Abstract: A semiconductor structure first and second channel regions, an isolation structure, a gate structure, first and second epitaxial features, a dielectric structure, a crystalline hard mask layer, and an amorphous hard mask layer. The isolation structure is disposed between the first channel region and the second channel region. The gate structure interfaces at least three surfaces of the first channel region and at least three surfaces of the second channel region. The first epitaxial feature is adjacent to a sidewall of the first channel region. The second epitaxial feature is adjacent to a sidewall of the second channel region. The dielectric structure is between the first and second channel regions and over the isolation structure. The crystalline hard mask layer is over the dielectric structure. The amorphous hard mask layer is over the dielectric structure and laterally surrounded by the crystalline hard mask layer.

Abstract: An electrophoretic display with charge balance enhancing circuit includes a control substrate, a charge balance substrate, a charge balance electrode, a display layer arranged on one side of the control substrate, and a charge balance enhancing circuit. The electrophoretic display further includes a plurality of pixel electrodes, a plurality of capacitance electrodes and a plurality of storage capacitors. One end of the storage capacitor is the capacitance electrode. The charge balance enhancing circuit includes a charge-voltage conversion capacitor having a first terminal and a second terminal. The second electrode of the storage capacitor is electrically connected to the first terminal of the charge-voltage conversion capacitor, and the charge balance electrode is electrically connected to the second terminal of the charge-voltage conversion capacitor.

Abstract: A semiconductor device includes a first integrated circuit, a bridge die, and a redistribution layer (RDL) structure. The first integrated circuit includes a first interconnect structure, a first passivation layer and a first conductive connector electrically connected to the first interconnect structure and disposed on the first passivation layer. The bridge die bridge die includes a second interconnect structure, a second passivation layer and a second conductive connector electrically connected to the second interconnect structure. The RDL structure is disposed between and electrically connected to the first integrated circuit and the bridge die, wherein the first passivation layer is in direct contact with the first conductive connector, the first conductive connector is in direct contact with the RDL structure, and the first passivation layer is a single layer and includes a first inorganic material.

Abstract: A radiative heat dissipation casing, including: an enclosure, which including a radiative heat dissipation unit whose material composition includes an aluminum oxide-boron nitride-fullerene composite material, for an enhanced thermal radiation dissipation; a heat generation element, disposed inside the enclosure; and an internal heat transfer bridge, disposed between the heat generation element and the enclosure, wherein the waste heat from the heat generation element is transferred via the internal heat transfer bridge to the radiative heat dissipation unit and then radiated to the outside of the enclosure.

Abstract: A three-dimensional flash memory device may be a AND flash memory device. The three-dimensional flash memory device includes: a substrate, a gate stack structure, a plurality of slit structures, a plurality of memory arrays, and a plurality of conductive pillars. The gate stack structure is located above the substrate. The plurality of slit structures extend through the gate stack structure and divide the gate stack structure into a plurality of blocks. The plurality of memory arrays are disposed in the gate stack structure of the plurality of blocks. The plurality of conductive pillars extends through the gate stack structure in the plurality of blocks, and disposed between the plurality of memory arrays and between the plurality of slit structures.

Abstract: An electrophoresis display includes a pixel control array including pixel units, a gate control circuit electrically connected to the pixel control array. The gate control circuit includes a plurality of gate driving circuit sets, one of the gate driving circuit sets includes a plurality of gate driving circuits. One of the gate driving circuits includes gate thin film transistor where an output of one gate driving circuit is electrically connected to a gate line of the pixel control array, a plurality of control signal lines where one of the control signal lines is connected to an input of one of the gate driving circuits of one gate driving circuit set, a plurality of gate driving circuit set enable lines where one of the gate driving circuit set enable lines is connected to the enable control points of the gate driving circuits of each gate driving circuit set.

Abstract: A vibration damping loudspeaker includes a sound generating unit, a magnetic assembly, a connecting member and a damping member. The connecting member is symmetrically arranged at the sound generating unit. The damping member is symmetrically injection molded between the magnetic assembly and the connecting member. A main magnetic plate is not in direct contact with the connecting member and thus a distance is formed in between. Thus, in the vibration damping loudspeaker of the present disclosure, by securely coupling the connecting member to the sound generating unit and securely assembling the damping member between the connecting member and the magnetic assembly, the damping member forms a buffer between the sound generating unit and the magnetic assembly, so as to achieve effects of shock absorption and shock isolation during the operation of the vibration damping loudspeaker to prevent discomfort of a user during use of an electronic device.

Abstract: Wingtip shields are described. In one embodiment, a wingtip shield includes an inner surface facing a high-pressure side of an airfoil. The airfoil is attached to the main body. The wingtip shield also includes an outer surface configured opposite from the inner surface. The wingtip shield is attachable to the airfoil along a peripheral edge of the airfoil from a first point of a leading edge of the airfoil to a second point of a trailing edge of the airfoil. A first span distance from the first point at the leading edge to the main body is less than a second span distance of the second point at the trailing edge to the main body.

Abstract: A sensing device is provided. The sensing device includes a sensing circuit, a plurality of sensing elements, and a plurality of light-collecting elements. The light-collecting elements are for collecting lights to the plurality of sensing elements. The plurality of sensing elements are configured to generate a plurality of sensing signals according to the lights that are collected, and output the plurality of sensing signals as a whole to the sensing circuit.

