Abstract: The present disclosure is directed to formation of a low-k spacer. For example, the present disclosure includes an exemplary method of forming the low-k spacer. The method includes depositing the low-k spacer and subsequently treating the low-k spacer with a plasma and/or a thermal anneal. The low-k spacer can be deposited on a structure protruding from the substrate. The plasma and/or thermal anneal treatment on the low-k spacer can reduce the etch rates of the spacer so that the spacer is etched less in subsequent etching or cleaning processes.

Abstract: A reminding method of unfamiliar emails includes: establishing a familiar database, the familiar database including familiar mail addresses and corresponding history records; receiving an email; verifying whether a sender address of the email is in the familiar database; generating a strange reminding message to a recipient of the email while the sender address is not in the familiar database; and determining whether the email is abnormal based upon the corresponding history records in the familiar database while the sender address is in the familiar database, and sending an abnormal reminding message to the recipient while the email is determined abnormal.

Abstract: A heat-dissipating device configured to cool the battery pack of an electric vehicle includes a coolant circulating pump and a tank. The coolant circulating pump is configured to engage with the one or more heat dissipation pipes of the electric vehicle and communicate with the one or more heat dissipation pipes. The tank is configured to contain coolant which includes phase change material. When cooling is required, for example during battery recharging, the coolant circulating pump is configured to inject the coolant in the tank into the one or more heat dissipation pipes via the coolant inlet, drive the coolant to flow in the one or more heat dissipation pipes, and take the coolant out from the one or more heat dissipation pipes via the coolant outlet to the exterior. A related electric vehicle and a related heat dissipation method are also provided.

Abstract: A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.

Abstract: The present disclosure is directed to formation of a low-k spacer. For example, the present disclosure includes an exemplary method of forming the low-k spacer. The method includes depositing the low-k spacer and subsequently treating the low-k spacer with a plasma and/or a thermal anneal. The low-k spacer can be deposited on a structure protruding from the substrate. The plasma and/or thermal anneal treatment on the low-k spacer can reduce the etch rates of the spacer so that the spacer is etched less in subsequent etching or cleaning processes.

Abstract: The present invention relates to a phosphor, a method for preparing the phosphor, an optoelectronic component, and a method for producing the optoelectronic component. The phosphor has the following general formula: La3(1?x)Ga1?yGe5(1?z)O16: 3xA3+, yCr3+, 5zB4+, where x, y, and z do not equal to 0 simultaneously; A represents at least one of Gd and Yb; B represents at least one of Sn, Nb, and Ta. For the phosphor, its emission spectrum is within a red visible light region and a near-infrared region when excited by blue visible light, purple visible light or ultraviolet light; and it has a wide reflection spectrum and a high radiant flux. Therefore, it can be used in optoelectronic components such as LEDs to meet requirements of current medical testing, food composition analysis, security cameras, iris/facial recognition, virtual reality, gaming notebook and light detection and ranging applications.

Abstract: An energy management system includes a power supply module, a charging module, an interface module and an energy management module. The power supply module provides an input power. The charging module generates, based on the input power, a first charge power and a second charge power in response to a first charge control signal and a second charge control signal. The interface module detects electrical energy stored in an energy storage device to generate a detection result. In response to the detection result, the energy management module determines an operating state of the energy storage device, and generates one of the first and second charge control signals.

Abstract: A battery charging apparatus includes a charging power source, a plurality of charging circuits, a plurality of batteries, a plurality of switching circuits and a control circuit. The control circuit is configured to determine the type of charging power source based on a current-voltage curve of the charging power source, and to control conduction states of the switching circuits to connect the charging circuits and the batteries in series in a series charging mode and to connect the charging circuits and the batteries in parallel in an equalizing charging mode. A battery charging method of the battery charging apparatus is also introduced.

Abstract: A method for sorting a light source is to be implemented by a computer and includes configuring the computer to determine whether or not a to-be-sorted light source is different from a reference light source by comparing features of a curve associated with measured spectral data of the to-be-sorted light source, with features of a reference curve associated with reference spectral data of a reference light source.

Abstract: The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.

Abstract: A method for manufacturing graphene-based material is disclosed. A graphene oxide dispersion includes graphene oxide dispersed in solvent. A hydrogen sulfide gas is introduced to the graphene oxide dispersion at a reacting temperature to achieve a graphene dispersion. The hydrogen sulfide reduces graphene oxide into graphene, and elemental sulfur produced from the hydrogen sulfide is deposited on surfaces of the graphene. The solvent and elemental sulfur are removed to achieve a graphene composite material.

