Patents by Inventor Yu Lee

Yu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11374142
    Abstract: An electronic device includes a photodiode, a first transistor, a second transistor, a third transistor and a capacitor. The photodiode has a first terminal and a second terminal. The first transistor has a control terminal used to receive a reset signal, a first terminal coupled to the second terminal of the photodiode, and a second terminal. The second transistor has a control terminal coupled to the second terminal of the photodiode, a first terminal and a second terminal. The third transistor has a control terminal used to receive a row selection signal, a first terminal coupled to the second terminal of the second transistor, and a second terminal. The capacitor has a first terminal coupled to the second terminal of the photodiode, and a second terminal coupled to the second terminal of the first transistor.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: June 28, 2022
    Assignee: InnoLux Corporation
    Inventors: Hui-Ching Yang, Tao-Sheng Chang, Te-Yu Lee
  • Patent number: 11372299
    Abstract: A display panel includes a first substrate; a scan line and a data line disposed on the first substrate and extending in a first direction and a second direction, respectively, wherein the data line intersects the scan line; a polysilicon layer disposed on the first substrate. In a top view, the polysilicon layer includes: a first channel region overlapping a portion of the scan line; a second channel region overlapping another portion of the scan line; a non-channel region not overlapping the scan line and connected between the first channel region and the second channel region; a long region extended in the second direction; wherein a portion of the non-channel region extends in the first direction, the portion has a first width in the second direction, the long region has a second width in the first direction, and the first width is greater than the second width.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: June 28, 2022
    Assignee: INNOLUX CORPORATION
    Inventors: Hsing-Yi Liang, Kuei-Ling Liu, Te-Yu Lee
  • Patent number: 11373878
    Abstract: A technique for semiconductor manufacturing is provided. The technique includes the operations as follows. A semiconductor structure having a first material and a second material is revived. The first material has a first incubation time to a first etching chemistry. The second material has a second incubation time to the first etching chemistry. The first incubation time is shorter than the second incubation time. A first main etch to the semiconductor structure for a first duration by the first etching chemistry is performed. The first duration is greater than the first incubation time and shorter than the second incubation time.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: June 28, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Han-Yu Lin, Li-Te Lin, Tze-Chung Lin, Fang-Wei Lee, Yi-Lun Chen, Jung-Hao Chang, Yi-Chen Lo, Fo-Ju Lin, Kenichi Sano, Pinyen Lin
  • Publication number: 20220199523
    Abstract: Semiconductor devices and method of forming the same are disclosed herein. A semiconductor device according to the present disclosure includes a first dielectric layer having a first top surface and a contact via extending through the first dielectric layer and rising above the first top surface of the first dielectric layer.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 23, 2022
    Inventors: Pei-Yu Wang, Cheng-Ting Chung, Wei Ju Lee
  • Publication number: 20220199590
    Abstract: A light-emitting diode (LED) packaging module includes a plurality of LED chips spaced apart from one another, an encapsulating layer that fills in a space among the LED chips, a light-transmitting layer disposed on the encapsulating layer, a wiring assembly disposed on and electrically connected to the LED chips, and an insulation component that covers the encapsulating layer and the wiring assembly. Each of the LED chips includes an electrode assembly including first and second electrodes. The light-transmitting layer includes a light-transmitting layer that has a light transmittance greater than that of the encapsulating layer.
    Type: Application
    Filed: March 10, 2022
    Publication date: June 23, 2022
    Inventors: SHUNING XIN, CHEN-KE HSU, AIHUA CAO, JUNPENG SHI, WENG-TACK WONG, YANQIU LIAO, ZHEN-DUAN LIN, CHANGCHIN YU, CHI-WEI LIAO, ZHENG WU, CHIA-EN LEE
  • Publication number: 20220199592
    Abstract: A light-emitting diode (LED) packaging module includes light-emitting units arranged in an array having m row(s) and n column(s), an encapsulating layer, and a wiring assembly, where m and n each independently represents a positive integer. Each of the light-emitting units includes LED chips each including a chip first surface, a chip second surface, a chip side surface, and an electrode assembly disposed on the chip second surface. The encapsulating layer covers the chip side surface and fills a space among the LED chips. The wiring assembly is disposed on the chip second surface and is electrically connected to the electrode assembly.
