Patents by Inventor Yu-Lin Yang

Yu-Lin Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210313452
    Abstract: A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes semiconductor wires disposed over a substrate, a source/drain epitaxial layer in contact with the semiconductor wires, a gate dielectric layer disposed on and wrapping around each channel region of the semiconductor wires, a gate electrode layer disposed on the gate dielectric layer and wrapping around the each channel region, and dielectric spacers disposed in recesses formed toward the source/drain epitaxial layer.
    Type: Application
    Filed: June 21, 2021
    Publication date: October 7, 2021
    Inventors: Chao-Ching CHENG, Yu-Lin YANG, Wei-Sheng YUN, Chen-Feng HSU, Tzu-Chiang CHEN
  • Patent number: 11133039
    Abstract: A power switch control circuit includes a supply rail configured to supply power to a memory array. A first header switch couples the supply rail to a first power supply that corresponds to a first power domain. A second header switch couples the supply rail to a second power supply that corresponds to a second power domain. A control circuit is configured to receive a select signal and a shutdown signal, and to output control signals to the first and second header switches to selectively couple the first and second header switches to the first and second power supplies, respectively, in response to the select signal and the shutdown signal. The control circuit is configured to output the control signals to the first and second header switches to disconnect both the first and second header switches from the first and second power supplies in response to the shutdown signal and irrespective of the select signal.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: September 28, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-I Yang, Cheng Hung Lee, Chen-Lin Yang, Yu-Hao Hsu
  • Publication number: 20210296439
    Abstract: In a method of manufacturing a semiconductor device, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed. A sacrificial gate structure is formed over the fin structure. The first semiconductor layers, the second semiconductor layer and an upper portion of the fin structure at a source/drain region of the fin structure, which is not covered by the sacrificial gate structure, are etched. A dielectric layer is formed over the etched upper portion of the fin structure. A source/drain epitaxial layer is formed. The source/drain epitaxial layer is connected to ends of the second semiconductor wires, and a bottom of the source/drain epitaxial layer is separated from the fin structure by the dielectric layer.
    Type: Application
    Filed: March 15, 2021
    Publication date: September 23, 2021
    Inventors: Yu-Lin YANG, Chao-Ching CHENG, Tzu-Chiang CHEN, I-Sheng CHEN
  • Publication number: 20210297444
    Abstract: Conventional email filtering services are not suitable for recognizing sophisticated malicious emails, and therefore may allow sophisticated malicious emails to reach inboxes by mistake. Introduced here are threat detection platforms designed to take an integrative approach to detecting security threats. For example, after receiving input indicative of an approval from an individual to access past email received by employees of an enterprise, a threat detection platform can download past emails to build a machine learning (ML) model that understands the norms of communication with internal contacts (e.g., other employees) and/or external contacts (e.g., vendors). By applying the ML model to incoming email, the threat detection platform can identify security threats in real time in a targeted manner.
    Type: Application
    Filed: June 7, 2021
    Publication date: September 23, 2021
    Inventors: Sanjay Jeyakumar, Jeshua Alexis Bratman, Dmitry Chechik, Abhijit Bagri, Evan James Reiser, Sanny Xiao Yang Liao, Yu Zhou Lee, Carlos Daniel Gasperi, Kevin Lau, Kai Jing Jiang, Su Li Debbie Tan, Jeremy Kao, Cheng-Lin Yeh
  • Patent number: 11120886
    Abstract: A gate driving circuit comprises a plurality of shift registers coupled in serial. An nth shift register includes a driving circuit, a pull-up circuit and a first auxiliary voltage regulator circuit. The driving circuit is electrically coupled to an output node and a first node. The driving circuit is configured to receive a clock signal and output a gate signal according to the clock signal. The pull-up circuit is electrically coupled to the driving circuit. The first auxiliary voltage regulator circuit is electrically coupled to the pull-up circuit and a second node. The first auxiliary voltage regulator circuit is configured to receive a control signal and the second node corresponding to a second voltage.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: September 14, 2021
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Er-Lang Deng, Yuan-Nan Chiu, Chih-Yuan Wu, Yu-Lin Huang, I-Sheng Lin, Kuo-Ting Yang
  • Patent number: 11121078
    Abstract: A semiconductor device includes a gate structure, a source/drain, a first via that is disposed over the gate structure and the source/drain, and a first metal line having a more elevated vertical position than the first via in a cross-sectional view. The first via is electrically coupled to both the gate structure and the source/drain. The first metal line and the first via each extends in a first direction. A first distance separates the metal line from the via in a second direction different from the first direction. The first metal line includes a protruding portion that protrudes outwardly in the second direction.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: September 14, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jui-Lin Chen, Chao-Yuan Chang, Yu-Kuan Lin, Chang-Ta Yang, Ping-Wei Wang
  • Publication number: 20210270870
    Abstract: A current sensing circuit having self-calibration includes two leads, a sensing element having a sensing resistance, and a sensing and calibration circuit. The sensing and calibration circuit senses and calibrates a sensing voltage of the sensing element, and senses a sensing current through the sensing element according to the sensing resistance and the sensing voltage, to generate a current sensing output signal. The sensing and calibration circuit includes two pads, a V2I circuit, a current mirror circuit and an I2V circuit. The sensing element has a first temperature coefficient (TC). The TC and/or the resistance of an adjusting resistor in the V2I circuit and an adjusting resistor in the I2V circuit are determined according to the first TC, such that the TC of the current sensing output signal is equal to 0.
