Patents by Inventor Yu Huang

Yu Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11515334
    Abstract: A MOSFET structure including stacked vertically isolated MOSFETs and a method for forming the same are disclosed.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: November 29, 2022
    Assignee: NATIONAL TAIWAN UNIVERSITY
    Inventors: Yu-Shiang Huang, Hung-Yu Yeh, Wen Hung Huang, Chee-Wee Liu
  • Patent number: 11516513
    Abstract: In one method, the current block is partitioned into multiple final sub-blocks using one or more stages of sub-tree partition comprising ternary tree partition and at least one other-type partition, where ternary partition tree is excluded from the sub-tree partition if a current sub-tree depth associated with a current sub-block is greater than a first threshold and the first threshold is an integer greater than or equal to 1. In another method, if a test condition is satisfied, the current block is encoded or decoded using a current Inter mode selected from a modified group of Inter tools, where the modified group of Inter tools is derived from an initial group of Inter tools by removing one or more first Inter tools from the initial group of Inter tools, replacing one or more second Inter tools with one or more complexity-reduced Inter tools, or both.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: November 29, 2022
    Assignee: MEDIATEK INC.
    Inventors: Chun-Chia Chen, Chia-Ming Tsai, Yu-Chi Su, Chen-Yen Lai, Chih-Wei Hsu, Ching-Yeh Chen, Tzu-Der Chuang, Yu-Wen Huang, Han Huang
  • Patent number: 11515459
    Abstract: The present invention relates to a micro light-emitting diode display panel and a method for producing the same. A backplane and a light-emitting diode display layer are subjected to a bonding process to form eutectic structures between the backplane and light-emitting diodes of the light-emitting diode display layer. Then, an adhesive bonding layer including a resin material and conducting materials is formed on a surface of the backplane, and a heating process is performed, thereby causing the conducting materials to form a plurality of metallic bridge connection structures. Therefore, a bonding between the light-emitting diode and the backplane is reinforced, and tensile strength of the micro light-emitting diode display panel is enhanced.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: November 29, 2022
    Assignees: Interface Technology (ChengDu) Co., Ltd., Interface Optoelectronics (ShenZhen) Co., Ltd., General Interface Solution Limited
    Inventors: Ping-Hsiang Kao, Po-Lun Chen, Chun-Ta Chen, Po-Ching Lin, Ya-Chu Hsu, Chia-Ming Fan, Chien-Yu Huang
  • Patent number: 11515511
    Abstract: A light-emitting diode (LED) display panel, a manufacturing method thereof, and an organic light-emitting diode (OLED) display device are disclosed. The LED display panel includes: a base substrate; and a plurality of sub-pixels, a color resistance layer and a light-shielding structure located on the base substrate. The base substrate includes a display region and a periphery region; the sub-pixels are located in the display region; the light-shielding structure is an annular structure located in the periphery region.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: November 29, 2022
    Assignee: Beijing BOE Technology Development Co., Ltd.
    Inventors: Dongsheng Li, Kuanta Huang, Yunlong Li, Shengji Yang, Pengcheng Lu, Xiaochuan Chen, Qing Wang, Hui Tong, Yongfa Dong, Xiaobin Shen, Xiong Yuan, Yu Wang
  • Patent number: 11513786
    Abstract: A system and method for providing commodity firmware packages for updating firmware in a network of servers is disclosed. A deployment server executes an update framework to provide firmware to target servers. A target server includes different hardware components and a baseboard management controller. Each of the hardware components have an associated firmware image. A management network connects the deployment server and the target server. A data network connects the deployment server and the target server. The deployment server sends a bootable disk image via virtual media redirection through the management network. The deployment server sends an upgrade framework to upload at least one firmware image associated with one of the hardware components through the data network to the remote server.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: November 29, 2022
    Assignee: QUANTA CLOUD TECHNOLOGY INC.
