Abstract: A light emitting device and a manufacturing method thereof are provided. The light emitting device includes a light emitting unit, a fluorescent layer, a reflective layer, and a light-absorbing layer. The light emitting unit has a top surface, a bottom surface opposite to the top surface, and a side surface located between the top surface and the bottom surface. The light emitting unit includes an electrode disposed at the bottom surface. The fluorescent layer is disposed on the top surface of the light emitting unit. The reflective layer covers the side surface of the light emitting unit. The light-absorbing layer covers the reflective layer, so that the reflective layer is located between the side surface of the light emitting unit and the light-absorbing layer.

Abstract: An automated-position-aligning method for transferring chips includes forming a chip-carrier base, applying a liquid, disposing a chip, transporting a carrier substrate and transferring the chip. A related system includes a carrier substrate, a liquid applying device, a chip disposing device, a carrier substrate transporting device and a chip transferring device. A carrier surface of the carrier substrate is crisscrossed by spacing grooves to form chip-carrier bases thereon. The carrier surface is hydrophilic, and the spacing grooves are hydrophobic. The liquid gathers on the chip-carrier bases. A plurality of chips are positioned and attached on the respective chip-carrier bases by surface free energy of the liquid. An electromagnetic wave radiates to the carrier substrate to heat and evaporate the liquid between each chip-carrier base and each chip such that the chips are released from the chip-carrier bases and fall to a receiving surface of a receiving substrate.

Abstract: Disclosed is a reflow device of a reflow soldering equipment, the reflow soldering equipment being provided with a reflowing zone, the reflow device comprising: a heating light source; a light mask having a plurality of holes, the light mask being irradiated by the heating light in such a manner that the heating light passes through the holes of the light mask to irradiate into the reflowing zone so as to form a plurality of irradiation areas; and a transporting member having a carrier which carries an object to be processed to move through the reflowing zone along a transporting path, wherein a plurality of predetermined areas to be reflowed are defined in an upper surface of the object to be processed, the carrier is configured to, when the object to be processed is in a position where the predetermined area to be reflowed is within the irradiation area respectively, halt at the position for a predetermined irradiation time, and then continue to move forward and move through the reflowing zone.