Patents by Inventor Yu Jin
Yu Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250253240Abstract: A three-dimensional memory device includes a stack structure including first and second tier stacks stacked on a substrate, each of the first and second tier stacks including a plurality of electrode layers and a plurality of interlayer insulating layers alternately stacked; a connection contact penetrating at least partially the stack structure; and a plurality of support patterns each including a first tier support penetrating the first tier stack and a second tier support penetrating the second tier stack. The plurality of support patterns include first support patterns adjacent to the connection contact. In two first support patterns among the first support patterns, which neighbor each other with the connection contact interposed therebetween, a gap between first tier supports is smaller than a gap between second tier supports.Type: ApplicationFiled: July 9, 2024Publication date: August 7, 2025Inventors: Byung Soo PARK, Jee Hyun KIM, Yu Jin KWON, Jeong Seob OH
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Publication number: 20250245853Abstract: Provided is a technology for recognizing a location or orientation of a robot using patterns of a floor on which the robot travels, and the technology includes two interrelated sub-technologies. The first sub-technology is a technology for generating a code block map based on floor pattern recognition, in which a code block map is generated using patterns of a floor on which a robot travels, and the second sub-technology is a technology for recognizing a location and orientation of a robot based on a floor pattern code string, in which a location and orientation of a traveling robot are recognized using a generated code block map.Type: ApplicationFiled: May 19, 2024Publication date: July 31, 2025Applicant: KOREA INSTITUTE OF ROBOT & CONVERGENCEInventors: Kap Ho SEO, Kyon Mo YANG, Ji Won LEE, Jae Wan KOO, Yu Jin CHO
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Publication number: 20250239227Abstract: A display device includes display pixels each including a light emitting part including a light emitting element and a pixel driver applying a driving current to the light emitting element, and light sensing pixels each including a light sensing part including an optical element and a sensing driver, the sensing driver applying a sensing current to a sensing line according to a photocurrent of the optical element. The sensing driver includes a first sensing transistor controlling the sensing current flowing through the sensing line according to a voltage of a first electrode of the optical element, and a second sensing transistor initializing the first electrode of the optical element to a first level voltage. A channel layer of the first sensing transistor and a channel layer of the second sensing transistor are made of different materials.Type: ApplicationFiled: April 9, 2025Publication date: July 24, 2025Applicant: Samsung Display Co., LTD.Inventors: Hee Rim SONG, Hee Jean PARK, Yu Jin LEE, Cheol Gon LEE, Mu Kyung JEON
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Patent number: 12364045Abstract: An image sensing device includes a plurality of pixel groups, each pixel group including first to fourth unit pixels that are configured to respond to incident light and generate electrical signals, and wherein each of the first to fourth unit pixels of a pixel group includes optical filters operable to transmit incident light corresponding to a same color, wherein the first unit pixel and the second unit pixel that are included in the pixel group are located adjacent to each other and include portions of a first microlens, and wherein a light reception area of the third unit pixel of the pixel group has a size smaller than a size of a light reception area of the fourth unit pixel of the pixel group.Type: GrantFiled: June 22, 2021Date of Patent: July 15, 2025Assignee: SK HYNIX INC.Inventors: Kyoung In Lee, Yu Jin Park
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Publication number: 20250226859Abstract: Embodiments of this application provide a communication method and a communication apparatus. The method includes: A terminal device determines a first parameter value of a first parameter based on a measurement result of a first downlink reference signal and a first precoder, where the first parameter reflects downlink channel quality; and obtains a parameter value of a second parameter based on a first compensation amount and the first parameter value of the first parameter, and reports the parameter value of the second parameter, where the first compensation amount indicates a difference between downlink channel quality in a case in which a network device uses the first precoder and downlink channel quality in a case in which the network device uses a second precoder. In the solutions in embodiments of this application, the parameter value reported by the terminal device can accurately reflect actual downlink channel quality.Type: ApplicationFiled: March 28, 2025Publication date: July 10, 2025Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Xiaomeng CHAI, Yang TIAN, Yuan LI, Yu JIN, Yan SUN, Jiyong PANG