    Inventors: Jia Yu Juang, Chia Jui Lee, Tong Pai Huang
  • Patent number: 11515488
    Abstract: The present disclosure relates to the field of organic light-emitting materials, and more particularly, to a thermally activated delayed fluorescence material having red, green, or blue color, a synthesis method thereof, and application thereof. The thermally activated delayed fluorescence material having red, green, or blue color has the following structural formula: the present disclosure provides a novel thermally activated delayed fluorescence material having red, green, or blue color which has a lower singlet triplet energy level difference, a high RISC rate constant (kRISC), and a high photoluminescence quantum yield (PLQY). It has significant characteristics of a thermally activated delayed fluorescence material and a long service life that can be used in an electroluminescent display and a light-emitting equipment structure which are mass produced.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: November 29, 2022
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Jiajia Luo, Xianjie Li, Jinchang Huang, Yu Gu, Lin Yang, Yamei Bai
  • Patent number: 11514852
    Abstract: A pixel array is provided. The pixel array includes a plurality of red pixels, a plurality of green pixels, and a plurality of blue pixels. Each green pixel includes a light emitting diode (LED), a first transistor, a second transistor, a third transistor, and a fourth transistor. The LED receives a system low voltage. The first transistor receives a first data signal and a first scan signal. The second transistor is coupled to a second end of the first transistor and the anode of the light emitting diode. The third transistor receives a system high voltage and a first control signal, and is coupled to a first end of the second transistor. The fourth transistor is coupled to the anode of the light-emitting diode of an adjacent green pixel, a control terminal of the third transistor, and the anode of the light-emitting diode.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: November 29, 2022
    Assignee: Au Optronics Corporation
    Inventors: Ya-Jung Wang, Jing-Wun Jhang, Rong-Fu Lin, Nien-Chen Li, Hsien-Chun Wang, Che-Chia Chang, June Woo Lee, Hsin-Ying Lin, Chia-Ting Hsieh, Chien-Fu Huang, Sung-Yu Su
  • Patent number: 11515613
    Abstract: A bendable antenna is provided. The bendable antenna is adapted to connect a cable. The bendable antenna includes an antenna body, a connection base, a first pivot base, a second pivot base, a first elastic element and a first restriction structure. The connection base is connected to the antenna body. The first pivot base is connected to the connection base, wherein the first pivot base includes a first recess. The second pivot base pivots on the first pivot base. The first elastic element is disposed in the first recess of the first pivot base, wherein the first elastic element is telescoped on the cable. The first restriction structure is connected to the connection base, wherein the first restriction structure pushes the first elastic element to restrict the first elastic element in the first recess.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: November 29, 2022
    Assignee: WISTRON NEWEB CORP.
    Inventors: Tzu-Heng Huang, Chun-Yu Lee
  • Patent number: 11513373
    Abstract: A diffraction grating includes a substrate and a plurality of fringes supported by the substrate. The fringes run parallel to each other in a first direction. A refractive index of a material of the plurality of fringes is anisotropic, whereby a refractive index contrast of the diffraction grating depends on direction of electric field of an impinging light beam, and through that dependence is a function of an azimuthal angle of the impinging light beam. A dependence of the diffraction efficiency on the azimuthal angle is affected by the dependence of the refractive index contrast on the direction of electric field of an impinging light beam. A pupil-replicating waveguide may use such a diffraction grating as a coupler for in- our out-coupling image light.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: November 29, 2022
    Assignee: Meta Platforms Technologies LLC
    Inventors: Siddharth Buddhiraju, Yu Shi, Ningfeng Huang, Hee Yoon Lee, Pasi Saarikko
  • Patent number: 11510949
    Abstract: The present invention relates to the use of a novel Lactobacillus brevis ProGA28 strain, deposited in the German Collection for Microorganisms and Cell Cultures (DSMZ) under the accession number DSM 33167 on May 28, 2019. The metabolites of Lactobacillus brevis ProGA28 have the ability to improve sleep quality, can effectively reduce the time of rapid eye movement in the sleep phase, can reduce time to fall asleep, can increase total sleep time, and can increase the ratio of low waves during sleep so that sleep disorders and related complications, such as anxiety and immune system diseases, are treated.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: November 29, 2022
    Assignee: SYNGEN BIOTECH CO., LTD
    Inventors: Wei-Jen Chen, Bing-Huang Gau, Po-An Chen, Yu-Shan Wei
  • Publication number: 20220373430
    Abstract: The invention provides an adaptive manifold probability distribution-based bearing fault diagnosis method, including constructing transferable domains and transfer tasks; converting a data sample in each transfer task into frequency domain data via Fourier transform, inputting the frequency domain data into a GFK algorithm model, and calculating a manifold feature representation matrix related to a bearing fault in each transfer task by using the GFK algorithm model; calculating a cosine distance between centers of a target domain and a source domain in each transfer task according to a manifold feature representation, and defining a target function of in-domain classifier learning; then solving the target function, to obtain a probability distribution matrix of the target domain; and selecting a label corresponding to the largest probability value corresponding to each data sample in the target domain from the probability distribution matrix as a predicted label of the data sample in the target domain.
