Patents by Inventor Yuhua Cheng
Yuhua Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240020448Abstract: A circuit and method for simulating real-time reconfigurable general-purpose memristor, nonlinear m-order polynomial fitting of mathematical model of a memristor is performed by using McLaughlin formula. m is related to the amplitude and frequency of an input signal and the fitting accuracy, thus the mathematical model of a memristor can be easily and quickly adapted by updating the polynomial order, the polynomial coefficients and the FPGA system clock cycle. Based on the FPGA, a system state variable generation module, a FIFO, a output module are used to obtain an output signal y[n]. the detailed steps of signal processing and displaying are given to obtain a display of a pinched hysteresis loop and a waveform display of time-domain. Simulation of high frequency memristor by setting polynomial coefficients can be obtained. Meanwhile, this is built based on FPGA, adopt digital circuit to simulates a reconfigurable general-purpose memristor, and experimental accuracy is enhanced.Type: ApplicationFiled: October 19, 2022Publication date: January 18, 2024Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Bo XU, Hang GENG, Libing BAI, Yuhua CHENG, Kai CHEN, Songting ZOU
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Publication number: 20230386595Abstract: A random transient power test signal generator based on three-dimensional memristive discrete map, which utilizes a three-dimensional parallel bi-memristor Logistic map module to generate two pseudo-random sequences, and based on the two pseudo-random sequences, uses two waveform output modules to generate a transient voltage signal and a transient current signal respectively, thus the random transient power testing signal is obtained.Type: ApplicationFiled: August 15, 2023Publication date: November 30, 2023Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Bo XU, Yuhua CHENG, Kai CHEN, Jia ZHAO, Hang GENG, Yifan WANG
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Publication number: 20230339112Abstract: Robot assisted multi-view 3D scanning measurement based on path planning includes firstly, establishing a virtual simulation platform to complete the setting of measurement poses and measurement paths and perform the path evaluations of measurement paths. Then, completing the preliminary hand-eye calibration based on the properties of Kronecker product, and the preliminary hand-eye calibration is optimized by establishing a reprojection error cost function as the fitness function of the particle swarm optimization algorithm. Lastly, moving the robot to the measurement poses of the planned measurement paths, obtaining a single-view point cloud of the measured object and transforming it from the camera coordinate system to the robot base coordinate system to obtain a registered single-view point cloud based on the optimized hand-eye matrix.Type: ApplicationFiled: April 28, 2023Publication date: October 26, 2023Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Chun YIN, Yan GAO, Zhongbao YAN, Kai CHEN, Yuhua CHENG, Xutong TAN, Junyang LIU
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Patent number: 11641457Abstract: A method for high-precision true color three dimensional reconstruction of mechanical component. Firstly performs image acquisition: the left and right high-resolution grayscale cameras are fixed at same height and spaced at certain distance, an optical transmitter fixed between the two grayscale cameras, and low-resolution color camera fixed above optical transmitter, thus images of measured high-precision mechanical component are shot. Then performs image processing: all images are transmitted to a computer, which uses image processing to record surface information of measured high-precision mechanical component in the point cloud by high-precision true color three-dimensional reconstruction, which reflects color texture information of the surface, so as to realize the non-contact high-precision true color three dimensional reconstruction of high-precision mechanical component.Type: GrantFiled: February 25, 2022Date of Patent: May 2, 2023Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Chun Yin, Yuhua Cheng, Zeqi Wang, Xutong Tan, Kai Chen, Gen Qiu, Jianhao Luo, Junjie Liu, Zhibo Li, Aolin Yang
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Patent number: 11587250Abstract: The present invention provides a method for quantitatively identifying the defects of large-size composite material based on infrared image sequence, firstly obtaining the overlap area of an infrared splicing image, and dividing the infrared splicing image into three parts according to overlap area: overlap area, reference image area and registration image area, then extracting the defect areas from the infrared splicing image to obtain P defect areas, then obtaining the conversion coordinates of pixels of defect areas according to the three parts of the infrared splicing image, and further obtaining the transient thermal response curves of centroid coordinate and edge point coordinates, finding out the thermal diffusion points from the edge points of defect areas according to a created weight sequence and dynamic distance threshold ?ttr×dp_max, finally, based on the thermal diffusion points, the accurate identification of quantitative size of defects are completed.Type: GrantFiled: August 13, 2021Date of Patent: February 21, 2023Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Yuhua Cheng, Chun Yin, Xiao Yang, Kai Chen, Xuegang Huang, Gen Qiu, Yinze Wang
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METHOD FOR EDDY CURRENT THERMOGRAPHY DEFECT RECONSTRUCTION BASEED ON ELECTRICAL IMPEDANCE TOMOGRAPHY
