Patents by Inventor Yu-Jui Wu

Yu-Jui Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220304131
    Abstract: A method for using an extreme ultraviolet radiation source is provided. The method includes assembling a first droplet generator onto a port of a vessel; ejecting a target droplet from the first droplet generator to a zone of excitation in front of a collector; emitting a laser toward the zone of excitation, such that the target droplet is heated by the laser to generate extreme ultraviolet (EUV) radiation; stopping the ejection of the target droplet; after stopping the ejection of the target droplet, disassembling the first droplet generator from the port of the vessel; after disassembling the first droplet generator from the port of the vessel, inserting a cleaning device into the vessel through the port; and cleaning the collector by using the cleaning device.
    Type: Application
    Filed: July 7, 2021
    Publication date: September 22, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chiao-Hua CHENG, Hsin-Feng CHEN, Yu-Fa LO, Yu-Kuang SUN, Wei-Shin CHENG, Yu-Huan CHEN, Ming-Hsun TSAI, Cheng-Hao LAI, Cheng-Hsuan WU, Shang-Chieh CHIEN, Heng-Hsin LIU, Li-Jui CHEN, Sheng-Kang YU
  • Patent number: 11451916
    Abstract: A sound adjustment method is disclosed. The sound adjustment method includes the following the steps: receiving a sound adjustment command; receiving a right channel sound signal and a left channel sound signal; selecting a corresponding adjustment mode according to the sound adjustment command and processing the right channel sound signal and the left channel sound signal based on the adjustment mode to generate a right channel first sound signal and a left channel first sound signal, wherein different adjustment modes have different intensity adjustment levels; shifting the frequency of the right channel first sound signal by X Hz to generate a right channel second sound signal and shifting the frequency of the left channel first sound signal by Y Hz to generate a left channel second sound signal, wherein 0.5?|X?Y|?100; outputting the right channel second sound signal and the left channel second sound signal.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: September 20, 2022
    Assignee: AIROHA TECHNOLOGY CORP.
    Inventors: Kuo-Wei Kao, Po-Jui Wu, Yu-Chieh Huang, Wei-Lin Chang, Kai-Yuan Hsiao, Cheng-Te Wang, I-Ting Lee, Kuo-Ping Yang
  • Patent number: 11442365
    Abstract: A photolithography system utilizes tin droplets to generate extreme ultraviolet radiation for photolithography. The photolithography system irradiates the droplets with a laser. The droplets become energized and emit extreme ultraviolet radiation. A collector reflects the extreme ultraviolet radiation toward a photolithography target. The photolithography system isolates a source of droplets from oxidants to prevent the oxidation of the nozzle or the formation of metal oxides on the nozzle, both of which can adversely affect an ability of the nozzle to generate a sufficient amount of droplets and/or direct the droplets in a desired direction.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: September 13, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Kuang Sun, Ming-Hsun Tsai, Yu-Huan Chen, Wei-Shin Cheng, Cheng-Hao Lai, Hsin-Feng Chen, Chiao-Hua Cheng, Cheng-Hsuan Wu, Yu-Fa Lo, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu
  • Publication number: 20220276572
    Abstract: A photolithographic apparatus includes a droplet generator, a droplet generator maintenance system, and a controller communicating with the droplet generator maintenance system. The droplet generator maintenance system operatively communicates with the droplet generator, a coolant distribution unit, a gas supply unit, and a supporting member. The gas supply unit includes a heat exchange assembly and an air heating assembly. The coolant distribution unit is configured to control the temperature of the droplet generator within the acceptable droplet generator range.
    Type: Application
    Filed: March 14, 2022
    Publication date: September 1, 2022
    Inventors: Yu-Huan CHEN, Cheng-Hsuan WU, Ming-Hsun TSAI, Shang-Chieh CHIEN, Li-Jui CHEN
  • Publication number: 20220199555
    Abstract: An electronic device includes a substrate, a transistor, and a ring resonator. The transistor is over the substrate. The ring resonator is over the substrate and includes a conductive loop and an impedance matching element. The conductive loop overlaps with the transistor. The impedance matching element is on the conductive loop and electrically isolated from the transistor.
