Patents by Inventor Yu-Chun Wu

Yu-Chun Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151642
    Abstract: A terahertz wave detection chip includes a substrate and at least one detection structure. The detection structure is disposed on a surface of the substrate. The detection structure includes a metamaterial layer and a hydrophilic layer, and the hydrophilic layer is disposed on the metamaterial layer.
    Type: Application
    Filed: December 22, 2022
    Publication date: May 9, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Tai LI, Kao-Chi LIN, Cho-Fan HSIEH, Teng-Chun WU
  • Patent number: 11980076
    Abstract: A tiled display device includes two panels and two cover layers respectively disposed on the two panels. The two cover layers include a contact region. A top portion and a bottom portion of the contact region have a height H. One of the two cover layers has a thickness Tn. One of the two panels has a distance Xn between an upper surface of the one of the two panels and the bottom portion of the contact region. The one of the two panels is corresponding to the one of the two cover layers. The height H, the thickness Tn and the distance Xn satisfy the equation: 0<H/(Xn+Tn)<0.8.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: May 7, 2024
    Assignee: InnoLux Corporation
    Inventors: Ping-Hsun Tsai, Shih-Fu Liao, I-An Yao, Yu-Chun Hsu, Yung-Hsun Wu, Sheng-Nan Fan
  • Publication number: 20240113071
    Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.
    Type: Application
    Filed: January 5, 2023
    Publication date: April 4, 2024
    Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
  • Patent number: 11944970
    Abstract: A microfluidic detection unit comprises at least one fluid injection section, a fluid storage section and a detection section. Each fluid injection section defines a fluid outlet; the fluid storage section is in gas communication with the atmosphere and defines a fluid inlet; the detection section defines a first end in communication with the fluid outlet and a second end in communication with the fluid inlet. A height difference is defined between the fluid outlet and the fluid inlet along the direction of gravity. When a first fluid is injected from the at least one fluid injection section, the first fluid is driven by gravity to pass through the detection section and accumulate to form a droplet at the fluid inlet, such that a state of fluid pressure equilibrium of the first fluid is established.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: April 2, 2024
    Assignees: INSTANT NANOBIOSENSORS, INC., INSTANT NANOBIOSENSORS CO., LTD.
    Inventors: Yu-Chung Huang, Yi-Li Sun, Ting-Chou Chang, Jhy-Wen Wu, Nan-Kuang Yao, Lai-Kwan Chau, Shau-Chun Wang, Ying Ting Chen
  • Publication number: 20240094104
    Abstract: An embodiment interfacial bonding test structure may include a first substrate having a first planar surface, a second substrate having a second planar surface that is parallel to the first planar surface, a first semiconductor die, and a second semiconductor die, each semiconductor die bonded between the first substrate and the second substrate thereby forming a sandwich structure. The first semiconductor die and the second semiconductor die may be bonded to the first surface with a first adhesive and may be bonded to the second surface with a second adhesive. The first semiconductor die and the second semiconductor die may be displaced from one another by a first separation along a direction parallel to the first planar surface and the second planar surface. The second substrate may include a notch having an area that overlaps with an area of the first separation in a plan view.
    Type: Application
    Filed: April 20, 2023
    Publication date: March 21, 2024
    Inventors: Yu-Sheng Lin, Jyun-Lin Wu, Yao-Chun Chuang, Chin-Fu Kao
  • Publication number: 20240088307
    Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 11929318
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Publication number: 20240071974
    Abstract: A semiconductor package includes a substrate and at least one integrated circuit (IC) die. Substrate solder resist has substrate solder resist openings exposing substrate bonding pads of the bonding surface of the substrate, and die solder resist has aligned die solder resist openings exposing die bonding pads of the bonding surface of the IC die. A ball grid array (BGA) electrically connects the die bonding pads with substrate bonding pads via the die solder resist openings and the substrate solder resist openings. The die solder resist openings include a subset A of the die solder resist openings in a region A of the bonding surface of the IC die and a subset B of the die solder resist openings in a region B of the bonding surface of the IC die. The die solder resist openings of subset A are larger than those of subset B.
    Type: Application
    Filed: August 30, 2022
    Publication date: February 29, 2024
    Inventors: Yu-Sheng Lin, Chen-Nan Chiu, Jyun-Lin Wu, Yao-Chun Chuang
  • Publication number: 20240001414
    Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.
