Abstract: A pressure sensor using the MEMS element and the manufacture method thereof utilize the semiconductor processes to form the micro channel connecting to the chamber, open the micro channel, coat the anti-sticking layer on the inner surface of the chamber, and then seal the micro channel to keep the chamber airtight. Therefore, the manufacture method may essentially simplify the process to coat the anti-sticking layer on the inner surface of the airtight chamber to prevent the sticking and failing of the movable MEMS element.

Abstract: A pressure sensor using the MEMS element and the manufacture method thereof utilize the semiconductor processes to form the micro channel connecting to the chamber, open the micro channel, coat the anti-sticking layer on the inner surface of the chamber, and then seal the micro channel to keep the chamber airtight. Therefore, the manufacture method may essentially simplify the process to coat the anti-sticking layer on the inner surface of the airtight chamber to prevent the sticking and failing of the movable MEMS element.

Abstract: A pressure sensor using the MEMS device comprises an airtight ring surrounding a chamber defined by the first substrate and the second substrate. The airtight ring extends from the upper surface of the second substrate to the surface between the first substrate and the second substrate and further breaks out the surface. The pressure sensor utilizes the airtight ring to retain the airtightness of the chamber. The manufacture method of the pressure sensor is also disclosed.

Abstract: A manufacturing process of a M EMS device divides a substrate for fabricating u MEMS component into two electrically isolated regions, so that the MEMS component and the circuit disposed on its surface could connect electrically with another substrate below respectively through the corresponding conducing regions, whereby the configuration of the electrical conducting paths and the manufacturing process are simplified. A MEMS device manufactured by using the aforementioned process is also disclosed herein.

Abstract: A MEMS device comprises a substrate for manufacturing a moving MEMS component is divided into two electrically isolated conducting regions to allow the moving MEMS component and a circuit disposed on its surface to connect electrically with another substrate below respectively through their corresponding conducting regions, thereby the electrical conducting paths and manufacturing process can be simplified.

Abstract: A manufacturing process of a MEMS device divides a substrate for fabricating a MEMS component into two electrically isolated regions, so that the MEMS component and the circuit disposed on its surface could connect electrically with another substrate below respectively through the corresponding conducing regions, whereby the configuration of the electrical conducting paths and the manufacturing process are simplified. A MEMS device manufactured by using the aforementioned process is also disclosed herein.

Abstract: A manufacturing method of the MEMS device disposes a conductive circuit to maintain various elements of the MEMS equi-potential thereby preventing electrostatic damages to various elements of the MEMS during the manufacturing process.

Abstract: A micro electro-mechanical (MEMS) device assembly is provided. The MEMS device assembly includes a first substrate that has a plurality of electronic devices, a plurality of first bonding regions, and a plurality of second bonding regions. The MEMS device assembly also includes a second substrate that is bonded to the first substrate at the plurality of first bonding regions. A third substrate having a recessed region and a plurality of standoff structures is disposed over the second substrate and bonded to the first substrate at the plurality of second bonding regions. The plurality of first bonding regions provide a conductive path between the first substrate and the second substrate and the plurality of the second bonding regions provide a conductive path between the first substrate and the third substrate.