Patents by Inventor Yu Ke

Yu Ke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151304
    Abstract: For a manual gearshift control of conventional vehicle transmission, a vehicle gearshift automatic control device including a first actuator module, a second actuator module and an electronic control unit, is provided in an add-on manner to retrofit the vehicle transmission with both automatic and manual gearshift functions. In an automatic gearshift mode, the electronic control unit executes the vehicle gearshift automatic control method and receives an automatic gearshift command to drive the first actuator module to push a shift lever to implement a lateral shift selection, or to drive the second actuator module to spin a park lever to implement a longitudinal gearshift. For vehicle security, whenever a vehicle gearshift automatic control device failure or a manual gearshift intervention is detected in the automatic gearshift mode, the electronic control unit shuts off the automatic gearshift mode and switches to a manual gearshift mode to perform the manual gearshift function.
    Type: Application
    Filed: February 17, 2023
    Publication date: May 9, 2024
    Inventors: Shao-Yu Lee, Zeng-Lung Huang, Bing-Ren Chen, Jia-Cheng Ke
  • Patent number: 11964409
    Abstract: A multi-shot moulding part structure includes a first structural part, an ink decoration layer, and a second structural part. The first structural part has a first area surface, a second area surface, and a joining surface located on the second area surface. The joining surface is non-parallel to the second area surface. The ink decoration layer is spread on the first area surface and the second area surface, but not on the joining surface. The second structural part is combined with the first structural part and covers the second area surface. The second structural part touches the joining surface. By the second structural part touching the joining surface of the first structural part that is not coated with the ink decoration layer, the structural bonding strength between the first structural part and the second structural part is enhanced.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: April 23, 2024
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Wen-Ching Lin, Ting-Yu Wang, Fa-Chih Ke, Yu-Ling Lin, Wen-Hsiang Chen
  • Publication number: 20240077343
    Abstract: Multiphase flowmeter aperture antenna transmission and pressure retention are disclosed herein. An example apparatus includes at least one radiating element to transmit or receive an electromagnetic signal along a measurement plane orthogonal to a direction of flow of the fluid in the vessel; a pressure retaining member to prevent fluid from entering the aperture antenna assembly through a measurement window of the aperture antenna assembly, at least a portion of the pressure retaining member to separate the radiating element and the fluid; and a metal housing with or without slits, the pressure retaining member to be at least partially within the metal housing, the radiating element to be coupled to the metal housing.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Inventors: Yu Ke Lim, Shasha Wang, Linyuan Zhan, Muhammad Fuad Bin Mohamed Zain, Kenny Shin Han Wei, Guillaume Jolivet, Cheng-Gang Xie
  • Patent number: 11923630
    Abstract: An electrical connector assembly includes: a bracket; and at least one transmission assembly mounted to the bracket and including an internal printed circuit board (PCB), a board-mount connector connected to a first row of conductive pads disposed at a bottom end portion of the PCB, and a plug-in connector connected to a second row of conductive pads disposed at a front end portion of the PCB, wherein the PCB has a third row of conductive pads disposed at a rear end portion thereof.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: March 5, 2024
    Assignees: FUDING PRECISION INDUSTRY (ZHENGZHOU) CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Shih-Wei Hsiao, Yu-San Hsiao, Yen-Chih Chang, Yu-Ke Chen, Na Yang, Wei-Hua Zhang
  • Publication number: 20240072019
    Abstract: An electronic package is provided, in which an electronic module and a plurality of conductive pillars are embedded in an encapsulation layer, and a circuit structure is formed on the encapsulation layer, where the electronic module includes a carrier structure having conductive vias and at least a first electronic element disposed on the carrier structure. The first electronic element has a plurality of conductors in a form of conductive through-silicon vias, and at least a second electronic element is disposed on the circuit structure. Therefore, the design of the electronic module can reduce the layout area occupied by the electronic element on a surface of a packaging zone of the circuit structure, such that other functional elements can be added to the electronic package according to requirements, and the electronic package can improve functional requirements of the end product.
    Type: Application
    Filed: October 27, 2022
    Publication date: February 29, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chung-Yu Ke, Liang-Pin Chen
  • Publication number: 20240069387
    Abstract: A display device includes a touch panel, an optical adhesive layer, and a front light module that includes a light source and a light guide plate (LGP) including multiple microstructures recessed into the LGP from a first surface of the LGP to form voids. The optical adhesive layer is adhered between the touch panel and a first surface of the LGP. A surface of the optical adhesive layer facing the LGP is in contact with the first surface of the LGP in multiple first regions, and a surface of the optical adhesive layer facing the LGP and the plurality of microstructures being overlapped in multiple second regions. A maximum vertical distance between each void and the first surface is a first depth. A vertical distance between the first regions and the second regions is 0 to 0.7 times the first depth.