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Publication number: 20250219896Abstract: A network controller and operating method of the network controller are disclosed. The network controller includes, based on error information transmitted through a plurality of data link layers and a plurality of physical layers respectively corresponding to a plurality of ports managed by one transaction layer, a port monitor circuit configured to determine a number of valid ports among the plurality of ports by monitoring a status of the plurality of ports, a split circuit configured to split and transmit one packet to the valid ports based on the number of valid ports, and a reorder buffer configured to sort an order of second split packets, which are received from another network controller through the plurality of ports, and restore the second split packets received.Type: ApplicationFiled: July 29, 2024Publication date: July 3, 2025Applicants: SAMSUNG ELECTRONICS CO., LTD., Daegu Gyeongbuk Institute of Science and TechnologyInventors: Seokbin HONG, Mincheol KANG, Gain KIM, Dong Geon KIM, Seo Young JANG, Yu Jin CHOI
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Publication number: 20250217987Abstract: A multi-task learning method according to an embodiment of the present disclosure may include generating, by a generation device, a first feature based on a first input image through a multi-task encoder, generating, by the generation device, a first output image based on the first feature through a first decoder for a first task, generating, by the generation device, a first loss based on the first output image and a first ground truth (GT) for the first task, generating, by the generation device, a second feature based on the first input image through a pretrained first encoder for a second task, generating, by the generation device, a second loss based on the first feature and the second feature, and learning, by a learning device, the multi-task encoder and the first decoder based on the first loss and the second loss.Type: ApplicationFiled: May 29, 2024Publication date: July 3, 2025Applicants: HYUNDAI MOTOR COMPANY, Kia CorporationInventors: Jung Gee KIM, Yu Jin YUN, Geon KANG
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Publication number: 20250218781Abstract: The present invention provides a substrate treatment method. The substrate processing method includes: a processing liquid supply step of supplying processing liquid to a substrate; and a heating step of heating a specific area of the substrate by emitting a laser beam, which is generated from a laser source, to the substrate, wherein the heating step may include: a laser modulation step of modulating the laser beam using a light modulation unit; and a laser emission step of emitting the laser beam modulated by the light modulation unit to the specific area.Type: ApplicationFiled: December 20, 2024Publication date: July 3, 2025Applicant: SEMES CO., LTD.Inventors: Tae Shin KIM, Seryeyohan CHO, Young Dae CHUNG, Seung Un OH, Hyun YOON, Yu Jin CHO, Ki Hoon CHOI
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Publication number: 20250219181Abstract: A method of recovering ternary valuable metals from a waste cathode active material includes a step of leaching valid metals in a waste cathode active material powder under acidic conditions, and a step of recovering the leached valid metals, wherein, in the step of leaching valid metals in the waste cathode active material powder under acidic conditions, an oxidizing agent is further added to selectively leach lithium. The method further comprises a step of leaching cobalt (Co) and nickel (Ni) from a residue separated from the lithium leachate leached by the step of leaching valid metals in the waste cathode active material powder under acidic conditions and recovering manganese dioxide (MnO2) as a residue, a step of reducing the residue manganese dioxide, and a step of leaching the manganese dioxide.Type: ApplicationFiled: December 11, 2024Publication date: July 3, 2025Inventors: EUIHYUK KWON, YU JIN LIM, YUJIN PARK