    Type: Application
    Filed: November 26, 2020
    Publication date: November 24, 2022
    Inventors: Changqing SHEN, Yu XIA, Lin KONG, Liang CHEN, Piao LEI, Yongjun SHEN, Dong WANG, Hongbo QUE, Aiwen ZHANG, Minjie CHEN, Chuancang DING, Xingxing JIANG, Jun WANG, Juanjuan SHI, Weiguo HUANG, Zhongkui ZHU
  • Publication number: 20220371266
    Abstract: Provided are compositions that may be referred to as photoreactive compositions or inks. The compositions may have a plurality of reactive components, which are silica nanocages with one or more photoreactive ligand(s). Also provided are methods of making an article of manufacture. Also provided are articles of manufacture and uses thereof. The article of manufacture may be formed from a composition of the present disclosure.
    Type: Application
    Filed: November 2, 2020
    Publication date: November 24, 2022
    Inventors: Jen-Yu Huang, Tangi Aubert, Tobias Hanrath, Ulrich B. Wiesner
  • Publication number: 20220373891
    Abstract: A method includes forming a bottom layer over a semiconductor substrate, where the bottom layer includes a polymer bonded to a first cross-linker and a second cross-linker, the first cross-linker being configured to be activated by ultraviolet (UV) radiation and the second cross-linker being configured to be activated by heat at a first temperature. The method then proceeds to exposing the bottom layer to a UV source to activate the first cross-linker, resulting in an exposed bottom layer, where the exposing activates the first cross-linker. The method further includes baking the exposed bottom layer, where the baking activates the second cross-linker.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 24, 2022
    Inventors: Jing Hong Huang, Chien-Wei Wang, Shang-Wern Chang, Ching-Yu Chang
  • Publication number: 20220374761
    Abstract: The instant system and methods solves the cold start problem through various systems and methods directed to aggregating user interaction data associated with a user over a period of time, generating an embedding model based on the aggregated user interaction data, generating a content embedding vector based on the embedding model, generating an embedding profile vector based on the embedding model, storing the embedding profile vector in a storage device, receiving each of the content embedding vector and embedding vector profile for training a ranking model, and generating a predicted list of one or more content items of interest for recommending to the user.
    Type: Application
    Filed: May 6, 2021
    Publication date: November 24, 2022
    Inventors: Peng-Yu CHEN, Yu-Ting CHANG, Chi-Chia HUANG, Yi-Ting TSAO, Cheng-En YEN, Tzu-Chiang LIOU
  • Publication number: 20220373865
    Abstract: A camera device with image compensation and autofocus function, comprising a first carrying member, a second carrying member, a camera module, a first optical compensation component, a third carrying member, and an autofocus component. The second carrying member is movably assembled to the first carrying member. The first optical compensation component comprises a first force interaction member disposed at the first carrying member and a second force interaction member disposed at the second carrying member, which generate force interaction, allowing the second carrying member to move in the direction of a first axis or/and a second axis intersecting with an optical axis of the optical lens for optical compensation for the optical lens. The third carrying member bears the optical lens and is movably disposed on the second carrying member. The third carrying member could move along an optical axis of the optical lens.
