Patents by Inventor Yu-Chun Hsiao

Yu-Chun Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240388290
    Abstract: A keyswitch assembly includes a keycap, a lifting mechanism, a shield, and a substrate. The lifting mechanism includes a keycap end coupled to the keycap and is capable of being driven by a force to move downward by a distance. The shield extends from the keycap end or the keycap and is movable along with the keycap end or the keycap. The substrate is disposed below the lifting mechanism and includes a sensing switch and a keyswitch circuit electrically connected to each other. The sensing switch has a signal channel and is configured to sense a change in sensed intensity caused by interference of the shield with the signal channel to cause the keyswitch circuit to generate at least one keyswitch signal. During movement of the shield with the keycap end or the keycap, the shield interferes with the signal channel as much as possible throughout the entire distance.
    Type: Application
    Filed: May 14, 2024
    Publication date: November 21, 2024
    Inventors: Chen YANG, Shao-Lun HSIAO, Yu-Chun HSIEH
  • Publication number: 20240363779
    Abstract: The present invention provides a photovoltaic panel packaging structure and method for the same. The packaging structure comprises a frame and a solar photovoltaic panel. The solar photovoltaic panel includes a first frame surface and a second frame surface with a receiving space and grooves formed therein. The a solar photovoltaic panel is installed in the receiving space and stacked on top of a first stop portion. The solar photovoltaic panel includes a first encapsulating layer, a second encapsulating layer. The first encapsulating layer includes a plurality of engaging strips extending along the edges of the solar photovoltaic panel, the engaging strips are respectively embedded in the corresponding grooves to hold the solar photovoltaic panel in place in the frame. Meanwhile, a third encapsulating layer extends to connect to the second frame surface. As a result, weight and thickness can be reduced while reducing multiple packaging passes and simplifying the assembly process.
    Type: Application
    Filed: July 17, 2023
    Publication date: October 31, 2024
    Inventors: Yao-Chung Hsiao, Hui-Yun Wu, Hung-Chun Wang, Yu-Sheng Kuo
  • Publication number: 20240355630
    Abstract: A semiconductor structure including a pillar structure and a spacer structure is provided. The pillar structure is disposed over a substrate, and comprises: a lower layer, disposed on the substrate; an upper layer, disposed over the lower layer; and a dielectric layer, disposed between the lower layer and the upper layer, wherein the upper layer includes a first portion and a second portion disposed below and connecting the first portion. The spacer structure laterally surrounds the pillar structure, and comprises: an upper portion, surrounding the first portion of the upper layer; and a lower portion, disposed below and connecting the upper portion, wherein a first thickness of the upper portion is substantially greater than a second thickness of the lower portion. A method for manufacturing a semiconductor structure is also provided.
    Type: Application
    Filed: April 20, 2023
    Publication date: October 24, 2024
    Inventors: YU-CHUN SHEN, CHI-CHUNG JEN, KAI-HUNG HSIAO, SZU-HSIEN LEE, WEN-CHIH CHIANG
  • Publication number: 20240332220
    Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, package-side bump structures located on a first side of the interconnect-level dielectric material layers, at least one dielectric capping layer located on a second side of the interconnect-level dielectric material layers, a bonding-level dielectric layer located on the at least one dielectric capping layer, metallic pad structures including pad via portions embedded in the at least one dielectric capping layer and pad plate portions embedded in the bonding-level dielectric layer, and an edge seal ring structure vertically extending from a first horizontal plane including bonding surfaces of the package-side bump structures to a second horizontal plane including distal planar surfaces of the metallic pad structures.
    Type: Application
    Filed: June 13, 2024
    Publication date: October 3, 2024
    Inventors: Hong-Seng Shue, Yao-Chun Chuang, Yu-Tse Su, Chen-Shien Chen, Ching-Wen Hsiao, Ming-Da Cheng
  • Patent number: 12080492
    Abstract: A keyswitch structure includes a lift mechanism and a keycap. Two supports of the lift mechanism support the keycap. There can be a spring structure connecting the two supports for driving the two supports to lift the keycap. The lift mechanism defines a central space extending through the whole lift mechanism in a vertical direction. The spring structure does not enter the central space. The two supports abut against and constrain each other through corresponding structures, to mutually rotate with respect to a rotation axis. The keyswitch structure can include a switch. The switch includes an intermediate support, detachably abutting downward against the lift mechanism or the keycap, and a resilient part, detachably abutting downward against the intermediate support. In the process of pressing the keycap, the intermediate support is separated from the lift mechanism or the keycap, so that the contact force of the switch can be maintained constant.