    Type: Application
    Filed: March 9, 2022
    Publication date: June 23, 2022
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Shih-Yuan CHEN, Jiun-Yun LI, Rui-Fu XU, Chiung-Yu CHEN, Ting-I YEH, Yu-Jui WU, Yao-Chun CHANG
  • Patent number: 11276653
    Abstract: An electronic device includes a substrate, a transistor, and a ring resonator. The transistor is over the substrate. The transistor is configured to generate a quantum dot. The ring resonator is over the substrate and includes a conductive loop and an impedance matching element. The conductive loop overlaps with the transistor. The impedance matching element is on the conductive loop and is configured to determine a resonance frequency of the ring resonator.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: March 15, 2022
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Shih-Yuan Chen, Jiun-Yun Li, Rui-Fu Xu, Chiung-Yu Chen, Ting-I Yeh, Yu-Jui Wu, Yao-Chun Chang
  • Publication number: 20210375821
    Abstract: A method for forming a chip package structure is provided. The method includes forming a first conductive bump and a first ring-like structure over a chip. The first ring-like structure surrounds the first conductive bump, the first ring-like structure and the first conductive bump are made of a same first material, the chip includes an interconnect structure, and the first ring-like structure is electrically insulated from the interconnect structure and the first conductive bump. The method includes bonding the chip to a substrate through the first conductive bump.
    Type: Application
    Filed: August 5, 2021
    Publication date: December 2, 2021
    Inventors: Sheng-Yao YANG, Ling-Wei LI, Yu-Jui WU, Cheng-Lin HUANG, Chien-Chen LI, Lieh-Chuan CHEN, Che-Jung CHU, Kuo-Chio LIU
  • Patent number: 11088108
    Abstract: A method for forming a chip package structure is provided. The method includes forming a first conductive bump and a first ring-like structure over a chip. The first ring-like structure surrounds the first conductive bump, the first ring-like structure and the first conductive bump are made of a same first material, the chip includes an interconnect structure, and the first ring-like structure is electrically insulated from the interconnect structure and the first conductive bump. The method includes bonding the chip to a substrate through the first conductive bump.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: August 10, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Sheng-Yao Yang, Ling-Wei Li, Yu-Jui Wu, Cheng-Lin Huang, Chien-Chen Li, Lieh-Chuan Chen, Che-Jung Chu, Kuo-Chio Liu
  • Publication number: 20210118826
    Abstract: An electronic device includes a substrate, a transistor, and a ring resonator. The transistor is over the substrate. The transistor is configured to generate a quantum dot. The ring resonator is over the substrate and includes a conductive loop and an impedance matching element. The conductive loop overlaps with the transistor. The impedance matching element is on the conductive loop and is configured to determine a resonance frequency of the ring resonator.
    Type: Application
    Filed: October 17, 2019
    Publication date: April 22, 2021
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Shih-Yuan CHEN, Jiun-Yun LI, Rui-Fu XU, Chiung-Yu CHEN, Ting-I YEH, Yu-Jui WU, Yao-Chun CHANG
  • Publication number: 20200411467
    Abstract: A method for forming a chip package structure is provided. The method includes forming a first conductive bump and a first ring-like structure over a chip. The first ring-like structure surrounds the first conductive bump, the first ring-like structure and the first conductive bump are made of a same first material, the chip includes an interconnect structure, and the first ring-like structure is electrically insulated from the interconnect structure and the first conductive bump. The method includes bonding the chip to a substrate through the first conductive bump.