    Type: Application
    Filed: January 21, 2022
    Publication date: November 24, 2022
    Applicant: Lanto Electronic Limited
    Inventors: Fu-Yuan WU, Tao-Chun CHEN, Wen-Yen HUANG, Meng-Ting LIN, Shang-Yu HSU
  • Publication number: 20220375850
    Abstract: A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a device, a first dielectric material disposed over the device, and an opening is formed in the first dielectric material. The semiconductor device structure further includes a conductive structure disposed in the opening, and the conductive structure includes a first sidewall. The semiconductor device structure further includes a surrounding structure disposed in the opening, and the surrounding structure surrounds the first sidewall of the conductive structure. The surrounding structure includes a first spacer layer and a second spacer layer adjacent the first spacer layer. The first spacer layer is separated from the second spacer layer by an air gap.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 24, 2022
    Inventors: LIN-YU HUANG, LI-ZHEN YU, CHIA-HAO CHANG, CHENG-CHI CHUANG, KUAN-LUN CHENG, CHIH-HAO WANG
  • Publication number: 20220376111
    Abstract: A semiconductor device includes a gate structure on a semiconductor fin, a dielectric layer on the gate structure, and a gate contact extending through the dielectric layer to the gate structure. The gate contact includes a first conductive material on the gate structure, a top surface of the first conductive material extending between sidewalls of the dielectric layer, and a second conductive material on the top surface of the first conductive material.
    Type: Application
    Filed: September 24, 2021
    Publication date: November 24, 2022
    Inventors: Kan-Ju Lin, Chien Chang, Chih-Shiun Chou, TaiMin Chang, Hung-Yi Huang, Chih-Wei Chang, Ming-Hsing Tsai, Lin-Yu Huang
  • Publication number: 20220376087
    Abstract: The present disclosure relates to a semiconductor device including a substrate and a pair of spacers on the substrate. Each spacer of the pair of spacers includes an upper portion having a first width and a lower portion under the upper portion and having a second width different from the first width. The semiconductor device further includes a gate structure between the pair of spacers. The gate structure has an upper gate length and a lower gate length that is different from the upper gate length.
    Type: Application
    Filed: July 28, 2022
    Publication date: November 24, 2022
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Yu KUO, Shang-Yun HUANG, Chih-Yin KUO
  • Publication number: 20220375931
    Abstract: A device comprises a first transistor, a second transistor, a first contact, and a second contact. The first transistor comprises a first gate structure, first source/drain regions on opposite sides of the first gate structure, and first gate spacers spacing the first gate structure apart from the first source/drain regions. The second transistor comprises a second gate structure, second source/drain regions on opposite sides of the second gate structure, and second gate spacers spacing the second gate structure apart from the second source/drain regions. The first contact forms a first contact interface with one of the first source/drain regions. The second contact forms a second contact interface with one of the second source/drain regions. An area ratio of the first contact interface to top surface the first source/drain region is greater than an area ratio of the second contact interface to top surface of the second source/drain region.
    Type: Application
    Filed: July 28, 2022
    Publication date: November 24, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Pin HUANG, Hou-Yu CHEN, Chuan-Li CHEN, Chih-Kuan YU, Yao-Ling HUANG
  • Publication number: 20220375827
    Abstract: A device, such as a computer system, includes an interconnection device die and at least two additional device dice. The additional device dies can be system on integrated chip (SOIC) dies laying face to face (F2F) on the interconnection device die. The interconnection device die includes electrical connectors on one surface, enabling connection to and/or among the additional device dice. The interconnection device die includes at least one redistribution circuit structure, which may be an integrated fan out (InFO) structure, and at least one through-silicon via (TSV). The TSV enables connection between a signal line, power line or ground line, from an opposite surface of the interconnection device die to the redistribution circuit structure and/or electrical connectors. At least one of the additional dice can be a three-dimensional integrated circuit (3DIC) die with face to back (F2B) stacking.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 24, 2022
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheny-hung Yeh, Hui Yu Lee, Po-Hsiang Huang, Yi-Kan Cheng