    Type: Application
    Filed: July 12, 2023
    Publication date: February 29, 2024
    Applicant: Coretronic Corporation
    Inventors: Tzeng-Ke Shiau, Yu-Feng Lin, Ying-Shun Syu, Che-Jui Hsu
  • Patent number: 11860669
    Abstract: The invention introduces a method, an apparatus and a non-transitory computer program product for storing data in flash memory. The method is performed by a processing unit when loading and executing program code of a flash translation layer to include: dividing storage space of a flash module into a first region and a second region; programming data belonging to a first partition type received from a host side into first physical blocks of the first region only; and programming data belonging to a second partition type received from the host side into the first physical blocks of the first region and the second physical blocks of the second region. With the region division and the policy for writing data into the regions in terms of data characteristics of different partition types, storage space of the flash module would be used more effective.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: January 2, 2024
    Assignee: SILICON MOTION, INC.
    Inventor: Kuan-Yu Ke
  • Publication number: 20230402409
    Abstract: An electronic package is provided, in which a plurality of antenna structures and a heat sink are integrated on a package module including an electronic element, so as to guide the heat energy generated by the electronic element out of the package module via the heat sink. Therefore, when the electronic package is configured with the plurality of antenna structures, the heat dissipation of the electronic element can be improved.
    Type: Application
    Filed: July 6, 2022
    Publication date: December 14, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chung-Yu Ke, Liang-Pin Chen
  • Patent number: 11835371
    Abstract: Multiphase flowmeter aperture antenna transmission and pressure retention are disclosed herein. An example apparatus includes at least one radiating element to transmit or receive an electromagnetic signal along a measurement plane orthogonal to a direction of flow of the fluid in the vessel; a pressure retaining member to prevent fluid from entering the aperture antenna assembly through a measurement window of the aperture antenna assembly, at least a portion of the pressure retaining member to separate the radiating element and the fluid; and a metal housing with or without slits, the pressure retaining member to be at least partially within the metal housing, the radiating element to be coupled to the metal housing.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: December 5, 2023
    Assignee: Schlumberger Technology Corporation
    Inventors: Yu Ke Lim, Shasha Wang, Linyuan Zhan, Muhammad Fuad Bin Mohamed Zain, Kenny Shin Han Wei, Guillaume Jolivet, Cheng-Gang Xie
  • Publication number: 20230317565
    Abstract: An electronic package is provided, in which a first packaging layer is formed on a circuit structure, a portion of at least one conductive column is inserted into the first packaging layer, a remaining portion of the conductive column is protruded from the first packaging layer, and a second packaging layer is formed to cover the remaining portion of the conductive column, so that the conductive column is integrally formed in the first packaging layer and the second packaging layer. Therefore, the impact on the conductive column from the second packaging layer can be reduced and the problem of tilting of the conductive column can be prevented.
    Type: Application
    Filed: May 23, 2022
    Publication date: October 5, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chung-Yu Ke, Liang-Pin Chen
  • Publication number: 20230275337
    Abstract: An electronic package is provided and includes a first carrier structure having a plurality of antenna feed lines, and an antenna module disposed on the first carrier structure. The antenna module includes a substrate body having a plurality of recesses with different depths. Further, antenna layers are formed in the plurality of recesses and electromagnetically coupled to the antenna feed lines so as to improve the overall radiation efficiency of the antenna assembly.
    Type: Application
    Filed: May 4, 2023
    Publication date: August 31, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chung-Yu Ke, Chia-Chu Lai, Liang-Pin Chen
  • Patent number: 11729905
    Abstract: A stretchable circuit is provided in the invention. The stretchable circuit comprises a plurality of segments. Each segment includes a plurality of sub-segments. Each sub-segment includes at least one main line, at least one secondary line, and rib lines, and in each sub-segment, the main lines and the secondary lines are electrically connected to the rib lines.
    Type: Grant
    Filed: April 2, 2021
    Date of Patent: August 15, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Lin Hsu, Hung-Hsien Ko, Ting-Yu Ke, Ting-Yu Wang
  • Publication number: 20230197591
    Abstract: An electronic package is provided and includes stacking a first packaging module having a circuit structure, an electronic element, a plurality of first conductive elements and a first packaging layer with a second packaging module having a routing structure, a plurality of second conductive elements and a second packaging layer, so that the second packaging layer is formed on the first packaging layer in a manner that the routing structure is overlapped on the circuit structure, where each of the second conductive elements is correspondingly bonded with each of the first conductive elements. Accordingly, the circuit structure and the routing structure are manufactured separately at the same time, so as to shorten the process time and control the stress distribution on the circuit structure and the routing structure separately.