Publication number: 20220412919Abstract: The present invention provides a method for eddy current thermography defect reconstruction based on electrical impedance tomography, first, obtaining a thermal reference image of temperature change with time by acquiring a thermogram sequence S of the specimen in the process of heating and fitting a curve for pixels of each location of the thermogram sequence S, then, creating a current matrix and a magnetic potential matrix, and calculating the satisfied conductivity distribution through iterations, so as a reconstructed image is obtained, then taking the low conductivity area of the reconstructed image as the defect profile, thus the defect profile is identified and quantified.Type: ApplicationFiled: August 29, 2022Publication date: December 29, 2022Applicant: University of Electronic Science and Technology of ChinaInventors: Libing BAI, Xu ZHANG, Chao REN, Yiping LIANG, Ruiheng ZHANG, Yong DUAN, Jinliang SHAO, Yali ZHENG, Yuhua CHENG -
Publication number: 20220373577Abstract: The present invention provides a system for data mapping and storing in digital three-dimensional oscilloscope, wherein the fixed coefficients, which are calculated according the parameters and settings of a digital oscilloscope, are stored into a fixed coefficient memory CO RAM, the fixed coefficients are outputted to N fractional operation units through N?1 D flip-flop delay units to multiply with the acquired data x(n) and then be accumulated, thus N fractional calculus results are obtained. In this way, N fractional calculus results can be obtained by performing L/N fractional calculus operations. N fractional calculus results are sent to a signal processing and display module, in which they are converted into a display data through a drawing thread, and the display data are sent to LCD for displaying, thus the fractional calculus operation and display of a input signal in a digital oscilloscope is realized.Type: ApplicationFiled: November 1, 2021Publication date: November 24, 2022Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Bo XU, Kai CHEN, Libing BAI, Lulu TIAN, Hang GENG, Yuhua CHENG, Songting ZOU, Jia ZHAO, Yanjun YAN, Xiaoyu HUANG
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Patent number: 11486901Abstract: A system maps and stores data in digital three-dimensional oscilloscope, wherein an ADC module has four ADC submodules. Four acquired waveform data are sent to an extraction module, and buffered in a FIFO module. When a trigger signal arrives, FIFO module outputs four extracted waveform data to a mapping address calculation module for calculating a mapping address and a RAM serial number for each point data, and the waveform data comparison and control module performs the reading and writing control of the 4×N dual port RAMs. When mapping number reaches a frame number, the RAM array module outputs its waveform probability values to the upper computer module to convert each value into RBG values, and the display module displays the waveforms of input signals of four channels on a screen according the RBG values.Type: GrantFiled: April 1, 2021Date of Patent: November 1, 2022Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Yuhua Cheng, Bo Xu, Kai Chen, Songting Zou, Libing Bai, Hang Geng, Yanjun Yan, Jia Zhao
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Publication number: 20220182593Abstract: A method for high-precision true color three dimensional reconstruction of mechanical component. Firstly performs image acquisition: the left and right high-resolution grayscale cameras are fixed at same height and spaced at certain distance, an optical transmitter fixed between the two grayscale cameras, and low-resolution color camera fixed above optical transmitter, thus images of measured high-precision mechanical component are shot. Then performs image processing: all images are transmitted to a computer, which uses image processing to record surface information of measured high-precision mechanical component in the point cloud by high-precision true color three-dimensional reconstruction, which reflects color texture information of the surface, so as to realize the non-contact high-precision true color three dimensional reconstruction of high-precision mechanical component.Type: ApplicationFiled: February 25, 2022Publication date: June 9, 2022Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Chun YIN, Yuhua CHENG, Zeqi WANG, Xutong TAN, Kai CHEN, Gen QIU, Jianhao LUO, Junjie LIU, Zhibo LI, Aolin YANG
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Publication number: 20210383563Abstract: The present invention provides a method for quantitatively identifying the defects of large-size composite material based on infrared image sequence, firstly obtaining the overlap area of an infrared splicing image, and dividing the infrared splicing image into three parts according to overlap area: overlap area, reference image area and registration image area, then extracting the defect areas from the infrared splicing image to obtain P defect areas, then obtaining the conversion coordinates of pixels of defect areas according to the three parts of the infrared splicing image, and further obtaining the transient thermal response curves of centroid coordinate and edge point coordinates, finding out the thermal diffusion points from the edge points of defect areas according to a created weight sequence and dynamic distance threshold ?ttr×dp_max, finally, based on the thermal diffusion points, the accurate identification of quantitative size of defects are completed.Type: ApplicationFiled: August 13, 2021Publication date: December 9, 2021Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Yuhua CHENG, Chun YIN, Xiao YANG, Kai CHEN, Xuegang HUANG, Gen QIU, Yinze WANG