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Publication number: 20250210277Abstract: A tantalum capacitor includes a tantalum body including a tantalum element body including tantalum particles and a conductive polymer layer disposed on the tantalum element body, the tantalum body having a first surface, a second surface opposing the first surface in a first direction, and a plurality of side surfaces connecting the first surface and the second surface to each other, a molded portion surrounding the tantalum body, and a coating layer disposed on at least a portion of an edge on which the first surface of the tantalum body and the plurality of side surfaces meet each other. When a thickness of an edge portion of the conductive polymer layer is denoted by t1 and a thickness of the coating layer is denoted by t2, a sum of t1 and t2 satisfies 5.5 ?m or more and 100 ?m or less.Type: ApplicationFiled: December 6, 2024Publication date: June 26, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yu Jin HAM, Boum Seock KIM, Chin Mo KIM, Jin Young KIM, Seong Jun PARK, Joung Hee CHO
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Publication number: 20250206807Abstract: The present application discloses a recombinant humanized type III collagen microsphere with innovative spatial structure, and its design, preparation process, and use. The gene sequence of humanized type III collagen is designed and constructed, and cut by a cutting enzyme and then cyclized by cyclase, obtaining the recombinant humanized type III collagen microspheres with an innovative spatial structure, without introducing any foreign insertion gene or modification gene. The collagen microsphere of the present application exhibits a long degradation time and good stability and durability and can exert its various biological effects for a long time, which can better adapt to applications in the pharmaceutical and cosmetics industries.Type: ApplicationFiled: December 17, 2024Publication date: June 26, 2025Inventors: Yu Jin, Lin Xu, Nianqin Xu, Jinbiao Lu, Dongwu Zhang, Songquan Xu, Kaijin Chang, Mouzhi Liu, Yuan Jiang
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Publication number: 20250208085Abstract: A nanoelectronic device includes first and second nano electrodes, a nanogap defined by the first and second nano electrodes and separating the first and second nano electrodes, a solvent present in the nanogap and including a plurality of redox molecules, and a component configured as a disruptor of solvent atomic structures, the component forming a surface portion on a bulk portion within the device, the component being located at a predetermined distance away from the first and second nano electrodes.Type: ApplicationFiled: December 20, 2023Publication date: June 26, 2025Inventors: Mordechai KORNBLUTH, Yu JIN, Christopher JOHNSON
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Publication number: 20250203862Abstract: A semiconductor device may include: a peripheral circuit located on a substrate; a stack structure located over the peripheral circuit in a non-core region and including insulating layers and dummy layers that are alternately and repeatedly stacked; a channel pattern located on the stack structure; a transistor located on the channel pattern; a contact structure extending through the stack structure and electrically connecting the peripheral circuit to the channel pattern; a gate structure located over the peripheral circuit in a core region and including insulating layers and conductive layers that are alternately and repeatedly stacked; a first source pattern located on the gate structure; and a channel structure extending through the gate structure to contact the first source pattern.Type: ApplicationFiled: April 4, 2024Publication date: June 19, 2025Inventors: Eun Seok CHOI, Dong Won KIM, Yu Jin PARK, Hui Woo PARK, Young Ock HONG
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Publication number: 20250179354Abstract: Disclosed are a heterocyclic compound of Chemical Formula 1, an organic light emitting device including the same and a composition for an organic material layer of an organic light emitting device.Type: ApplicationFiled: November 26, 2024Publication date: June 5, 2025Applicant: LT MATERIALS CO.,LTD.Inventors: Yu-Jin HEO, Jun-Tae MO, Dong-Jun KIM, Dae-Hyuk CHOI
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Patent number: 12322773Abstract: The present invention relates to a secondary battery which includes a sheathing made of a material having an increased thermal conductivity and can thus have an improved safety. As an example, disclosed is a secondary battery comprising: an electrode assembly; and a sheath material which receives the electrode assembly and comprises a metal layer and a non-metal layer formed on the surface of the metal layer, wherein the thickness of the metal layer occupies 50% to 70% of the total thickness of the sheath material.Type: GrantFiled: September 20, 2018Date of Patent: June 3, 2025Assignee: Samsung SDI Co., Ltd.Inventors: Won Chull Han, Jeong Chull Ahn, Shin Gun Kang, Sang Hyun Kim, Sung Soo Park, Soo Youn Park, Chang Wook Kim, Young Jin Park, Yu Jin Han