    Type: Application
    Filed: February 17, 2022
    Publication date: June 22, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chung-Yu Ke, Po-Kai Huang, Liang-Pin Chen
  • Publication number: 20230199961
    Abstract: An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.
    Type: Application
    Filed: March 24, 2022
    Publication date: June 22, 2023
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Lin Hsu, Kuan-Chu Wu, Ting-Yu Ke, Min-Hsiung Liang, Yu-Ming Peng
  • Patent number: 11682826
    Abstract: An electronic package is provided and includes a first carrier structure having a plurality of antenna feed lines, and an antenna module disposed on the first carrier structure. The antenna module includes a substrate body having a plurality of recesses with different depths. Further, antenna layers are formed in the plurality of recesses and electromagnetically coupled to the antenna feed lines so as to improve the overall radiation efficiency of the antenna assembly.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: June 20, 2023
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chung-Yu Ke, Chia-Chu Lai, Liang-Pin Chen
  • Publication number: 20230183357
    Abstract: An isolated antibody, comprising: a heavy chain variable domain (VH) that is at least 75% identical to the amino acid sequence of SEQ ID NO: 1; and a light chain variable domain (VL) that is at least 75% identical to the amino acid sequence of SEQ ID NO: 2; wherein the antibody binds specifically to human neurotensin receptor 1 (hNTSR1).
    Type: Application
    Filed: June 9, 2021
    Publication date: June 15, 2023
    Inventors: Chuan Shih, Andrew Yueh, Ren-Huang Wu, Han-Shu Hu, Pei-Shan Wu, Zhi-Ping Yang, Yi-Yu Ke, Chiung-Tong Chen
  • Patent number: 11662944
    Abstract: A method and apparatus for performing resuming management are provided. The method includes: utilizing a boot loader to load a group of In-System Programming (ISP) codes; storing information to be retained, including a resume ISP loader, into a retention region of a RAM, for being retained during sleeping; determining whether to start sleeping, and generating a determining result; in response to the determining result, controlling the memory device to start sleeping; after starting sleeping, determining whether a wake-up event occurs; after the wake-up event occurs, executing a first ISP code within the group of ISP codes to start performing a first operation; and executing the resume ISP loader to load other ISP codes within the group of ISP codes.
    Type: Grant
    Filed: November 1, 2020
    Date of Patent: May 30, 2023
    Assignee: Silicon Motion, Inc.
    Inventor: Kuan-Yu Ke
  • Publication number: 20230131830
    Abstract: Pyrimidine compounds of Formula (I). Assignments to the variables in the formula are set forth herein. Also disclosed is a method of treating cancer with one of the pyrimidine compounds.
    Type: Application
    Filed: March 3, 2021
    Publication date: April 27, 2023
    Inventors: Chun-Ping Chang, Ya-Hui Chi, Chiung-Tong Chen, Chuan Shih, Yi-Yu Ke
  • Patent number: 11580017
    Abstract: The invention relates to a method, a non-transitory computer program product, and an apparatus for managing data storage. The method performed by a flash controller includes: obtaining information indicating a subregion to be activated, where the subregion is associated with a logical block address (LBA) range; triggering a garbage collection (GC) process being performed in background to migrate user data of all the or a portion of the LBA range associated with the subregion to continuous physical addresses in a flash device; and updating content of a plurality of entries associated with the subregion according to migration results, where each entry includes information indicating which physical address that user data of a corresponding logical address is physically stored in the flash device.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: February 14, 2023
    Assignee: SILICON MOTION, INC.
    Inventor: Kuan-Yu Ke
  • Publication number: 20230033854
    Abstract: An electrical connector assembly includes: a first frame defining plural accommodating cavities; plural transmission units partially received in the accommodating cavities, respectively, each of the transmission units comprising a card edge connector received in a corresponding accommodating cavity, a motherboard connector, and a circuit board connected with the card edge connector and the motherboard connector; and a second frame attached to the first frame; wherein the second frame presses against and hold the circuit boards in position.
    Type: Application
    Filed: July 21, 2022
    Publication date: February 2, 2023
    Inventors: XIAN-LIANG ZHANG, QIN-XIN CAO, WEN-BO ZHAO, YEN-CHIH CHANG, YU-SAN HSIAO, SHIH-WEI HSIAO, YU-KE CHEN