Abstract: A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die and the coating layer. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of each of the connecting pins is smaller than that of the conductive sheet. A top surface of each of the connecting pins is lower than that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer.

Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate.

Abstract: The present invention relates to use an agent for the prevention and/or treatment of multiple organ dysfunction syndrome (MODS) or multiple organ failure (MOF) comprising interleukin-22 (IL-22) as an effective ingredient. The present invention is applicable to prevention of or therapy for diseases from sepsis, septic shock, liver failure, to multiple organ dysfunction syndromes. More particularly, the present invention is useful for an emergency medical service, for treatment of injury caused by a traffic accident, burns, heat attacks, hypercytokinemia or severe infective diseases.

Abstract: The present invention relates to use of interleukin-22 (IL-22) for treating fatty liver disease by decreasing the levels of transaminases. The use of IL-22 in decreasing the levels of transaminases is also provided.

Abstract: An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.

Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Bottom surfaces of the first and second electrodes are exposed out of a bottom surface of the substrate to connect with welding pads of a printed circuit board. A bottom surface of the third electrode is received in the substrate.

Abstract: An exemplary LED package includes a base, electrodes formed on the base, an LED chip electrically connecting the electrodes, and a reflecting cup mounted on the base and surrounding the LED chip therein. The reflecting cup includes a bottom surface and an inner surface recessed up from the bottom surface and slantwise oriented towards a top end of the reflecting cup. The reflecting cup is annular. The inner surface includes a reflecting portion slantwise extending from the top surface, and a transition portion extending downwardly from the reflecting portion. The transition portion defines a through hole therein. The reflecting portion defines a reflecting hole therein. An angle ? is defined between the reflecting portion and an imaginary surface parallel to the bottom surface. An angle ? is defined between the reflecting portion and the bottom surface. The angle ? is larger than the angle ?.

Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.

Abstract: An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.

Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Bottom surfaces of the first and second electrodes are exposed out of a bottom surface of the substrate to connect with welding pads of a printed circuit board. A bottom surface of the third electrode is received in the substrate.

Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate.

Abstract: A backlight driving circuit includes a light driving unit, which includes a constant current unit, and a light source operated by the constant current unit. The light driving unit further includes a feedback control unit and a detection circuit. The detection circuit detects the light source and outputs at least a voltage feedback signal to the feedback control unit. The feedback control unit obtains a prestored power parameter corresponding to the voltage feedback signal and outputs an adjusting signal to the constant current unit to adjust the constant current of the light source.

Abstract: The present invention relates to use an agent for the prevention and/or treatment of multiple organ dysfunction syndrome (MODS) or multiple organ failure (MOF) comprising interleukin-22 (IL-22) as an effective ingredient. The present invention is applicable to prevention of or therapy for diseases from sepsis, septic shock, liver failure, to multiple organ dysfunction syndromes. More particularly, the present invention is useful for an emergency medical service, for treatment of injury caused by a traffic accident, burns, heat attacks, hypercytokinemia or severe infective diseases.

Abstract: The present invention relates to use of interleukin-22 (IL-22) for treating fatty liver disease by decreasing the levels of transaminases. The use of IL-22 in decreasing the levels of transaminases is also provided.

Abstract: An exemplary backlight module (2) includes a light guide plate (23), a light source (25), a light source driver (27), and a frame (21). The light source is provided adjacent to the light guide plate. The light source driver is directly connected with the light source. The frame includes an upper frame (211) and a lower frame (212). The upper frame and the lower frame cooperatively form a space to accommodate the light guide plate, the light source, and the light source driver.

Abstract: The use of IL-22 for the treatment of metabolic disorders including hyperlipidemia, obesity, hyperinsulinemia and diabetes. IL-22 may also be used in combination with insulin for diabetes.

Abstract: The use of IL-22 for the treatment of metabolic disorders including hyperlipidemia, obesity, hyperinsulinemia and diabetes. IL-22 may also be used in combination with insulin for diabetes.

Abstract: The use of IL-22 for the treatment of metabolic disorders including hyperlipidemia, obesity, hyperinsulinemia and diabetes. IL-22 may also be used in combination with insulin for diabetes.

Abstract: A novel recombinant protein expression system is provided for improving expression of recombinant human arginase I. The system contains an isolated and purified nucleic acid molecule for constructing plasmid and E. coli strain in order to improve the expression of recombinant human arginase I. In another aspect of the present invention, a method is provided for producing an isolated E. coli strain in expressing said arginase.

Abstract: A backlight driving circuit includes a light driving unit, which includes a constant current unit, and a light source operated by the constant current unit. The light driving unit further includes a feedback control unit and a detection circuit. The detection circuit detects the light source and outputs at least a voltage feedback signal to the feedback control unit. The feedback control unit obtains a prestored power parameter corresponding to the voltage feedback signal and outputs an adjusting signal to the constant current unit to adjust the constant current of the light source.