Abstract: A constant speed control method for a vehicle and a device thereof are disclosed. The constant speed control method includes steps of: firstly examining if a constant speed switch of the vehicle is pressed by an electronic control unit; allowing the electronic control unit to enter a constant speed mode when the constant speed switch is pressed; and sending a signal by the electronic control unit, so as to lock a throttle locking device for maintaining an opening degree of a throttle valve, and to adjust an transmission ratio of an electric continuously variable transmission (ECVT) for maintaining the constant speed driving of the vehicle. The present invention is further related to a constant speed control device for implementing the above method.

Abstract: A holder is disclosed, wherein the holder is situated on a circuit board and is used for connecting with an electronic component. The holder comprises an upper surface, a lower surface, and an opening. The upper surface comprises a recess used for laying a flat component, wherein the recess comprises at least one rough area; the lower surface comprises a protruding edge, wherein the protruding edge is connected with the circuit board with glue, and the protruding side and the circuit board delimit a space; and the opening penetrates the upper surface and the lower surface, whereby the gas generated from heating the glue will accumulate in the enclosed space, and the gas will then escape through the opening and out through at least one of the rough areas.

Abstract: An electronic device and a method of operating a screen are disclosed; the touch screen has a display area and a non-display area, and the method includes steps as follows. First, a first sensing signal is generated when a designator controls a pointer on the non-display area. Then, a second sensing signal is generated when the pointer is moved from the non-display area to the display area. Then, a third sensing signal is generated when the pointer is moved on the display area. Last, a user interface is opened in the display area when a processing module receives the first, second and third sensing signals sequentially.

Abstract: Read the description file of a PCBA without determining and selecting connectors which might be relevant to boundary scan. The description file of the PCBA determines which pins of the connectors on the PCBA should correspond to the pins of a test I/O module. And use the wiring report generated by an auto test program generator to correspond the pins of the test I/O module to the pins of the connectors which are accessed by boundary scan. Thus the IC of the test I/O module would not have any unused pin between any two consecutive pins wired to the connectors of the PCBA.

Abstract: A built-in self repair (BISR) circuit for a multi-port memory and a method thereof are provided. The circuit includes a test-and-analysis module (TAM) and a defect locating module (DLM) coupled to the TAM. The TAM tests a repairable multi-port memory to generate a fault location and determines whether the test generates a port-specific fault candidate according to the fault location. If a port-specific fault candidate is generated, the DLM generates a defect location based on the fault location and provides the defect location to the TAM so that the TAM can determine how to repair the repairable multi-port memory according to the defect location. If no port-specific fault candidate is generated in the test, the TAM determines how to repair the repairable multi-port memory according to the fault location.

Abstract: A built-in self repair (BISR) circuit for a multi-port memory and a method thereof are provided. The circuit includes a test-and-analysis module (TAM) and a defect locating module (DLM) coupled to the TAM. The TAM tests a repairable multi-port memory to generate a fault location and determines whether the test generates a port-specific fault candidate according to the fault location. If a port-specific fault candidate is generated, the DLM generates a defect location based on the fault location and provides the defect location to the TAM so that the TAM can determine how to repair the repairable multi-port memory according to the defect location. If no port-specific fault candidate is generated in the test, the TAM determines how to repair the repairable multi-port memory according to the fault location.

Abstract: A wafer supporting device of a sputter apparatus includes a pedestal positioned in a sputtering chamber and used to load a wafer for sputtering, a deposition ring having a recess positioned on a peripheral portion of the pedestal, and a cover ring positioned on the pedestal and the deposition ring. The cover ring has a gate corresponding to the recess.

Abstract: Read the description file of a PCBA without determining and selecting connectors which might be relevant to boundary scan. The description file of the PCBA determines which pins of the connectors on the PCBA should correspond to the pins of a test I/O module. And use the wiring report generated by an auto test program generator to correspond the pins of the test I/O module to the pins of the connectors which are accessed by boundary scan. Thus the IC of the test I/O module would not have any unused pin between any two consecutive pins wired to the connectors of the PCBA.

Abstract: The present invention provides a package structure of optical sensitive device. The package structure includes a silicon substrate, an optical sensitive device, a supporting pad, a transparent plate and a plurality of conductive wires. The optical sensitive device is positioned on the silicon substrate, and the transparent plate is fixedly positioned on the supporting pad and corresponds to the optical sensitive area of the optical sensitive device. The transparent plate can be positioned on the substrate, and the electrical wires are electrically connected between the optical sensitive device and the substrate.

Abstract: A package substrate having a chip on a substrate has a die pad on the substrate. The chip is attached on the die pad via ah adhesive. A plurality of gold contacts is distributed on the die pad for electrically connecting to the chip. A plurality of traces is distributed around the die pad to connect to the chip via wires. An adhesive dike is formed between the die pad and the traces to prevent the adhesive from flowing out of the die pad when the chip is attached on the die pad.