Abstract: An electrical connector assembly includes a board end connector and a wire end connector. The board end connector includes an insulative body and two conductive columns. The wire end connector includes an insulative housing and two conductive members. The insulative body includes a first latching member. The insulative housing includes two accommodating cavities therein. The insulative housing includes a plurality of lateral openings that are interconnected to the two accommodating cavities. A bottom of the insulative housing has a plurality of through holes that are interconnected to the two accommodating cavities. The insulative housing has a first sidewall and a second sidewall. There is a corner area between the first sidewall and the second sidewall. The corner area has a second latching member. The two conductive members are at least partially disposed in the two accommodating cavities, respectively.

Abstract: An optical circuit includes one or more input waveguides, a plurality of output waveguides, and a reflector structure. At least a portion of the reflector structure forms an interface with the one or more input waveguides. The portion of the reflector structure has a smaller refractive index than the one or more input waveguides. An electrical circuit is electrically coupled to the optical circuit. The electrical circuit generates and sends different electrical signals to the reflector structure. In response to the reflector structure receiving the different electrical signals, a carrier concentration level at or near the interface or a temperature at or near the interface changes, such that incident radiation received from the one or more input waveguides is tunably reflected by the reflector structure into a targeted output waveguide of the plurality of output waveguides.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first fin structure and a second fin structure over a semiconductor substrate and a first epitaxial structure over the first fin structure. The semiconductor device structure also includes a second epitaxial structure over the second fin structure. The semiconductor device structure further includes a dielectric fin over the semiconductor substrate. The dielectric fin is between the first fin structure and the second fin structure. The dielectric fin has an inner portion and a protective layer. The protective layer extends along sidewalls and a bottom of the inner portion, and the protective layer has a dielectric constant higher than that of the inner portion.

Abstract: Provided herein are methods for differentiating tumor and non-tumor (e.g., clonal hematopoiesis of indeterminate potential (CHIP)) origin nucleic acid variants from one another in a test sample obtained from a test subject at least partially using a computer. Other aspects are directed to methods of treating disease in subjects. Yet other aspects include related systems and computer readable media used to differentiating tumor and non-tumor origin nucleic acid variants from one another.

Abstract: The disclosure provides pharmaceutical compositions comprising a therapeutically effective amount of compound (A), compound (B), compound (C), compound (D), compound (E), compound (F), compound (G), compound (H), compound (J), compound (K), compound (L), compound (M), compound (N), compound (O), compound (P), or compound (Q) or a pharmaceutically acceptable salt thereof, and a pharmaceutically acceptable excipient: Also provided are dosage units comprising one or more of compound (A), compound (B), compound (C), compound (D), compound (E), compound (F), compound (G), compound (H), compound (J), compound (K), compound (L), compound (M), compound (N), compound (O), compound (P), or compound (Q) or the pharmaceutical compositions described herein, methods of treating an inflammatory bowel disease in a subject in need thereof, or methods of modulating an inflammatory bowel disease marker in a subject in need thereof.

Abstract: A cyclic power generation and storage system with dynamic battery switching capability is provided, comprising: a power supply modules, a driving module, a transmission module, a plurality of power generation modules, a control module, and a plurality of power storage modules. The present invention can dynamically switch in battery packs to provide a stable power to an electrical device, as well as, switch in a battery or battery pack for recharging with the power generated by the power generation modules. The power storage module having a power management unit, together with the control module, uses the detection result from the power detection unit of the power storage module to dynamically adjust the power generation, distribution, storage, and usage to improve the overall efficiency of the present invention.

Abstract: Wingtip shields are described. In one embodiment, a wingtip shield includes an inner surface facing a high-pressure side of an airfoil. The airfoil is attached to the main body. The wingtip shield also includes an outer surface configured opposite from the inner surface. The wingtip shield is attachable to the airfoil along a peripheral edge of the airfoil from a first point of a leading edge of the airfoil to a second point of a trailing edge of the airfoil. A first span distance from the first point at the leading edge to the main body is less than a second span distance of the second point at the trailing edge to the main body.

Abstract: An integrated vapor chamber includes a metallic top cover, a metallic bottom cover, a working space, capillary structures and a working fluid in the working space. The top cover includes oppositely an outer heat-dissipating surface and an inner condensation surface surrounded by a top frame. The inner condensation surface has parallel top grooves and protrusive supporting structures. The bottom cover includes oppositely an outer heat-absorption surface having recessed spaces for accommodating electronic elements and an inner evaporation surface surrounded by a bottom frame. The inner evaporation surface has parallel bottom grooves. The working space is an airtight space formed by engaging the top frame and the bottom frame with the inner condensation surface to face the inner evaporation surface, the top grooves to overlap individually the bottom grooves, the supporting structures to contact individually at the inner evaporation surface among the bottom grooves.

Abstract: A sensing device is provided herein, which operates in a reset period, an exposure period, and a readout period. The sensing device includes a first transistor, a second transistor, a detection device, and a third transistor. The first transistor includes a control terminal and a first terminal. The second transistor is coupled to the first transistor and configured to set the voltage of the control terminal during the exposure period. The sensing device is coupled to the first transistor and configured to change the voltage of the control terminal during the exposure period. The third transistor is coupled to the first transistor and includes an output terminal outputting a sense signal from the first terminal during the readout period. The first transistor is an N-type transistor and the third transistor is a P-type transistor.

Abstract: A card device including a first substrate, a circuit board, a sensing unit and a protective layer is disclosed. The circuit board is disposed on the first substrate, and the circuit board includes an accommodating recess. The sensing unit is disposed in the accommodating recess and electrically connected to the circuit board. The protective layer is disposed on the circuit board, and the protective layer covers the circuit board and the sensing unit.