    Type: Application
    Filed: December 8, 2020
    Publication date: September 2, 2021
    Inventors: Isaac Y. Chen, Chien-Fu Tang, Hsin-Yi Wu, Kai-Chuan Chan, Yu-Lin Yang
  • Publication number: 20210265208
    Abstract: The present disclosure provides a method of forming an integrated circuit structure. The method includes depositing a first metal layer on a semiconductor substrate; forming a hard mask on the first metal layer; patterning the first metal layer to form first metal features using the hard mask as an etch mask; depositing a dielectric layer of a first dielectric material on the first metal features and in gaps among the first metal features; performing a chemical mechanical polishing (CMP) process to both the dielectric layer and the hard mask; removing the hard mask, thereby having portions of the dielectric layer extruded above the metal features; forming an inter-layer dielectric (ILD) layer of the second dielectric material different from the first dielectric material; and patterning the ILD layer to form openings that expose the first metal features and are constrained to be self-aligned with the first metal features by the extruded portions of the first dielectric layer.
    Type: Application
    Filed: May 7, 2021
    Publication date: August 26, 2021
    Inventors: Tai-I Yang, Yu-Chieh Liao, Chia-Tien Wu, Hsin-Ping Chen, Hai-Ching Chen, Shau-Lin Shue
  • Patent number: 11101820
    Abstract: A memory control method for a rewritable non-volatile memory module is provided according to an exemplary embodiment of the disclosure. The method includes: sending a first read command sequence which indicates a reading of a first physical unit by using a first read voltage level to obtain first data; decoding the first data; sending a second read command sequence which indicates a reading of the first physical unit by using a second read voltage level to obtain second data; decoding the second data with assistance information to improve a decoding success rate of the second data if the second read voltage level meets a first condition or the second data meets a second condition; and decoding the second data without the assistance information if the second read voltage level does not meet the first condition and the second data does not meet the second condition.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: August 24, 2021
    Assignee: PHISON ELECTRONICS CORP.
    Inventors: Wei Lin, Shih-Jia Zeng, Yu-Cheng Hsu, Yu-Siang Yang
  • Publication number: 20210242328
    Abstract: A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes semiconductor wires disposed over a substrate, a source/drain epitaxial layer in contact with the semiconductor wires, a gate dielectric layer disposed on and wrapping around each channel region of the semiconductor wires, a gate electrode layer disposed on the gate dielectric layer and wrapping around the each channel region, and dielectric spacers disposed in recesses formed toward the source/drain epitaxial layer.
    Type: Application
    Filed: March 29, 2021
    Publication date: August 5, 2021
    Inventors: Chao-Ching CHENG, Yu-Lin YANG, Wei-Sheng YUN, Chen-Feng HSU, Tzu-Chiang CHEN
  • Patent number: 11056400
    Abstract: Nanowire devices and fin devices are formed in a first region and a second region of a substrate. To form the devices, alternating layers of a first material and a second material are formed, inner spacers are formed adjacent to the layers of the first material, and then the layers of the first material are removed to form nanowires without removing the layers of the first material within the second region. Gate structures of gate dielectrics and gate electrodes are formed within the first region and the second region in order to form the nanowire devices in the first region and the fin devices in the second region.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: July 6, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chao-Ching Cheng, Tzu-Chiang Chen, Chen-Feng Hsu, Yu-Lin Yang, Tung Ying Lee, Chih Chieh Yeh
  • Patent number: 11043577
    Abstract: A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes semiconductor wires disposed over a substrate, a source/drain epitaxial layer in contact with the semiconductor wires, a gate dielectric layer disposed on and wrapping around each channel region of the semiconductor wires, a gate electrode layer disposed on the gate dielectric layer and wrapping around the each channel region, and dielectric spacers disposed in recesses formed toward the source/drain epitaxial layer.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: June 22, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Ching Cheng, Yu-Lin Yang, Wei-Sheng Yun, Chen-Feng Hsu, Tzu-Chiang Chen
  • Patent number: 10964798
    Abstract: A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes semiconductor wires disposed over a substrate, a source/drain epitaxial layer in contact with the semiconductor wires, a gate dielectric layer disposed on and wrapping around each channel region of the semiconductor wires, a gate electrode layer disposed on the gate dielectric layer and wrapping around the each channel region, and dielectric spacers disposed in recesses formed toward the source/drain epitaxial layer.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: March 30, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Ching Cheng, Yu-Lin Yang, Wei-Sheng Yun, Chen-Feng Hsu, Tzu-Chiang Chen
  • Patent number: 10950693