Abstract: A method for making graphene-based highly dense but porous carbon material with a high degree of hardness includes forming a sol by dispersing a graphene-based component in a solvent; preparing a graphene-based gel by reacting the sol in a reacting container at a temperature of about 20° C. to about 500° C. for about 0.1 hours to about 100 hours; and drying the gel at a temperature of about 0° C. to about 200° C. to obtain a material. A graphene-based porous carbon material and applications thereof are also disclosed.

Abstract: A method for manufacturing graphene-based material is disclosed. A graphene oxide dispersion includes graphene oxide dispersed in solvent. A hydrogen sulfide gas is introduced to the graphene oxide dispersion at a reacting temperature to achieve a graphene dispersion. The hydrogen sulfide reduces graphene oxide into graphene, and elemental sulfur produced from the hydrogen sulfide is deposited on surfaces of the graphene. The solvent and elemental sulfur are removed to achieve a graphene composite material.

Abstract: The invention provides a light emitting sensing device and a manufacturing method thereof. The light emitting sensing device comprises: a non-translucent substrate having a first surface with at least one recess formed on the first surface; a light emitting element disposed in the at least one recess; a light sensing element disposed on the first surface; a first transparent material disposed in the at least one recess and covering the light emitting element; and a second transparent material disposed on the first surface and covering the light sensing element. The light emitting sensing device provided in this embodiment solves the problem in the prior art, the infrared light emitted by the light emitting chip irradiates into the sensing chip and causes the sensing chip to be interfered by the light of the light emitting chip resulting in reduced sensing accuracy.

Abstract: The present invention provides a package support structure and a light emitting device including same. The package support structure includes: a housing which comprises a light emitting surface, a backlight surface, a bottom surface and a groove; a conductive support which is partially covered by the housing and includes a first lead and a second lead that are separated from each other, where each of the first lead and the second lead includes an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; where one of the first lead and the second lead further includes a heat radiation portion, the heat radiation portion extend outward from the electrode portion and is exposed from the backlight surface of the housing.

Abstract: The present disclosure discloses an LED package structure and a chip-scale light emitting unit. The chip-scale light emitting unit includes an LED chip, a phosphor sheet, and at least one light guiding group. The phosphor sheet covers entirely a top surface of the LED chip. The phosphor sheet has a light emitting surface arranged away from the LED chip, and the light emitting surface has a central region and a ring-shaped region surrounding the central region. The light guiding group is disposed on the ring-shaped region and covers at least 60% of an area of the ring-shaped region of the phosphor sheet, and the central region is not covered by the light guiding group. The light guiding group includes a plurality of light guiding micro-structures.

Abstract: The present disclosure is directed to formation of a low-k spacer. For example, the present disclosure includes an exemplary method of forming the low-k spacer. The method includes depositing the low-k spacer and subsequently treating the low-k spacer with a plasma and/or a thermal anneal. The low-k spacer can he deposited on a structure protruding from the substrate. The plasma and/or thermal anneal treatment on the low-k spacer can reduce the etch rates of the spacer so that the spacer is etched less in subsequent etching or cleaning processes.

Abstract: This invention discloses a circuit encoding method and a circuit structure recognition method. The circuit encoding method is applied to a circuit structure recognition process of a circuit. The circuit is coupled to a voltage source and a reference voltage. The circuit encoding method includes: selecting a target transistor from the circuit; when a terminal of the target transistor is electrically connected to the voltage source or the reference voltage, adding a first value to a terminal value of the terminal; when the terminal of the target transistor is electrically connected to a terminal other than the voltage source and the reference voltage, adding a second value to the terminal value of the terminal; and taking a set of multiple terminal values of the target transistor as a transistor signature of the target transistor.

Abstract: A sodium ion battery electrode material is disclosed, the electrode material including a conductive porous material or a conductive porous composite. A sodium accommodating pore is defined inside the electrode material, effective pore diameter size for sodium ion storage in the sodium accommodating pore is in a range of 0.2-50 nm. A method for preparing the conductive porous composite and a sodium ion battery electrode are also provided.

Abstract: A multi-axis hinge includes a first shaft, a first rotary member pivotally connected to the first shaft, a second shaft fixed to the first rotary member, a second rotary member pivotally connected to the second shaft, a first switching pin movably configured at the first rotary member, and a switching member fixed to the first shaft. The switching member includes a switching recess. When the first switching pin is located at the switching recess of the switching member, the second rotary member is rotatable relatively to the first rotary member. The second rotary member includes a switching recess. When the first switching pin is located at the switching recess of the second rotary member, the second rotary member is fixed to the first rotary member. An electronic device with the multi-axis hinge is also disclosed therein.