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Publication number: 20210215744Abstract: A system maps and stores data in digital three-dimensional oscilloscope, wherein an ADC module has four ADC submodules. Four acquired waveform data are sent to an extraction module, and buffered in a FIFO module. When a trigger signal arrives, FIFO module outputs four extracted waveform data to a mapping address calculation module for calculating a mapping address and a RAM serial number for each point data, and the waveform data comparison and control module performs the reading and writing control of the 4×N dual port RAMs. When mapping number reaches a frame number, the RAM array module outputs its waveform probability values to the upper computer module to convert each value into RBG values, and the display module displays the waveforms of input signals of four channels on a screen according the RBG values.Type: ApplicationFiled: April 1, 2021Publication date: July 15, 2021Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Yuhua CHENG, Bo XU, Kai CHEN, Songting ZOU, Libing BAI, Hang GENG, Yanjun YAN, Jia ZHAO
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Patent number: 11036978Abstract: The present invention provides a method for separating out a defect image from a thermogram sequence based on weighted naive Bayesian classifier and dynamic multi-objective optimization, we find that different kinds of TTRs have big differences in some physical quantities. The present invention extracts these features (physical quantities) and classifies the selected TTRs into K categories based on their feature vectors through a weighted naive Bayesian classifier, which deeply digs the physical meanings contained in each TTR, makes the classification of TTRs more rational, and improves the accuracy of defect image's separation. Meanwhile, the multi-objective function does not only fully consider the similarities between the RTTR and other TTRs in the same category, but also considers the dissimilarities between the RTTR and the TTRs in other categories, thus the RTTR selected is more representative, which guarantees the accuracy of describing the defect outline.Type: GrantFiled: March 29, 2019Date of Patent: June 15, 2021Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Chun Yin, Yuhua Cheng, Ting Xue, Xuegang Huang, Haonan Zhang, Kai Chen, Anhua Shi
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Patent number: 10846841Abstract: The present invention provides a method for separating out a defect image from a thermogram sequence based on feature extraction and multi-objective optimization, we find that different kinds of TTRs have big differences in some physical quantities, such as the energy, temperature change rate during endothermic process, temperature change rate during endothermic process, average temperature, maximum temperature. The present invention extract these features (physical quantities) and cluster the selected TTRs into L clusters based on their feature vectors, which deeply digs the physical meanings contained in each TTR, makes the clustering more rational, and improves the accuracy of defect separation. Meanwhile, the present invention creates a multi-objective function to select a RTTR for each cluster based on multi-objective optimization.Type: GrantFiled: March 29, 2019Date of Patent: November 24, 2020Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Yuhua Cheng, Chun Yin, Haonan Zhang, Xuegang Huang, Ting Xue, Kai Chen, Yi Li
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Patent number: 10746604Abstract: An apparatus for measuring temperature of turbine blades, including: a radiation collection device, a data processing module; a master control unit (MCU); a calibration module; and a motion servo. The radiation collection device includes a scan reflector, a collimator lens, a first dichroic mirror, a first focus lens, a visible and near-infrared (VNIR) detector, a second dichroic mirror, a second focus lens, a short-wave infrared (SWIR) detector, a third focus lens, and a medium-wave infrared (MWIR) detector. The calibration module includes a calibration reflection mirror and a blackbody furnace. The scan reflector, the collimator lens, the first dichroic mirror, the second dichroic mirror, the third focus lens, and the MWIR detector are disposed successively along a first optical axis; the first dichroic mirror, the first focus lens, and the VNIR detector are disposed successively along a second optical axis that is perpendicular to the first optical axis.Type: GrantFiled: April 9, 2018Date of Patent: August 18, 2020Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Chao Wang, Zezhan Zhang, Fei Wang, Chengui Zhang, Jun Hu, Yang Yang, Jing Jiang, Hongchuan Jiang, Yueming Wang, Yuhua Cheng, Jiexiong Ding, Li Du, Houjun Wang
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Patent number: 10551350Abstract: The present invention provides a method for simulating magnetic flux leakage based on loop current, the magnetic distribution of a single loop current is obtained by solid angle, then the magnetic field distribution of a semi-infinite solenoid is obtained based on the assumption of arrangement of loop currents in the magnetized specimen, and its equation is given; and the JA hysteresis model is introduced to obtain the distribution of quasi-static magnetic flux leakage field, on the basis of analyzing the relation between the distribution of a loop current on the surface of the defect and the excitation magnetic field, the distribution of quasi-static magnetic flux leakage field is obtained based on the semi-infinite solenoid.Type: GrantFiled: August 18, 2017Date of Patent: February 4, 2020Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Yuhua Cheng, Libing Bai, Yonggang Wang, Jie Zhang, Chun Yin, Shuai Shi, Xue Chen