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Publication number: 20250174533Abstract: A semiconductor package structure includes a package substrate. The package substrate includes a first core structure, a plurality of first dielectric layers, a plurality of first metal layers, a plurality of second dielectric layers, and a plurality of second metal layers. The first core structure has a first surface and a second surface opposite the first surface. The first dielectric layers and the first metal layers are alternatingly stacked on the first surface of the first core structure. The second dielectric layers and the second metal layers are alternatingly stacked on the second surface of the first core structure. A number of second dielectric layers is less than a number of first dielectric layers.Type: ApplicationFiled: June 7, 2024Publication date: May 29, 2025Inventors: Yih-Ting SHEN, Tai-Yu CHEN, Ping-Yeh LIN, Yu-Jin LI, Chun-Yi CHANG, Chi-Yuan CHEN, Sang-Mao CHIU
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Publication number: 20250174576Abstract: A semiconductor package includes a package substrate, an interposer disposed on the package substrate, a central logic die and peripheral function dies disposed on the interposer, and at least one dummy die disposed between the central logic die and the peripheral function dies so as to form a rectangular shaped die arrangement. The at least one dummy die is disposed at a corner position of the rectangular shaped die arrangement. An underfill fills a gap between the interposer and the package substrate. A stress-reducing buffer structure is disposed on a bottom surface of the interposer.Type: ApplicationFiled: November 13, 2024Publication date: May 29, 2025Applicant: MEDIATEK INC.Inventors: Pei-Haw Tsao, Te-Chi Wong, Yu-Jin Li, Yih-Ting Shen, Tai-Yu Chen
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Publication number: 20250167161Abstract: A package includes a first die over and bonded to a first side of a package component, where a first bond between the first die and the package component includes a dielectric-to-dielectric bond between a first bonding layer of the first die and a second bonding layer on the package component, and second bonds between the first die and the package component include metal-to-metal bonds between first bonding pads of the first die and second bonding pads on the package component, a first portion of a redistribution structure adjacent to the first die and over the second bonding layer, and a second die over and coupled to the first portion of the redistribution structure using first conductive connectors, where the first conductive connectors are electrically connected to first conductive pads in the second bonding layer.Type: ApplicationFiled: February 23, 2024Publication date: May 22, 2025Inventors: Yu-Jin Hu, Hua-Wei Tseng, Wei-Cheng Wu, Yung-Ping Chiang, An-Jhih Su, Der-Chyang Yeh
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Publication number: 20250154648Abstract: Provided are a precursor for forming a metal thin film including a metal compound represented by Chemical Formula 1, a method for manufacturing a metal thin film using the same, and a metal thin film manufactured by the method.Type: ApplicationFiled: August 1, 2024Publication date: May 15, 2025Applicants: Samsung Electronics Co., Ltd., ADEKA CORPORATION, ADEKA KOREA CorporationInventors: Hyunwoo KIM, Daeun KIM, Akio SAITO, Tomoharu YOSHINO, Kazuki HARANO, Takashi HIGASHINO, Shotaro TAGUCHI, Yoshiki MANABE, Yu Jin PARK, Byung Seok LEE, Seung-min RYU, Gyu-Hee PARK, Younjoung CHO
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Publication number: 20250156012Abstract: A display device includes a first display panel, a second display panel disposed adjacent to the first display panel, a first touch array disposed on the first display panel, a second touch array disposed on the second display panel, a first touch driver that applies a first touch driving signal to the first touch array in response to a frame synchronization signal, a second touch driver that applies a second touch driving signal to the second touch array in response to the frame synchronization signal, and a common line commonly connected to the first and second touch drivers to transmit the frame synchronization signal, and pulses included in the first touch driving signal and pulses included in the second touch driving signal have phases opposite to each other.Type: ApplicationFiled: May 30, 2024Publication date: May 15, 2025Inventors: Yu Jin SIN, Jae Hyun PARK, IL Ho LEE, Hyun Wook CHO