, Shih Wei Hung, Wei Ting Chen, Yu Chin Lin
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Publication number: 20210344254Abstract: A motor structure includes a housing, a stator winding and at least one thermal conductive pad. The housing includes an internal space. The stator winding is received in the internal space. The at least one thermal conductive pad is abutted against the stator winding. The heat of the stator winding can be transmitted by the at least one thermal conductive pad.Type: ApplicationFiled: April 21, 2021Publication date: November 4, 2021Inventors: FU-HSIANG CHUNG, SHIH-WEI HUNG, YU-CHIN LIN, WEI-LIN HSU
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Publication number: 20200395286Abstract: The present disclosure provides an electronic device including a substrate, a first pad, a second pad and an integrated circuit chip. The first pad is disposed on the substrate. The second pad is disposed on the first pad and electrically connected to the first pad. The integrated circuit chip is disposed on the second pad and is electrically connected to the second pad. The second pad has a plurality of curved corners.Type: ApplicationFiled: May 11, 2020Publication date: December 17, 2020Inventors: Mei-Chi Hsu, Yu-Chin Lin, Yu-Ting Liu
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Publication number: 20190388446Abstract: A method of using Neoandrographolide for lowering blood sugar, lowering blood lipid, improving liver function and improving renal function. The method includes preparing a composition comprising Neoandrographolide as the active ingredient, and administering the composition to lower the blood sugar or blood lipid of a user, to prevent a decrease in liver function of a user, or to improve the renal function of a user. The Neoandrographolide is the only active ingredient in the composition.Type: ApplicationFiled: June 22, 2019Publication date: December 26, 2019Applicant: Bioalpha International Sdn. Bhd.Inventors: Yu-Chin Lin, Ching-Wen Chang