Patents by Inventor Yu-Hao Chen
Yu-Hao Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250041975Abstract: A laser slicing apparatus, in which a laser module provides a laser beam, and a light splitting element of a focusing lens set splits the laser beam into a plurality of focused laser beams to form a plurality of induce lines having first laser modified cracks in a modified layer at a predetermined depth inside a substrate. A rotating module rotates the light splitting element with an angle, and the light splitting element converts the focused laser beams according to this angle to form a plurality of modified groups between the induce lines. Each modified group includes a plurality of modified lines having second laser modified cracks, and the first laser modified cracks and the second laser modified cracks are connected to each other to form a continuous laser modified crack in the modified layer at the predetermined depth inside the substrate, thereby speeding up the laser slicing production.Type: ApplicationFiled: September 11, 2023Publication date: February 6, 2025Applicant: Industrial Technology Research InstituteInventors: Jyun-Jhih WANG, Chun-Ming CHEN, Yu-Chung LIN, Pin-Hao HU, Chien-Jung HUANG
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Patent number: 12218082Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.Type: GrantFiled: November 9, 2023Date of Patent: February 4, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Patent number: 12218009Abstract: A method of forming a semiconductor device includes forming a first dielectric layer over a front side of a wafer, the wafer having a plurality of dies at the front side of the wafer, the first dielectric layer having a first shrinkage ratio smaller than a first pre-determined threshold; curing the first dielectric layer at a first temperature, where after curing the first dielectric layer, a first distance between a highest point of an upper surface of the first dielectric layer and a lowest point of the upper surface of the first dielectric layer is smaller than a second pre-determined threshold; thinning the wafer from a backside of the wafer; and performing a dicing process to separate the plurality of dies into individual dies.Type: GrantFiled: August 1, 2023Date of Patent: February 4, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Meng-Che Tu, Wei-Chih Chen, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu
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Patent number: 12219732Abstract: A graphic card assembly includes a bracket, a graphic card module, a first fin set, a centrifugal fan, a second fin set, a heat pipe set and an axial flow fan. The graphic card module is assembled to the bracket and has at least one heat source. The first fin set and the second fin set are assembled to the bracket and the first fin set thermally contacts the heat source. The centrifugal fan is disposed beside the first fin set to generate a first air flow dissipating heat from the first fin set. The heat pipe set contacts the heat source. The axial flow fan is disposed on the second fin set to generate a second air flow dissipating heat from the second fin set. The first air flow and the second air flow are separated from each other, and the second air flow passes through the bracket and the graphic card module.Type: GrantFiled: August 5, 2022Date of Patent: February 4, 2025Assignee: Acer IncorporatedInventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Shu-Hao Kuo, Tsung-Ting Chen
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Publication number: 20250037858Abstract: The present invention disclose a medical image-based system for predicting lesion classification and a method thereof. The system comprises a feature data extracting module for providing a raw feature data based on a medical image, and a predicting module for outputting a predicted class and a risk index according to the raw feature data. The predicting module comprises a classification unit for generating the predicted class and a prediction score corresponding thereto according to the raw feature data, and a risk evaluation unit for generating the risk index according to the prediction score. The system provides medical personnels a reference score and a risk index to determine progression of a certain disease.Type: ApplicationFiled: February 1, 2024Publication date: January 30, 2025Inventors: YI-SHAN TSAI, YU-HSUAN LAI, CHENG-SHIH LAI, CHAO-YUN CHEN, MENG-JHEN WU, YI-CHUAN LIN, YI-TING CHIANG, PENG-HAO FANG, PO-TSUN KUO, YI-CHIH CHIU
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Publication number: 20250040213Abstract: A semiconductor structure includes a source/drain feature in the semiconductor layer. The semiconductor structure includes a dielectric layer over the source/drain feature. The semiconductor structure includes a silicide layer over the source/drain feature. The semiconductor structure includes a barrier layer over the silicide layer. The semiconductor structure includes a seed layer over the barrier layer. The semiconductor structure includes a metal layer between a sidewall of the seed layer and a sidewall of the dielectric layer, a sidewall of each of the silicide layer, the barrier layer, and the metal layer directly contacting the sidewall of the dielectric layer. The semiconductor structure includes a source/drain contact over the seed layer.Type: ApplicationFiled: July 27, 2023Publication date: January 30, 2025Applicant: Taiwan Semiconductor Manufacturing Company Ltd.Inventors: Yi-Hsiang Chao, Peng-Hao Hsu, Yu-Shiuan Wang, Chi-Yuan Chen, Yu-Hsiang Liao, Chun-Hsien Huang, Hung-Chang Hsu, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai
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Publication number: 20250040323Abstract: An electronic device is provided. The electronic device includes: a first substrate, a first light-emitting unit, a wall structure, and a first optical film. The first light-emitting unit is disposed on the first substrate. The wall structure is disposed on the first substrate, and includes a first opening corresponding to the first light-emitting unit. At least a portion of the first optical film is disposed on the first light-emitting unit, and the at least a portion of the first optical film is disposed in the first opening.Type: ApplicationFiled: June 24, 2024Publication date: January 30, 2025Inventors: Yu-Ding LIN, Hua-Pin CHEN, Shuai WANG, Chien-Hao KUO