    Type: Application
    Filed: March 10, 2022
    Publication date: June 23, 2022
    Inventors: SHUNING XIN, ZHEN-DUAN LIN, YANQIU LIAO, JUNPENG SHI, AIHUA CAO, CHANGCHIN YU, CHEN-KE HSU, CHI-WEI LIAO, CHIA-EN LEE, ZHENG WU
  • Publication number: 20220200169
    Abstract: An electronic device is provided according to an embodiment of the present invention. The electronic device includes a housing, a first antenna module and a second antenna module. The housing has a side, and the side has an accommodating space. The first antenna module is arranged in the accommodating space, and is for transmitting and receiving a signal of a first frequency band. The second antenna module is arranged in the accommodating space, and is for transmitting and receiving a signal of a second frequency band. A virtual reference surface is defined below the housing, and a projection range of the first antenna module on the virtual reference surface partially overlaps with a projection range of the second antenna module on the virtual reference surface.
    Type: Application
    Filed: June 28, 2021
    Publication date: June 23, 2022
    Inventors: KUN-CHENG LEE, MIN-YU WANG
  • Patent number: 11364082
    Abstract: A fusion-imaging method for radiofrequency ablation is provided, including: obtaining preoperative volume image of an individual; reconstructing a virtual three-dimensional model of a target area of the individual according to the preoperative volume image; creating a global reference frame by a tracking device and registering the virtual three-dimensional model to the global reference frame; obtaining an ultrasound image of the target area by using an ultrasonic probe and tracking the ultrasonic probe by the tracking device in order to register the ultrasonic image to the global reference frame; capturing a virtual corresponding image corresponding to a portion of the virtual three-dimensional model along a plane of the ultrasonic image; and overlapping the ultrasonic image and the virtual corresponding image and simultaneously displaying the overlapping image and a virtual radiofrequency ablation probe model.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: June 21, 2022
    Assignee: CHANG BING SHOW CHWAN MEMORIAL HOSPITAL
    Inventors: Atul Kumar, Yen-Yu Wang, Hurng-Sheng Wu, Kai-Che Liu, Shih-Wei Huang, I-Chun Lee, Wan-Chi Hung
  • Patent number: 11367507
    Abstract: Different embodiments of local redundancy decoder circuits that can be used in a memory device are disclosed. The different types of local redundancy decoder circuits are operably connected to the columns of memory cells in a memory array.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: June 21, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien-Yu Huang, Chia-En Huang, Cheng Hung Lee, Hua-Tai Shieh
  • Patent number: 11368195
    Abstract: Embodiments of a communications system with multiple active scattering devices to service multiple users either indoor or outdoor over same spectrum in a communication network and a method for the system are generally described herein. Signals streams for transmission to users in spoke-and-hub configurations will utilize multiple active scattering devices. Three categories of operational concepts are presented: (1) multiple scattering devices arranged geometrically bundled together to function as active mirrors or retro-directive repeaters, (2) distributed man-made scattering devices placed to enhance channel bandwidth in between a hub and a common service area via frequency re-use, and (3) organizing distributed active scattering devices by remote beamforming for servicing a small common coverage area indoor or outdoor with enhanced bandwidth.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: June 21, 2022
    Assignee: Spatial Digital Systems, Inc.
    Inventors: Donald C. D. Chang, Juo-Yu Lee
  • Publication number: 20220190250
    Abstract: A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.
    Type: Application
    Filed: March 7, 2022
    Publication date: June 16, 2022
    Inventors: Dong Mug SEONG, Jong Min YUN, Su Hyeon CHO, Hae Sik KIM, Tae Hoon HAN, Hyo Won SON, Sang Yu LEE, Sang Beum LEE
  • Publication number: 20220187195
    Abstract: Provided is a method of calibrating a nano measurement scale using a standard material including: measuring widths of a plurality of nanostructures included in the standard material and having pre-designated certified values of different sizes by a microscope; determining measured values for the widths of each of the plurality of nanostructures measured by the microscope based on a predetermined criterion; and calibrating a measurement scale of the microscope based on the certified values and the measured values.
    Type: Application
    Filed: June 3, 2021
    Publication date: June 16, 2022
    Inventors: Kyung Joong KIM, Gyea Young KWAK, Taegun KIM, Hyungung YU, Seung Mi LEE
  • Publication number: 20220189997
    Abstract: The present disclosure relates an integrated chip. The integrated chip includes a polysilicon layer arranged on an upper surface of a base substrate. A dielectric layer is arranged over the polysilicon layer, and an active semiconductor layer is arranged over the dielectric layer. A semiconductor material is arranged vertically on the upper surface of the base substrate and laterally beside the active semiconductor layer.
