Abstract: A method includes forming a first material layer on a semiconductor wafer, the first material layer comprising a first periodic structure within an overlay mark region of the semiconductor wafer and forming a second material layer on the semiconductor wafer, the second material layer comprising a second periodic structure in the overlay mark region. The method further includes with an acoustic transmitter device disposed within the overlay mark region, transmitting an acoustic wave across both the first periodic structure and the second periodic structure. The method further includes, with an acoustic wave receiver device, detecting the acoustic wave and determining an overlay error between the first material layer and the second material layer based on the acoustic wave as detected by the acoustic wave receiver device.

Abstract: A detection method for a pellicle membrane of a photomask includes applying a predetermined pressure under which the pellicle membrane undergoes a deformation, measuring and calculating at least one of deformation level, Young's modulus, and flexural rigidity level of the pellicle membrane by detection, and obtaining a detection result about the pellicle membrane according to at least one of the deformation level, Young's modulus, and flexural rigidity level of the pellicle membrane, so as to evaluate the quality of the pellicle membrane.

Abstract: An overlay mark includes a first, a second, a third, and a fourth component. The first component is located in a first region of the first overlay mark and includes a plurality of gratings that extend in a first direction. The second component is located in a second region of the first overlay mark and includes a plurality of gratings that extend in the first direction. The third component is located in a third region of the first overlay mark and includes a plurality of gratings that extend in a second direction different from the first direction. The fourth component is located in a fourth region of the first overlay mark and includes a plurality of gratings that extend in the second direction. The first region is aligned with the second region. The third region is aligned with the fourth region.

Abstract: Methods for manufacturing a semiconductor structure are provided. A substrate is provided. A first lithography is performed according to a first layer mask, to form a plurality of first photonic crystals with a first pitch on a first area of a layer above the substrate. A second lithography is performed according to a second layer mask, to form a plurality of second photonic crystals with a second pitch on a second area of the layer. A light is provided to illuminate the first and second photonic crystals. Light reflected by the first and second photonic crystals or transmitted through the first and second photonic crystals is received. The received light is analyzed to detect overlay-shift between the first photonic crystals corresponding to the first layer mask and the second photonic crystals corresponding to the second layer mask.

Abstract: An apparatus configured to load or unload a mask pod includes a first load port supporter and a second load port supporter spaced apart from the first load port supporter. Each of the first load port supporter and the second load port supporter includes at least portions of an L-shaped rectangular prism. The first load port supporter and the second load port supporter are disposed diagonally around a rectangular area, where first inner sidewalls of the first load port supporter and second inner sidewalls of the second load port supporter delimit boundaries of the rectangular area, and where a first width of the rectangular area is equal to a second width of the mask pod, and a first length of the rectangular area is equal to a second length of the mask pod.

Abstract: A transportation container is provided with a container body constructed of a top wall, a bottom wall, a rear wall, and two sidewalls forming a front opening for loading or unloading a reticle pod into or out of the container body; a lid for opening and closing the front opening; and a lift plate above the container body configured to connect to a carrier of an overhead hoist transfer (OHT) system.

Abstract: A structure includes a first periodic structure positioned on a chip, the first periodic structure comprising a material of a first layer disposed on the chip. The structure further includes a second periodic structure positioned within the region of the chip adjacent the first periodic structure, the second periodic structure comprising a second material of a second layer disposed on the chip. The structure further includes an acoustic wave transmitter device disposed on the chip and an acoustic wave receiver device disposed on the chip.

Abstract: The invention provides anti-CaENO1 antibodies and humanized antibodies as effective diagnostic agent or therapeutic treatment against infections caused by Candida spp. (preferably Candida. albicans, Candida tropicalis), fluconazole resistance Candida spp., Streptococcus, or Staphylococcus.

Abstract: Methods and systems disclosed herein use acoustic energy to determine a gap between a wafer and an integrated circuit (IC) processing system and/or determine a thickness of a material layer of the wafer during IC processing implemented by the IC processing system. An exemplary method includes emitting acoustic energy through a substrate and a material layer disposed thereover. The substrate is positioned within an IC processing system. The method further includes receiving reflected acoustic energy from a surface of the substrate and a surface of the material layer disposed thereover and converting the reflected acoustic energy into electrical signals. The electrical signals indicate a thickness of the material layer.

Abstract: An overlay mark includes a first, a second, a third, and a fourth component. The first component is located in a first region of the first overlay mark and includes a plurality of gratings that extend in a first direction. The second component is located in a second region of the first overlay mark and includes a plurality of gratings that extend in the first direction. The third component is located in a third region of the first overlay mark and includes a plurality of gratings that extend in a second direction different from the first direction. The fourth component is located in a fourth region of the first overlay mark and includes a plurality of gratings that extend in the second direction. The first region is aligned with the second region. The third region is aligned with the fourth region.