    Type: Application
    Filed: July 20, 2023
    Publication date: January 4, 2024
    Inventors: Meng-Hsueh WU, Faung Yu Kuo, Kai Yu Liu, Yu-Chun Wu, Jao Huang, Wei-Yi Chen
  • Patent number: 11849723
    Abstract: A dispersion includes a zinc oxide component, and an aromatic polyol which is represented by Formula (I) and which has terminal hydroxyl groups that form chelating bonds with zinc atoms of the zinc oxide component, wherein p and q are independently integers ranging from 1 to 40. A method for preparing the dispersion includes heating a composition including the aromatic polyol and a zinc-containing salt, so that the zinc-containing salt undergoes nucleophilic reaction and condensation reaction to form the zinc oxide component. A composition for preparing the dispersion is also disclosed.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: December 26, 2023
    Assignee: Far Eastern New Century Corporation
    Inventors: Li-Tzu Ting, Yu-Chun Wu, Wei-Che Hung
  • Patent number: 11779967
    Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: October 10, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Hsueh Wu, Fang Yu Kuo, Kai Yu Liu, Yu-Chun Wu, Jao Huang, Wei-Yi Chen
  • Publication number: 20230056414
    Abstract: A 3D cell culture gel kit and a 3D cell culture method using the same are provided. The 3D cell culture gel kit includes a gel material A, a buffer solution C, and a buffer solution D. The 3D cell culture method includes the steps of adding cells into a mixed solution containing the gel material A and setting the mixed solution at low temperature to get gel containing the cells. Then adding the buffer solution C to the gel for performing crosslinking. Next removing the buffer solution C and adding a growth medium. Let stand until the cells form spheroids in the gel. Moreover, the buffer solution D is used to dissolve the gel and the cells cultured are taken out for analysis. Thereby the 3D cell culture gel kit is convenient to use and suitable for 3D culture of a plurality of cell lines.
    Type: Application
    Filed: August 26, 2020
    Publication date: February 23, 2023
    Inventors: YU-CHUN WU, CHING-WEN LIU, WEI-YU LIN
  • Patent number: 11583197
    Abstract: A method for detecting cardiac arrhythmia based on a photoplethysmographic (PPG) signal is provided. The method includes: receiving a PPG signal and a motion signal corresponding to a motion made by a user; extracting PPG signal segments and motion signal segments corresponding to a time period from the PPG signal and the motion signal, respectively, at every time period; filtering out motion artifact noise in the PPG signal segments according to the PPG signal segments and the motion signal segments, and converting the PPG signal segments and the motion signal segments into PPG spectrum diagrams and motion spectrum diagrams, respectively; obtaining an estimated heart rate according to the PPG spectrum diagrams and the motion spectrum diagrams; and determining whether cardiac arrhythmia is present based on the filtered PPG signal segments and the estimated heart rate.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: February 21, 2023
    Assignee: ACER INCORPORATED
    Inventors: Jo-Hua Wu, Hsien-Yang Chiang, Yu-Chun Wu, Pin-Cyuan Lin, Ke-Han Pan, Yueh-Yarng Tsai
  • Publication number: 20210368785
    Abstract: A dispersion includes a zinc oxide component, and an aromatic polyol which is represented by Formula (I) and which has terminal hydroxyl groups that form chelating bonds with zinc atoms of the zinc oxide component, wherein p and q are independently integers ranging from 1 to 40. A method for preparing the dispersion includes heating a composition including the aromatic polyol and a zinc-containing salt, so that the zinc-containing salt undergoes nucleophilic reaction and condensation reaction to form the zinc oxide component. A composition for preparing the dispersion is also disclosed.
    Type: Application
    Filed: January 12, 2021
    Publication date: December 2, 2021
    Inventors: Li-Tzu Ting, Yu-Chun Wu, Wei-Che Hung
  • Publication number: 20210371618
    Abstract: A graphene dispersion includes a graphene and a polyol compound selected from the group consisting of an aromatic polyol represented by Formula (I), and a modified aromatic polyol made by subjecting the aromatic polyol represented by Formula (I) and an epoxidized vegetable oil to a ring opening reaction, wherein p and q are independently integers ranging from 1 to 20. A method for preparing the graphene dispersion, a composition for preparing a polyurethane composite material, and a polyurethane composite material made from the composition are also disclosed.