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Publication number: 20190228517Abstract: The present invention provides a method for separating out a defect image from a thermogram sequence based on feature extraction and multi-objective optimization, we find that different kinds of TTRs have big differences in some physical quantities, such as the energy, temperature change rate during endothermic process, temperature change rate during endothermic process, average temperature, maximum temperature. The present invention extract these features (physical quantities) and cluster the selected TTRs into L clusters based on their feature vectors, which deeply digs the physical meanings contained in each TTR, makes the clustering more rational, and improves the accuracy of defect separation. Meanwhile, the present invention creates a multi-objective function to select a RTTR for each cluster based on multi-objective optimization.Type: ApplicationFiled: March 29, 2019Publication date: July 25, 2019Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Yuhua CHENG, Chun YIN, Haonan ZHANG, Xuegang HUANG, Ting XUE, Kai CHEN, Yi LI
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Publication number: 20190228221Abstract: A method for separating out a defect image from a thermogram sequence based on weighted naive Bayesian classifier and dynamic multi-objective optimization. A method extracts these features and classifies the selected TTRs into K categories based on their feature vectors through a weighted naive Bayesian classifier, which deeply digs the physical meanings contained in each TTR, makes the classification of TTRs more rational, and improves the accuracy of defect image's separation. Meanwhile, the multi-objective function does not only fully consider the similarities between the RTTR and other TTRs in the same category, but also considers the dissimilarities between the RTTR and the TTRs in other categories, thus the RTTR selected is more representative, which guarantees the accuracy of describing the defect outline.Type: ApplicationFiled: March 29, 2019Publication date: July 25, 2019Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Chun YIN, Yuhua CHENG, Ting XUE, Xuegang HUANG, Haonan ZHANG, Kai CHEN, Anhua SHI
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Patent number: 10171187Abstract: A system and a method for testing a high-speed ADC in a DP-QPSK receiver are disclosed. The system includes a simulation module for outputting a data flow and performing signal recovery, an arbitrary waveform generator for receiving the data flow and outputting a high-speed analog signal and a clock signal, a high-speed ADC for converting the high-speed analog signal and the clock signal into a high-speed digital signal, a cache memory circuit for converting the high-speed digital signal into a low-speed digital signal, and a logic analyzer for sending the low-speed digital signal to the simulation module.Type: GrantFiled: September 13, 2017Date of Patent: January 1, 2019Assignee: XIAMEN UX HIGH-SPEED IC CO., LTD.Inventors: Zhe Chen, Xiang Xiao, Long Zhao, Bao Li, Yuhua Cheng, Quanchuan Gao, Qiuwei Huang
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Publication number: 20180348059Abstract: An apparatus for measuring temperature of turbine blades, including: a radiation collection device, a data processing module; a master control unit (MCU); a calibration module; and a motion servo. The radiation collection device includes a scan reflector, a collimator lens, a first dichroic mirror, a first focus lens, a visible and near-infrared (VNIR) detector, a second dichroic mirror, a second focus lens, a short-wave infrared (SWIR) detector, a third focus lens, and a medium-wave infrared (MWIR) detector. The calibration module includes a calibration reflection mirror and a blackbody furnace. The scan reflector, the collimator lens, the first dichroic mirror, the second dichroic mirror, the third focus lens, and the MWIR detector are disposed successively along a first optical axis; the first dichroic mirror, the first focus lens, and the VNIR detector are disposed successively along a second optical axis that is perpendicular to the first optical axis.Type: ApplicationFiled: April 9, 2018Publication date: December 6, 2018Inventors: Chao WANG, Zezhan ZHANG, Fei WANG, Chengui ZHANG, Jun HU, Yang YANG, Jing JIANG, Hongchuan JIANG, Yueming WANG, Yuhua CHENG, Jiexiong DING, Li DU, Houjun WANG
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Publication number: 20180335403Abstract: The present invention provides a method for simulating magnetic flux leakage based on loop current, the magnetic distribution of a single loop current is obtained by solid angle, then the magnetic field distribution of a semi-infinite solenoid is obtained based on the assumption of arrangement of loop currents in the magnetized specimen, and its equation is given; and the JA hysteresis model is introduced to obtain the distribution of quasi-static magnetic flux leakage field, on the basis of analyzing the relation between the distribution of a loop current on the surface of the defect and the excitation magnetic field, the distribution of quasi-static magnetic flux leakage field is obtained based on the semi-infinite solenoid.Type: ApplicationFiled: August 18, 2017Publication date: November 22, 2018Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINAInventors: Yuhua CHENG, Libing BAI, Yonggang WANG, Jie ZHANG, Chun YIN, Shuai SHI, Xue CHEN