    Type: Grant
    Filed: November 18, 2022
    Date of Patent: September 3, 2024
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Chen Yang, Ling-Hsi Chao, Shao-Lun Hsiao, Yu-Chun Hsieh
  • Publication number: 20240258145
    Abstract: A semiconductor wafer processing system includes a stocker having an interior surface, a wafer carrier disposed within the stocker, a wafer shelf disposed within the wafer carrier for storing a semiconductor wafer, and a discharge circuit including a first conductor electrically coupled to the wafer shelf and a first current controller electrically coupled to the first conductor and to the interior surface of the stocker.
    Type: Application
    Filed: February 12, 2024
    Publication date: August 1, 2024
    Inventors: Kai-Hung HSIAO, Chi-Chung JEN, Yu-Chun SHEN, Jhang-Jie JIAN, Wen-Chih CHIANG
  • Patent number: 12040289
    Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, package-side bump structures located on a first side of the interconnect-level dielectric material layers, at least one dielectric capping layer located on a second side of the interconnect-level dielectric material layers, a bonding-level dielectric layer located on the at least one dielectric capping layer, metallic pad structures including pad via portions embedded in the at least one dielectric capping layer and pad plate portions embedded in the bonding-level dielectric layer, and an edge seal ring structure vertically extending from a first horizontal plane including bonding surfaces of the package-side bump structures to a second horizontal plane including distal planar surfaces of the metallic pad structures.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: July 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Hong-Seng Shue, Ming-Da Cheng, Ching-Wen Hsiao, Yao-Chun Chuang, Yu-Tse Su, Chen-Shien Chen
  • Patent number: 11548552
    Abstract: A steering device includes a steering power unit, a transmission unit, an upper control arm, a steering element, an eccentric bolt and a steering knuckle. The steering power unit has at least one torque-output end. The transmission unit is connected with the torque-output end. The steering element is connected with the transmission unit. The eccentric bolt, installed at the upper control arm, is connected with the steering power unit. The steering knuckle, mounted to a wheel disc, is connected with the steering element and the upper control arm, and used for controlling the wheel disc. The steering power unit drives the steering element to push or pull the steering knuckle for controlling a turning angle, and simultaneously drives the eccentric bolt to have the upper control arm to push or pull the steering knuckle for varying a camber angle of the wheel disc. In addition, a steering method is provided.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: January 10, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Peng-Yu Chen, Chia Tsao, Cheng-Han Ho, Yu-Chun Hsiao, Fang-Ming Lee
  • Publication number: 20220204077
    Abstract: A steering control device is provided to output a vehicle steering control signal to a wire-controlled vehicle. The wire-controlled vehicle generates a vehicle steering feedback signal corresponding to the vehicle steering control signal. The steering load drive unit is configured to feedback a steering feel to an operator. The response discrimination unit obtains a steering angle command, a steering angle feedback, and a vehicle velocity according to the vehicle steering control signal and the feedback signal, and performs a Fourier transform to obtain a steering angle gain and a steering angle phase to identify a response characteristic of the wire-controlled vehicle. The steering angle feedback, vehicle velocity, steering angle gain, and steering angle phase are inputted into a steering system model to simulate a steering load of the wire-controlled vehicle, and the steering load is inputted to the steering load drive unit to generate the steering feel.
    Type: Application
    Filed: December 29, 2020
    Publication date: June 30, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Chun HSIAO, Yi-Lun CHENG, Yung-Chen WANG
  • Publication number: 20210155290
    Abstract: A steering device includes a steering power unit, a transmission unit, an upper control arm, a steering element, an eccentric bolt and a steering knuckle. The steering power unit has at least one torque-output end. The transmission unit is connected with the torque-output end. The steering element is connected with the transmission unit. The eccentric bolt, installed at the upper control arm, is connected with the steering power unit. The steering knuckle, mounted to a wheel disc, is connected with the steering element and the upper control arm, and used for controlling the wheel disc. The steering power unit drives the steering element to push or pull the steering knuckle for controlling a turning angle, and simultaneously drives the eccentric bolt to have the upper control arm to push or pull the steering knuckle for varying a camber angle of the wheel disc. In addition, a steering method is provided.