    Type: Application
    Filed: March 2, 2021
    Publication date: June 16, 2022
    Inventors: Eugene I-Chun Chen, Kuan-Liang Liu, Szu-Yu Wang, Chia-Shiung Tsai, Ru-Liang Lee, Chih-Ping Chao, Alexander Kalnitsky
  • Patent number: 11360524
    Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: June 14, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Ming-Chung Peng, Ko-Fan Chen, Chun-Yi Ho, Chien-Ting Lin, Yu-Jung Liu, Hsin-Jung Lee, Hsin-Yu Huang, Jih-Houng Lee, Ming-Feng Liu, Kuo-Jung Wu, Kuo-Pin Chen, Chia-Ling Lee, Jing-Jie Lin
  • Patent number: 11360519
    Abstract: An electronic device includes a first body, a second body, at least one hinge, and at least one electronic assembly. The hinge is connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the hinge. The electronic assembly is connected to the second body. A first gap exists between the electronic assembly and the hinge in an axial direction of the hinge.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: June 14, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Ming-Chung Peng, Jih-Houng Lee, Ko-Fan Chen, Hsin-Yu Huang
  • Patent number: 11361706
    Abstract: A micro-LED display system is disclosed. The micro-LED display system includes a host, a plurality of row/column drivers and a plurality of ?ICs. The row/column drivers are coupled to the host through serial interfaces and used to provide a plurality of row clock signals and a plurality of column data signals respectively. The ?ICs are arranged as a matrix including columns of ?ICs and rows of ?ICs receiving the column data signals and the row clock signals respectively. All ?ICs in the same column of ?ICs are cascaded in order and all ?ICs in the same row of ?ICs are cascaded in order.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: June 14, 2022
    Assignee: Raydium Semiconductor Corporation
    Inventors: Kuan-Hsien Lee, Chien-Yu Chan, Yann-Hsiung Liang, Yu-Lung Lo
  • Patent number: 11359722
    Abstract: A sealing member is provided, including a plurality of nodes and a plurality of antinodes. Each sealing member can be rotated to expose nondamaged lobes for sealing, and prevents the sealing member from falling out of the lobed groove. A chamber is provided, including a groove that the sealing member is placed in. A method of rotating and placing the sealing member is provided, including a rotation to expose nondamaged portions of the sealing member.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: June 14, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Shagun P. Maheshwari, Yao-Hung Yang, King F. Lee, Andrew Yu, Aniruddha Pal, Tom K. Cho, Chien-Min Liao
  • Publication number: 20220176372
    Abstract: A cartridge for a bioreactor adapted for accommodating a plurality of objects includes a cartridge main body defining a plurality of spaced-apart accommodating slots for respectively accommodating the objects therein. The cartridge main body includes a retaining portion extending into at least one of the accommodating slots, and adapted to retain a corresponding one of the objects in a corresponding one of the accommodating slots. The retaining portion is pushable to move resiliently in the corresponding one of the accommodating slots.
    Type: Application
    Filed: March 31, 2021
    Publication date: June 9, 2022
    Applicant: GENEREACH BIOTECHNOLOGY CORPORATION
    Inventors: Wen-Shan YANG, Ching-Ko LIN, Chia-Lin HSU, Fu-Chun LI, Pin-Hsing CHOU, Yun-Lung TSAI, Pei-Yu LEE, Hsiao-Fen CHANG
  • Publication number: 20220178527
    Abstract: A light emitting apparatus, including: a first light emitting device with a first substrate having a first upper surface and first bottom surface, a plurality of first LED chips disposed on the first upper surface, emitting a light penetrating the first substrate, and a first wavelength conversion layer directly contacting the plurality of first LED chips and first upper surface, and a first shape in a cross-sectional view; a second wavelength conversion layer directly contacting the first bottom surface; a second shape in the cross-sectional view substantially the same as the first shape; a second light emitting device separated from the first light emitting device, including a second substrate and plurality of second LEDs disposed on the second substrate; a support base connected to the first light emitting device by a first angle and connected to the second light emitting device by a second angle; and a first support arranged between the support base and first light emitting device.
    Type: Application
    Filed: February 21, 2022
    Publication date: June 9, 2022
    Inventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG
  • Publication number: 20220181418
    Abstract: A display may include an array of pixels. Each pixel in the array includes an organic light-emitting diode coupled to associated semiconducting oxide transistors. The semiconducting oxide transistors may exhibit different device characteristics. Some of the semiconducting oxide transistors may be formed using a first oxide layer formed from a first semiconducting oxide material using first processing steps, whereas other semiconducting oxide transistors are formed using a second oxide layer formed from a second semiconducting oxide material using second processing steps different than the first processing steps. The display may include three or more different semiconducting oxide layers formed during different processing steps.
    Type: Application
    Filed: October 18, 2021
    Publication date: June 9, 2022
    Inventors: Jung Yen Huang, Shinya Ono, Chin-Wei Lin, Akira Matsudaira, Cheng Min Hu, Chih Pang Chang, Ching-Sang Chuang, Gihoon Choo, Jiun-Jye Chang, Po-Chun Yeh, Shih Chang Chang, Yu-Wen Liu, Zino Lee