    Type: Application
    Filed: February 26, 2021
    Publication date: December 2, 2021
    Inventors: Yu-Chun Wu, Wei-Che Hung, Chun-Chieh Chien
  • Publication number: 20210268558
    Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.
    Type: Application
    Filed: December 23, 2020
    Publication date: September 2, 2021
    Inventors: M.H. WU, Fang-Yu KUO, Kai-Yu LIU, Yu-Chun WU, Jao Sheng HUANG, W.Y. CHEN
  • Patent number: 11095672
    Abstract: The disclosure provides a method for evaluating domain name and a server using the same method. The method includes: retrieving a raw domain name and dividing the raw domain name into a plurality of parts; retrieving a specific part of the parts, wherein the specific part include characters; encoding the characters into encoded data; padding the encoded data to a specific length; projecting the encoded data being padded as embedded vectors; sequentially inputting the embedded vectors to a plurality cells of a long short term memory model to generate a result vector; and converting the result vector to a prediction probability via a fully-connected layer and a specific function.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: August 17, 2021
    Assignee: Acer Cyber Security Incorporated
    Inventors: Pin-Cyuan Lin, Jun-Mein Wu, Yu-Chun Wu, Ming-Kung Sun, Zong-Cyuan Jhang, Yi-Chung Tseng, Chiung-Ying Huang
  • Publication number: 20210100465
    Abstract: The present disclosure provides a heart-rhythm signal-processing method, including the following steps: obtain PPG signals; perform a labeling operation to determine whether inappropriate signal data exist in the PPG signals and label the inappropriate signal data; perform a first separation operation to remove the inappropriate signal data from the PPG signals and separate the PPG signals into continuous signal segments; find peak positions of the continuous signal segments; perform a second separation operation to separate the continuous signal segments into sub-signal segments according to the number of peaks required for interpretation; perform a feature-extraction operation to obtain feature values respectively corresponding to each of the sub-signal segments, wherein the feature values are relative to peak-to-peak intervals (PPI) of the sub-signal segments; perform a judgement operation to judge the feature values using a judgement model and determine whether the heart rhythm of the subject is belong to
    Type: Application
    Filed: September 23, 2020
    Publication date: April 8, 2021
    Inventors: Ke-Han PAN, Yu-Chun WU, Yueh-Yarng TSAI, Pin-Cyuan LIN, Hsien-Yang CHIANG, Yen-Bin LIU
  • Patent number: 10931714
    Abstract: The disclosure provides a domain name recognition method and a domain name recognition device. The domain name recognition method includes the following steps. A first string of a first domain name and a second string of a second domain name are obtained. Multiple characters of the first string and the second string are classified into multiple clusters. Multiple vectors corresponding to the clusters are generated, wherein each of the characters corresponds to one of the vectors. A first vector set corresponding to the first string and a second vector set corresponding to the second string are generated. A similarity of the first vector set and the second vector set is calculated.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: February 23, 2021
    Assignee: Acer Cyber Security Incorporated
    Inventors: Pin-Cyuan Lin, Yu-Chun Wu, Ming-Kung Sun, Zong-Cyuan Jhang, Yi-Chung Tseng, Chiung-Ying Huang
  • Publication number: 20210032311
    Abstract: A non-human gene-edited mammal, a protein crude extract isolated from a connective tissue of the non-human gene-edited mammal, a method for preparing the protein crude extract, and uses of the protein crude extract are provided. The method includes: microinjecting a deoxyribonucleic acid sequence construct (DNA construct) containing SEQ ID NO: 4 or SEQ ID NO: 5 into a rat embryo, transplanting the rat embryo into a female rat of the same species to develop into a mature rat, and isolating a protein crude extract from a connective tissue of the mature rat. The protein crude extract includes human type I collagen and a non-native chimeric protein peptide chain.
    Type: Application
    Filed: September 25, 2017
    Publication date: February 4, 2021
    Inventors: Yu-Chun Wu, Pi-Hung Liao, Shih-Chieh Tsai