Light emitting diode package
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The broken lines in the drawings are included for the purpose of illustration and form no part of the claimed design.
Claims
The ornamental design for a light emitting diode package, as shown and described.
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Type: Grant
Filed: Mar 2, 2018
Date of Patent: Mar 26, 2019
Assignee: Genesis Photonics Inc. (Tainan)
Inventors: Chuan-Yu Liu (Tainan), Xun-Xain Zhan (Tainan), Chun-Ming Tseng (Tainan), Yu-Jung Wu (Tainan), Yu-Feng Lin (Tainan)
Primary Examiner: Selina Sikder
Application Number: 29/638,942