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Patent number: 12209202Abstract: A resin composition and a filter element are provided. The resin composition includes a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), and a photoinitiator (E). The black coloring agent (A) includes a titanium black (A-1) and a carbon black (A-2). Based on a total usage amount of 100 parts by weight of the titanium black (A-1) and the carbon black (A-2), a usage amount of the titanium black (A-1) is 50 parts by weight to 75 parts by weight.Type: GrantFiled: April 16, 2024Date of Patent: January 28, 2025Assignee: Advanced Echem Materials Company LimitedInventors: Yu-Wen Chen, Yi-Lun Chiu, Chia-Hao Lou, Chen-Wen Chiu
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Patent number: 12197123Abstract: A method for making a IC is provided, including: identifying, in a schematic, first and second edge elements, which edge elements including devices whose layout patterns are configured to conform to a first layout grid; identifying all the elements between the first and second edge elements, at least one of the identified elements including a device whose layout pattern is configured to conform to a second layout grid that is finer than the first layout grid; and calculating a spatial quantity of a combined layout pattern of the identified elements between the first and second edge elements to determine whether the combined layout pattern conforms to the first layout grid.Type: GrantFiled: October 20, 2023Date of Patent: January 14, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Yu-Hao Chen, Hui-Yu Lee, Jui-Feng Kuan, Chien-Te Wu
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Patent number: 12200886Abstract: Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, the quantity of hardware resources available for providing the computer implemented services may be modified. The quantity of hardware resources may be modified by adding removable cards to a host system. The host system may, while the added removable cards are cold, selectively warm the removable cards through conduction heating to retain their temperatures within operating temperature ranges.Type: GrantFiled: October 20, 2022Date of Patent: January 14, 2025Assignee: Dell Products L.P.Inventors: Julian Yu-Hao Chen, Shun-Cheng Hsu, Hung-Jen Chen
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Patent number: 12200898Abstract: Methods and systems for managing the operation of data processing systems are disclosed. A data processing system may include a computing device that may provide computer implemented services. To provide the computer implemented services, hardware components of the data processing system may need to operate in predetermined manners. To manage the operation of the hardware components, the data processing system may cool them when their temperatures fall outside of thermal operating ranges. To facilitate cooling, fans may be densely packed and arranged in a manner the occupies a majority of the space in a stack up. At least one side of the fans may be exposed and may not be covered.Type: GrantFiled: October 20, 2022Date of Patent: January 14, 2025Assignee: Dell Products L.P.Inventors: Julian Yu-Hao Chen, Shun-Cheng Hsu, Hung-Jen Chen
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Patent number: 12181722Abstract: Disclosed are apparatus and methods for a silicon photonic (SiPh) structure comprising the integration of an electrical integrated circuit (EIC); a photonic integrated circuit (PIC) disposed on top of the EIC; two or more polymer waveguides (PWGs) disposed on top of the PIC and formed by layers of cladding polymer and core polymer; and an integration fan-out redistribution (InFO RDL) layer disposed on top of the two or more PWGs. The operation of PWGs is based on the refractive indexes of the cladding and core polymers. Inter-layer optical signals coupling is provided by edge-coupling, reflective prisms and grating coupling. A wafer-level system implements a SiPh structure die and provides inter-die signal optical interconnections among the PWGs.Type: GrantFiled: August 9, 2023Date of Patent: December 31, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yu-Hao Chen, Hui-Yu Lee, Chung-Ming Weng, Jui-Feng Kuan, Chien-Te Wu
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Publication number: 20240421535Abstract: A toolless direct current connector includes a frame, a plug, and a toolless component. The plug is in physical communication with the frame. The plug includes a power terminal, a return terminal, and a ground terminal. The plug to be secured within a receptacle of a power supply unit. The toolless component is in physical communication with the frame and with the plug. The toolless component transitions between a locked position and an unlocked position. The toolless component releases the plug from within the receptacle of the power supply unit when the toolless component transitions from the locked position to the unlocked position.Type: ApplicationFiled: June 14, 2023Publication date: December 19, 2024Inventors: Julian Yu-Hao Chen, Padmanabh R. Gharpure
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Publication number: 20240402218Abstract: A probe head includes multiple probes and guide plates. Each probe includes a first end, a second end, and a probe body. The first end abuts a contact pad of a device under test. The second end abuts a contact pad of a board of a probe system. The probe body extends between the first end and the second end according to a longitudinal development axis. The guide plate includes a guide-hole pair for a probe pair of the probe head to respectively pass through, and the guide-hole pair slidably accommodate the pair of probes. The guide plate further includes an extension hole extending from one guide hole of the guide-hole pair to another guide hole. The extension hole intersects with at least one of the first guide holes and is located substantially between the probe pair on the first guide plate.Type: ApplicationFiled: August 16, 2024Publication date: December 5, 2024Inventors: CHIN-TIEN YANG, YU-HAO CHEN, HUI-PIN YANG, CHI-HSIEN LI