    Type: Application
    Filed: June 27, 2019
    Publication date: December 31, 2020
    Inventors: Sheng-Yao YANG, Ling-Wei LI, Yu-Jui WU, Cheng-Lin HUANG, Chien-Chen LI, Lieh-Chuan CHEN, Che-Jung CHU, Kuo-Chio LIU
  • Patent number: 9966427
    Abstract: A method for manufacturing a metal-insulator-metal (MIM) capacitor with a top electrode that is free of sidewall damage is provided. A bottom electrode layer is formed with a first material. An inter-electrode dielectric layer is formed over the bottom electrode layer. A top electrode layer is formed over the inter-electrode dielectric layer and without the first material. A first etch is performed into the top electrode layer and the inter-electrode dielectric layer to form a top electrode. A second etch into the bottom electrode layer to form a bottom electrode. The present application is also directed towards a MIM capacitor resulting from performing the method.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: May 8, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shyh-Wei Cheng, Hung-Lin Chen, Jui-Chun Weng, Shiuan-Jeng Lin, Tian Sheng Lin, Yu-Jui Wu, Albion Pan, Bob Sun
  • Patent number: 9884758
    Abstract: The present disclosure relates to a MEMS package having an outgassing element configured to adjust a pressure within a hermetically sealed cavity by inducing outgassing of into the cavity, and an associated method. In some embodiments, the method is performed by forming an outgassing element within a passivation layer over a CMOS substrate and forming an outgassing resistive layer to cover the outgassing element. The outgassing resistive layer is removed from over the outgassing element, and the MEMS substrate is bonded to a front side of the CMOS substrate to enclose a first MEMS device within a first cavity and a second MEMS device within a second cavity. After removing the outgassing resistive layer, the outgassing element releases a gas into the second cavity to increase a second pressure of the second cavity to be greater than a first pressure of the first cavity.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: February 6, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shyh-Wei Cheng, Hsi-Cheng Hsu, Hsin-Yu Chen, Ji-Hong Chiang, Jui-Chun Weng, Wei-Ding Wu, Yu-Jui Wu, Ching-Hsiang Hu, Ming-Tsung Chen
  • Publication number: 20170330931
    Abstract: A method for manufacturing a metal-insulator-metal (MIM) capacitor with a top electrode that is free of sidewall damage is provided. A bottom electrode layer is formed with a first material. An inter-electrode dielectric layer is formed over the bottom electrode layer. A top electrode layer is formed over the inter-electrode dielectric layer and without the first material. A first etch is performed into the top electrode layer and the inter-electrode dielectric layer to form a top electrode. A second etch into the bottom electrode layer to form a bottom electrode. The present application is also directed towards a MIM capacitor resulting from performing the method.
    Type: Application
    Filed: May 13, 2016
    Publication date: November 16, 2017
    Inventors: Shyh-Wei Cheng, Hung-Lin Chen, Jui-Chun Weng, Shiuan-Jeng Lin, Tian Sheng Lin, Yu-Jui Wu, Albion Pan, Bob Sun
  • Publication number: 20170203962
    Abstract: The present disclosure relates to a MEMS package having an outgassing element configured to adjust a pressure within a hermetically sealed cavity by inducing outgassing of into the cavity, and an associated method. In some embodiments, the method is performed by forming an outgassing element within a passivation layer over a CMOS substrate and forming an outgassing resistive layer to cover the outgassing element. The outgassing resistive layer is removed from over the outgassing element, and the MEMS substrate is bonded to a front side of the CMOS substrate to enclose a first MEMS device within a first cavity and a second MEMS device within a second cavity. After removing the outgassing resistive layer, the outgassing element releases a gas into the second cavity to increase a second pressure of the second cavity to be greater than a first pressure of the first cavity.
    Type: Application
    Filed: June 15, 2016
    Publication date: July 20, 2017
    Inventors: Shyh-Wei Cheng, Hsi-Cheng Hsu, Hsin-Yu Chen, Ji-Hong Chiang, Jui-Chun Weng, Wei-Ding Wu, Yu-Jui Wu, Ching-Hsiang Hu, Ming-Tsung Chen
  • Patent number: 7752807
    Abstract: An improved watering device comprises a cap member including a fastening portion provided at the upper side thereof for screwing with a container, and including a hollow tapered insertion element couplingly disposed at the lower side thereof and communicating with the fastening portion for forming a water passageway therein, and the cap member containing an air flowing duct extending in the air venting end of the cap member and having an air admitting end formed at the outer portion thereof for screwing with a rotating knob, wherein the air admitting end of the air flowing duct includes a tapered outer thread portion attached thereon so that as screwing with the rotating knob, an air admitting sacs between the inner and outer thread portions may be formed, thereby the outside air may flow into the air flowing duct, any by using the control member, the outflow amount of fluid may be stably regulated.
