Abstract: A treadmill running platform structure is provided, which includes a running platform, a running board, and a running belt. The running board includes two soft elastic strips adapted to two side bars of the running platform, a plurality of rigid support strips provided between the soft elastic strips, and strip-shaped connection plates respectively connected to two ends of the rigid support strips. Two strip-shaped connection plates are connected above the rigid support strips, and the strip-shaped connection plates are respectively fixed to a corresponding end of each rigid support strip. The present disclosure can achieve buffering of the entire running board, especially by connecting the rigid support strips together through the strip-shaped connection plates, thereby avoiding an uneven transition of the rigid support strips when a runner steps on the running board, improving the comfort of the runner's feet, and reducing the noise of the treadmill.

Abstract: The disclosure relates to a method for information recommendation, an apparatus, an electronic device, and a storage medium. The method includes: determining a historical interaction parameter of a target user for associated information of each candidate object in a candidate object set; determining a target interaction parameter corresponding to each candidate object; ranking the candidate objects in the candidate object set based on the historical interaction parameter of the target user for the associated information of each candidate object and the target interaction parameter corresponding to each candidate object, to obtain a ranking result; and recommending, based on the ranking result, the associated information of the candidate objects to the target user.

Abstract: Disclosed are a leadframe, a bracket and an LED device. The leadframe includes a first photo-etched metal part, having a first electrode and a chip placement layer thereon, which has a greater length for short and long edges than those of the first electrode; and a second photo-etched metal part, composed of a second electrode and a connection layer thereon, which has a greater length for short and long edges than those of the second electrode; wherein a first long edge of the chip placement layer is flush with a first long edge of the first electrode, and a first long edge of the connection layer is flush with a first long edge of the second electrode; and wherein the chip placement layer and the connection layer are provided with L-shaped pins at corners of their first long edges to cover sidewalls of the corresponding corners.

Abstract: Disclosed are a leadframe, a bracket and an LED device. The leadframe includes a first photo-etched metal part, having a first electrode and a chip placement layer thereon, which has a greater length for short and long edges than those of the first electrode; and a second photo-etched metal part, composed of a second electrode and a connection layer thereon, which has a greater length for short and long edges than those of the second electrode; wherein a first long edge of the chip placement layer is flush with a first long edge of the first electrode, and a first long edge of the connection layer is flush with a first long edge of the second electrode; and wherein the chip placement layer and the connection layer are provided with L-shaped pins at corners of their first long edges to cover sidewalls of the corresponding corners.

Abstract: The present disclosure provides a method and apparatus for scheduling a memory access request, an electronic device and a storage medium. The method may include: acquiring monitoring data of at least one service module; determining a target service module from the at least one service module based on the monitoring data; determining a target NUMA node matching the target service module from a preset NUMA node set, based on the monitoring data; and sending a memory access request of the target service module to the target NUMA node.

Abstract: A pixel data optimization method, a pixel matrix driving device and a display apparatus are provided. The method includes: obtaining a first pixel data set; obtaining a second pixel data set according to the first pixel data set; obtaining an initial amplitude difference according to pixel data of each two adjacent rows of pixels in the second pixel data set; and obtaining pixel output data of n rows*M columns of pixels according to the initial amplitude difference and a preset threshold. By comparing the initial amplitude difference obtained from the pixel data of each two adjacent rows of pixels with the preset threshold, a pixel grayscale value to be final displayed of each pixel can be adjusted according to a comparison result, so that an energy consumption and an overheating phenomenon of the pixel matrix driving device can be improved, and a visual effect can be improved.

Abstract: A pixel data optimization method, a pixel matrix driving device and a display apparatus are provided. The method includes: obtaining a first pixel data set; obtaining a second pixel data set according to the first pixel data set; obtaining an initial amplitude difference according to pixel data of each two adjacent rows of pixels in the second pixel data set; and obtaining pixel output data of n rows*M columns of pixels according to the initial amplitude difference and a preset threshold. By comparing the initial amplitude difference obtained from the pixel data of each two adjacent rows of pixels with the preset threshold, a pixel grayscale value to be final displayed of each pixel can be adjusted according to a comparison result, so that an energy consumption and an overheating phenomenon of the pixel matrix driving device can be improved, and a visual effect can be improved.

Abstract: The present disclosure provides a method and apparatus for scheduling a memory access request, an electronic device and a storage medium. The method may include: acquiring monitoring data of at least one service module; determining a target service module from the at least one service module based on the monitoring data; determining a target NUMA node matching the target service module from a preset NUMA node set, based on the monitoring data; and sending a memory access request of the target service module to the target NUMA node.

Abstract: The present invention relates to a surface mounted LED structure of integrating functional circuits on a silicon substrate, comprising the silicon substrate and an LED chip. Said silicon substrate has an upper surface of planar structure without grooves. An oxide layer covers the upper surface of the silicon substrate, and metal electrode layers are arranged in the upper surface of the oxide layer. The upper surfaces of said metal electrode layers are arranged with metal bumps, and the LED chip is flip-chip mounted to the silicon substrate. Two conductive metal pads are arranged on the lower surface of said silicon substrate, said conductive metal pads are electrically connected to the metal electrode layers on the upper surface of the silicon substrate by a metal lead arranged on the side wall of the silicon substrate. A heat conduction metal pad is arranged on the corresponding lower, surface of the silicon substrate just below the LED chip.

Abstract: The present invention relates to a surface mounted LED structure of integrating functional circuits on a silicon substrate, comprising the silicon substrate and an LED chip. Said silicon substrate has an upper surface of planar structure without grooves. An oxide layer covers the upper surface of the silicon substrate, and metal electrode layers are arranged in the upper surface of the oxide layer. The upper surfaces of said metal electrode layers are arranged with metal bumps, and the LED chip is flip-chip mounted to the silicon substrate. Two conductive metal pads are arranged on the lower surface of said silicon substrate, said conductive metal pads are electrically connected to the metal electrode layers on the upper surface of the silicon substrate by a metal lead arranged on the side wall of the silicon substrate. A heat conduction metal pad is arranged on the corresponding lower, surface of the silicon substrate just below the LED chip.

Abstract: A surface mounted LED packaging structure based on a silicon substrate includes the silicon substrate, an LED chip, an annular convex wall and a lens. The silicon substrate has an upper surface of planar structure and without grooves. An oxide layer covers the upper surface of the silicon substrate. Metal electrode layers are arranged in the upper surface of the oxide layer, and the upper surfaces of the metal electrode layers are arranged with metal bumps. Vias through the silicon substrate are provided under the metal electrode layers. An insulating layer covers the inner wall of the vias and a part of the lower surface of the silicon substrate. A metal connection layer covers the insulating layer surface within the vias. Two conductive metal pads are respectively arranged under the lower surface of the silicon substrate and insulated from the silicon substrate. A heat conduction metal pad is arranged on the lower surface of the silicon substrate. The LED chip is flip-chip mounted on the silicon substrate.