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Patent number: 12159791Abstract: A method includes forming a package, which includes forming a plurality of redistribution lines over a carrier, and forming a thermal dissipation block over the carrier. The plurality of redistribution lines and the thermal dissipation block are formed by common processes. The thermal dissipation block has a first metal density, and the plurality of redistribution lines have a second metal density smaller than the first metal density. The method further includes forming a metal post over the carrier, placing a device die directly over the thermal dissipation block, and encapsulating the device die and the metal post in an encapsulant. The package is then de-bonded from the carrier.Type: GrantFiled: July 24, 2023Date of Patent: December 3, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ching-Yi Lin, Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Jyh Chwen Frank Lee, Shuo-Mao Chen
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Publication number: 20240393367Abstract: A probe head includes multiple probes and guide plates. Each probe includes a first end, a second end, and a probe body. The first end abuts a contact pad of a device under test. The second end abuts a contact pad of a board of a probe system. The probe body extends between the first end and the second end according to a longitudinal development axis. The guide plate includes a guide-hole pair for a probe pair of the probe head to respectively pass through, and the guide-hole pair slidably accommodate the pair of probes. The guide plate further includes an extension hole extending from one guide hole of the guide-hole pair to another guide hole to provide compensating impedance between the guide-hole pair, improve impedance matching when probing the device under test with the probe pair, and reduce return loss between the probe head and the device under test.Type: ApplicationFiled: April 25, 2024Publication date: November 28, 2024Inventors: CHIN-TIEN YANG, YU-HAO CHEN, HUI-PIN YANG, CHI-HSIEN LI
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Publication number: 20240393368Abstract: A probe system and a probe card, a probe head and a guide plate structure thereof are described herein. The probe head includes a plurality of probes and guide plates. Each probe includes a first end, a second end, and a probe body. The first end is configured to abut a contact pad of the device under test. The second end is configured to abut a contact pad of a board of the probe system. The probe body extends between the first end and the second end according to a longitudinal development axis. The guide plate includes a pair of first guide holes for a pair of probes to pass through, and the pair of first guide holes are configured to slidably accommodate the pair of probes. The material between the pair of first guide holes in the guide plate has a relative dielectric constant not greater than 6, so as to reduce the return loss between the probe head and the device under test.Type: ApplicationFiled: April 25, 2024Publication date: November 28, 2024Inventors: CHIN-TIEN YANG, YU-HAO CHEN, HUI-PIN YANG, CHI-HSIEN LI
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Publication number: 20240371839Abstract: A semiconductor package includes a first package component comprising: a first semiconductor die; a first encapsulant around the first semiconductor die; and a first redistribution structure electrically connected to the semiconductor die. The semiconductor package further includes a second package component bonded to the first package component, wherein the second package component comprises a second semiconductor die; a heat spreader between the first semiconductor die and the second package component; and a second encapsulant between the first package component and the second package component, wherein the second encapsulant has a lower thermal conductivity than the heat spreader.Type: ApplicationFiled: July 15, 2024Publication date: November 7, 2024Inventors: Fong-Yuan Chang, Po-Hsiang Huang, Lee-Chung Lu, Jyh Chwen Frank Lee, Yii-Chian Lu, Yu-Hao Chen, Keh-Jeng Chang
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Publication number: 20240361546Abstract: In a method, a stacked structure including an electronic integrated circuit (IC) and a photonic IC is bonded to a heat spreader releasably attached to a carrier. A first multilayer structure is sequentially deposited and patterned over the stacked structure to form, in the first multilayer structure, a first waveguide optically coupled to the photonic IC. A redistribution structure is sequentially deposited and patterned over the first multilayer structure, the redistribution structure electrically coupled to the photonic IC. The carrier is detached from the heat spreader.Type: ApplicationFiled: July 12, 2024Publication date: October 31, 2024Inventors: Yu-Hao CHEN, Hui Yu LEE
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Patent number: 12127680Abstract: Provided are an air cell device and an air mattress system thereof. The air cell device includes an air cell which has therein an upper connection segment and a lower connection segment. The upper connection segment and the lower connection segment each have a curved portion whereby the air cell is partitioned to become a multilayered air cell so as to mitigate air cell bending or air cell inversion, thereby improving the lying human being's comfort.Type: GrantFiled: February 15, 2022Date of Patent: October 29, 2024Assignee: WELLELL INC.Inventors: Chih-Kuang Chang, Sheng-Wei Lin, Chin-Chang Lin, Yue-Yin Chao, Yu-Hao Chen