    Type: Grant
    Filed: July 17, 2007
    Date of Patent: July 13, 2010
    Inventor: Yu-Jui Wu
  • Patent number: 7323784
    Abstract: Top via pattern for a bond pad structure has at least one first via group and at least one second via group adjacent to each other. The first via group has at least two line vias extending in a first direction. The second via group has at least two line vias extending in a second direction different from said first direction. The line via of the first via group does not cross the line via of the second via group.
    Type: Grant
    Filed: March 17, 2005
    Date of Patent: January 29, 2008
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ho-Yin Yiu, Fu-Jier Fan, Yu-Jui Wu, Aaron Wang, Hsiang-Wei Wang, Huang-Sheng Lin, Ming-Hsien Chen, Ruey-Yun Shiue
  • Publication number: 20080017728
    Abstract: An improved watering device comprises a cap member including a fastening portion provided at the upper side thereof for screwing with a container, and including a hollow tapered insertion element couplingly disposed at the lower side thereof and communicating with the fastening portion for forming a water passageway therein, and the cap member containing an air flowing duct extending in the air venting end of the cap member and having an air admitting end formed at the outer portion thereof for screwing with a rotating knob, wherein the air admitting end of the air flowing duct includes a tapered outer thread portion attached thereon so that as screwing with the rotating knob, an air admitting sacs between the inner and outer thread portions may be formed, thereby the outside air may flow into the air flowing duct, any by using the control member, the outflow amount of fluid may be stably regulated.
    Type: Application
    Filed: July 17, 2007
    Publication date: January 24, 2008
    Inventor: Yu-Jui Wu
  • Publication number: 20060208360
    Abstract: Top via pattern for a bond pad structure has at least one first via group and at least one second via group adjacent to each other. The first via group has at least two line vias extending in a first direction. The second via group has at least two line vias extending in a second direction different from said first direction. The line via of the first via group does not cross the line via of the second via group.
    Type: Application
    Filed: March 17, 2005
    Publication date: September 21, 2006
    Inventors: Ho-Yin Yiu, Fu-Jier Fan, Yu-Jui Wu, Aaron Wang, Hsiang-Wei Wang, Huang-Sheng Lin, Ming-Hsien Chen, Ruey-Yun Shiue
  • Patent number: 6684563
    Abstract: A watering device comprises a watering container, a cap, a control knob, and an air tube. The cap is fastened with the water container such that an air inlet of the cap and a channel of a tapered projection of the cap are in communication with the hollow interior of the water container. The tapered projection of the cap is provided with at least one water discharging hole in communication with the air inlet of the cap. The control knob is rotatably fastened with an outer end of the air inlet such that the control knob can be turned to block the air inlet. The air tube is fastened at one end with an inner end of the air inlet such that other end of the air tube is extended into the hollow interior of the water container.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: February 3, 2004
    Inventor: Yu-Jui Wu
  • Publication number: 20030079402
    Abstract: A watering device comprises a watering container, a cap, a control knob, and an air tube. The cap is fastened with the water container such that an air inlet of the cap and a channel of a tapered projection of the cap are in communication with the hollow interior of the water container. The tapered projection of the cap is provided with at least one water discharging hole in communication with the air inlet of the cap. The control knob is rotatably fastened with an outer end of the air inlet such that the control knob can be turned to block the air inlet. The air tube is fastened at one end with an inner end of the air inlet such that other end of the air tube is extended into the hollow interior of the water container.
    Type: Application
    Filed: September 26, 2002
    Publication date: May 1, 2003
    Inventor: Yu-Jui Wu