Patents by Inventor Yu-Ju LIAO

Yu-Ju LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMBEDDED COMPONENT PACKAGE STRUCTURE, EMBEDDED TYPE PANEL SUBSTRATE AND MANUFACTURING METHOD THEREOF
    Publication number: 20200296836
    Abstract: An embedded component package structure including a circuit substrate, an embedded component and a stress compensation layer is provided. The circuit substrate includes a core layer and an asymmetric circuit structure, and the core layer has a first thickness. The embedded component is disposed in the core layer. The stress compensation layer is disposed on one side of the core layer, and the stress compensation layer has a second thickness between 4 ?m and 351 ?m.
    Type: Application
    Filed: March 12, 2019
    Publication date: September 17, 2020
    Inventors: Yu-Ju LIAO, Chien-Fan CHEN, Chien-Hao WANG, I-Chia LIN