    Abstract: In a method of manufacturing a semiconductor device, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed. A sacrificial gate structure is formed over the fin structure. The first semiconductor layers, the second semiconductor layer and an upper portion of the fin structure at a source/drain region of the fin structure, which is not covered by the sacrificial gate structure, are etched. A dielectric layer is formed over the etched upper portion of the fin structure. A source/drain epitaxial layer is formed. The source/drain epitaxial layer is connected to ends of the second semiconductor wires, and a bottom of the source/drain epitaxial layer is separated from the fin structure by the dielectric layer.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: March 16, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Lin Yang, Chao-Ching Cheng, Tzu-Chiang Chen, I-Sheng Chen
  • Publication number: 20210057539
    Abstract: In a method of manufacturing a semiconductor device, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed. A sacrificial gate structure is formed over the fin structure. A source/drain region of the fin structure, which is not covered by the sacrificial gate structure, is etched, thereby forming a source/drain space. The first semiconductor layers are laterally etched through the source/drain space. An inner spacer made of a dielectric material is formed on an end of each of the etched first semiconductor layers. A source/drain epitaxial layer is formed in the source/drain space to cover the inner spacer. A lateral end of each of the first semiconductor layers has a V-shape cross section after the first semiconductor layers are laterally etched.
    Type: Application
    Filed: October 26, 2020
    Publication date: February 25, 2021
    Inventors: Kuo-Cheng CHIANG, Chen-Feng HSU, Chao-Ching CHENG, Tzu-Chiang CHEN, Tung Ying LEE, Wei-Sheng YUN, Yu-Lin YANG
  • Publication number: 20210036119
    Abstract: A gate-all-around structure is provided. The gate-all-around structure includes a plurality of nanostructures stacked over a substrate in a vertically direction, and the nanostructures extends from a gate region to a source/drain (S/D) region. The gate-all-around structure includes a gate structure formed in the gate region around the first nanostructures, and a S/D structure formed in the S/D region.
    Type: Application
    Filed: October 15, 2020
    Publication date: February 4, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chao-Ching CHENG, Yu-Lin YANG, I-Sheng CHEN, Tzu-Chiang CHEN
  • Patent number: 10872893
    Abstract: A method for manufacturing a semiconductor device includes forming a fin structure over a substrate and forming a first gate structure over a first portion of the fin structure. A first nitride layer is formed over a second portion of the fin structure. The first nitride layer is exposed to ultraviolet radiation. Source/drain regions are formed at the second portion of the fin structure.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: December 22, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Lin Yang, Chia-Cheng Ho, Chih Chieh Yeh, Cheng-Yi Peng, Tsung-Lin Lee
  • Patent number: 10868149
    Abstract: A method includes providing a structure having a substrate and a fin extending from the substrate, wherein the fin includes a first semiconductor material and has a source region, a channel region, and a drain region for a transistor; forming a gate stack over the channel region; performing a surface treatment to the fin in the source and drain regions, thereby converting an outer portion of the fin in the source and drain regions into a different material other than the first semiconductor material; etching the converted outer portion of the fin in the source and drain regions, thereby reducing a width of the fin in the source and drain regions; and depositing an epitaxial layer over the fin in the source and drain regions.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Han Fan, Wei-Yuan Lu, Yu-Lin Yang, Chun-Hsiang Fan, Sai-Hooi Yeong
  • Patent number: 10868127
    Abstract: Present disclosure provides gate-all-around structure including a first transistor. The first transistor includes a semiconductor substrate having a top surface, a first nanowire over the top surface of the semiconductor substrate and between a first source and a first drain, a first gate structure around the first nanowire, an inner spacer between the first gate structure and the first source and first drain, and an isolation layer between the top surface of the semiconductor substrate and the first source and the first drain. Present disclosure also provides a method for manufacturing the gate-all-around structure described herein.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Ching Cheng, Yu-Lin Yang, I-Sheng Chen, Tzu-Chiang Chen
  • Publication number: 20200357885
    Abstract: Transistor structures and methods of forming transistor structures are provided. The transistor structures include alternating layers of a first epitaxial material and a second epitaxial material. In some embodiments, one of the first epitaxial material and the second epitaxial material may be removed for one of an n-type or p-type transistor. A bottommost layer of the first epitaxial material and the second epitaxial material maybe be removed, and sidewalls of one of the first epitaxial material and the second epitaxial material may be indented or recessed.
    Type: Application
    Filed: July 27, 2020
    Publication date: November 12, 2020
    Inventors: Cheng-Yi Peng, Hung-Li Chiang, Yu-Lin Yang, Chih Chieh Yeh, Yee-Chia Yeo, Chi-Wen Liu