    Type: Application
    Filed: December 23, 2019
    Publication date: May 27, 2021
    Inventors: Peng-Yu Chen, Chia Tsao, Cheng-Han Ho, Yu-Chun Hsiao, Fang-Ming Lee
  • Patent number: 10649129
    Abstract: The present invention discloses a light guide plate, a backlight module and a display device. The light guide plate comprises a light conversion layer, the light conversion layer is arranged at a light emitting plane of the light guide plate for receiving a first light and converting the same to at least a second light to emit. According to the aforesaid aspect, the present invention can improve the display effect of the display device by making the emitted light have a better diffusivity and a larger brightness view angle.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: May 12, 2020
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Jianyu Chang, Yung-jui Lee, Yu-chun Hsiao, Sheng-Jer Chang Chien, Lixuan Chen
  • Patent number: 10591776
    Abstract: The present application discloses a backlight module and a display device, the backlight module including a light source for emitting at least a first light; at least two sheets of light conversion films, wherein at least one sheet of light conversion films receives the first light and converts the light into at least a second light to emit, and makes the light emitting angle of the backlight module matching the wide viewing angle display requirements. It can increase the light emitting angle of the backlight module and achieve the wide viewing angle effect. By having at least two sheets of light conversion films at the same time, a part of the light is reflected back while the light is scattered and emitted at the same time, and the light is excited and emitted again, to improve the light utilization rate, enhance the brightness to have a better performance of display.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: March 17, 2020
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Jianyu Chang, Yung-jui Lee, Yu-chun Hsiao, Sheng-Jer Chang Chien, Zanjia Su
  • Patent number: 10527774
    Abstract: The invention provides an optical film assembly, a backlight module, and a display device. The backlight module includes a light source emitting at least a first light, a first optical film, and a second optical film laminated to the first optical film, wherein the first optical film includes a base film and a functional layer stacking up to the base film, the functional layer is a diffusion film, a brightness enhancement film, a reflection film, or a prism film, the second optical film is a light conversion layer, the light conversion layer receives the first light and converts the first light to a second light to emit, such that a light emission angle of the backlight module matches a requirement of wide viewing angle. The invention could broaden the light emitting angle of the backlight module to make the display device with the backlight module achieve wide viewing angle.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: January 7, 2020
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Jianyu Chang, Yung-jui Lee, Yu-chun Hsiao, Sheng-Jer Chang Chien, Zanjia Su, Bo Hai
  • Patent number: 10531579
    Abstract: The present application discloses a display device, a backplane and the mold for manufacturing the backplane bracket. The mold is used to imprint molding the sheet raw material; the mold has an elongated imprint mold structure; the two ends of the imprint mold structure have a male and female interworking mold structures; by placing the raw material with different lengths in a plurality of predetermined positions in the imprint mold structure can form a plurality of brackets for combining to a backplane. The present application provides a backplane and the simplified mold structures for manufacturing the backplane bracket, the process to manufacturing the backplane is simplified. By adapting a set of mold can manufacture a plurality of the needed bracket to form a backplane, which greatly reduces the cost of production.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: January 7, 2020
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Yu-chun Hsiao, Taiyong Yin, Guofu Tang, Quan Li, Gang Yu
  • Patent number: 10451789
    Abstract: A liquid crystal display device and a backlight module are disclosed. The backlight module includes a first light-emitting element; a clamper, which is provided with a curved groove and used for accommodating the first light-emitting element; and a light guide plate that is arranged outside the clamper and provided with a curved end surface which faces the first light-emitting element. The curved end surface and the curved groove are aligned with each other. The liquid crystal display device includes the aforesaid backlight module. The cost of the backlight module is relatively low. A curved liquid crystal display device provided with the backlight module can have a good display effect.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: October 22, 2019
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Yu Chun Hsiao, Shih Hsiang Chen, Chengwen Que, Dehua Li
  • Patent number: 10424700
    Abstract: The present disclosure relates to a LED lamp source and the manufacturing method and the backlight module thereof. The LED lamp source includes a substrate and a LED chip, fluorescent adhesive, and a white reflective layer being fixed on the substrate. The fluorescent adhesive encapsulates the LED chip on the substrate, and the white reflective layer is configured for reflecting light beams emitted from the fluorescent adhesive and being radiated on the white reflective layer. A positive projection of the fluorescent adhesive on the substrate is within the positive projection of the white reflective layer on the substrate.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: September 24, 2019
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Yong Fan, Yu-chun Hsiao, Sheng-Jer Chang Chien
  • Patent number: 10359559
    Abstract: The invention provides an optical film assembly, a backlight module, and a display device. The backlight module includes a light source emitting at least a first light, a first optical film, and a second optical film laminated to the first optical film, wherein the first optical film includes a functional layer but does not include a base film, the functional layer is a diffusion film, a brightness enhancement film, a reflection film, or a prism film, and the second optical film is a light conversion layer, the light conversion layer receives the first light and converts the first light to at least a second light to emit, such that a light emission angle of the backlight module matches a requirement of wide viewing angle. The invention could broaden the light emitting angle of the backlight module to make the display device with the backlight module achieve wide viewing angle.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: July 23, 2019
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Jianyu Chang, Yung-jui Lee, Yu-chun Hsiao, Sheng-Jer Chang Chien, Zanjia Su, Bo Hai
  • Patent number: D930043
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: September 7, 2021
    Assignee: FUSIN INDUSTRIAL CO., LTD.
    Inventor: Yu-Chun Hsiao
  • Patent number: D939586
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: December 28, 2021
    Assignee: FUSIN INDUSTRIAL CO., LTD.
    Inventor: Yu-Chun Hsiao
  • Patent number: D939587
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: December 28, 2021
    Assignee: FUSIN INDUSTRIAL CO.. LTD.
    Inventor: Yu-Chun Hsiao