Abstract: A method includes depositing a first dielectric layer over a substrate; forming a first dummy metal layer over the first dielectric layer, wherein the first dummy metal layer has first and second portions laterally separated from each other; depositing a second dielectric layer over the first dummy metal layer; etching an opening having an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first dummy metal layer, and a lower portion in the first dielectric layer, wherein a width of the lower portion of the opening is greater than a width of the middle portion of the opening, and a bottom of the opening is higher than a bottom of the first dielectric layer; and forming a dummy via in the opening and a second dummy metal layer over the dummy via and the second dielectric layer.

Abstract: A global dynamic detection method for a protective film of a photomask includes: causing the protective film to undergo broadband oscillation; applying a broadband signal to the protective film undergoing multi-frequency oscillation; transforming an optical time-domain signal reflecting off the protective film to obtain a frequency spectrum with multiple resonance frequencies; and detecting the protective film with the frequency spectrum comprehensively to ensure the quality of the protective film. A global dynamic detection system for use with the global dynamic detection method is further provided.

Abstract: Methods and systems disclosed herein use acoustic energy to determine a gap between a wafer and an integrated circuit (IC) processing system and/or determine a thickness of a material layer of the wafer during IC processing implemented by the IC processing system. An exemplary method includes emitting acoustic energy through a substrate and a material layer disposed thereover. The substrate is positioned within an IC processing system. The method further includes receiving reflected acoustic energy from a surface of the substrate and a surface of the material layer disposed thereover and converting the reflected acoustic energy into electrical signals. The electrical signals indicate a thickness of the material layer.

Abstract: An automotive seat rail includes a rail and an engaging structure. The engaging structure includes a fixing frame, an engaging member and an elastic member. The fixing frame includes a fixing portion and an abutting portion fixed to and abutting an inner rail respectively. The engaging member includes an engaging section, a base section, and a stress section sequentially coupled to each other and bent with respect to each other. The base section is pivotally coupled to the fixing frame, and the engaging section is engaged between the inner and outer rails. When the stress section is controlled by an external force, the engaging section is driven to release the engagement between the inner rail and the outer rail, so as to ensure the accurate action of the engaging structure and allow the engaging member to have better structural strength, smoother control, and more accurate engagement and disengagement effects.

Abstract: A system and method for determining clearance between a fabrication tool and a workpiece is provided. In an exemplary embodiment, the method includes receiving a substrate within a tool such that a gap is defined there between. A transducer disposed on a bottom surface of the substrate opposite the gap provides an acoustic signal that is conducted through the substrate. The transducer also receives a first echo from a top surface of the substrate that defines the gap and a second echo from a bottom surface of the tool that further defines the gap. A width of the gap is measured based on the first echo and the second echo. In some embodiments, the bottom surface of the tool is a bottom surface of a nozzle, and the nozzle provides a liquid or a gas in the gap while the transducer is receiving the first and second echoes.

Abstract: A semiconductor device and a method of manufacture thereof are provided. The method for manufacturing the semiconductor device includes forming a first dielectric layer on a substrate. Next, forming a first dummy metal layer on the first dielectric layer. Then, forming a second dielectric layer over the first dummy metal layer. Furthermore, forming an opening in the second dielectric layer and the first dummy metal layer. Then, forming a dummy via in the opening, wherein the dummy via extending through the second dielectric layer and at least partially through the first dummy metal layer. Finally, forming a second dummy metal layer on the second dielectric layer and contact the dummy via.

Abstract: An electric drive mechanism of a seat rail includes a front frame, a rear frame, a gear assembly, a lead screw and a bumper. The front frame and rear frame are separated from each other and fixed to an outer rail of a slide rail; the lead screw is spanned across the front frame and rear frame; the gear assembly driven by a driving device is fixed to an inner rail of the slide rail and engaged with the lead screw; the bumper is installed at the rear frame provide a buffering effect between the gear assembly and the rear frame, so as to prevent the production of abnormal sounds caused by colliding the gear assembly with the rear frame directly.

Abstract: Anti-CaENO1 antibodies and humanized antibodies are provided as an effective diagnostic agent or a therapeutic treatment against infections caused by Candida spp., preferably Candida albicans, Candida tropicalis, fluconazole resistance Candida spp., Streptococcus, Staphylococcus.

Abstract: A transportation container is provided with a container body constructed of a top wall, a bottom wall, a rear wall, and two sidewalls forming a front opening for loading or unloading a reticle pod into or out of the container body; a lid for opening and closing the front opening; and a lift plate above the container body configured to connect to a carrier of an overhead hoist transfer (OHT) system.

Abstract: The invention relates to anti-EGF like domain multiple 6 antibody (anti-EGFL6 antibody) and cancer detection (or diagnosis) and treatment using the anti-EGFL6 antibody. The present invention creates anti-EGFL6 antibodies, particularly, a single-chain antibody fragments (scFv) and humanized antibody, which have ability in binding to EGFL6 and in inhibiting angiogenesis and cancer cell growth.