Abstract: The disclosed computer-implemented method may include dynamically selecting transportation options to present to a transportation requestor device based on current transportation network conditions and transportation requestor device history. In some embodiments, transportation network may have many different ways of arranging a transportation requestor's trip, such as private rides, shared rides, immediate rides, and delayed rides. In some examples, the requestor's choice of transportation option may have an impact on the transportation network. In anticipation of or in response to a transportation request, the method may determine which transportation options will better benefit the transportation network and determine which transportation options to display to the requestor and/or the prominence with which the transportation products are displayed. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: Methods, systems, and computer program products for de-duplicating data in executable files in a container image are disclosed. The method may include receiving a request to read a file in a first layer in a container image including a plurality of layers, wherein the file is a delta file which is from an updated executable file based on a base executable file, the base executable file is in a lower layer than the first layer in the container image, and the delta file includes block mappings between the updated executable file and the base executable file and different data between the two files, and blocks included in the two files are based on respective file structure. The method may also include restoring the updated executable file based on the delta file and the base executable file. The method may further include returning data in the updated executable file.

Abstract: A backlight module and a display device are provided, and the backlight module includes a light guide plate, a plurality of light-emitting components, and a frame. The light guide plate includes a first side, a second side, and two third sides. The light-emitting components are disposed on the first side, and light generated from the light-emitting components enters the light guide plate from the first side. The frame covers the second side and the third sides and includes an opening and at least one buffer portion. The light-emitting components are disposed in the opening, and the buffer portion is disposed on a side of the opening and contacts the light guide plate.

Abstract: An illumination system provides an illumination beam and includes a red light source, a green light source, a blue light source, a first supplementary light source, a first X-shaped light-splitting assembly, a first light-splitting element, and a light-uniforming element. The red light source provides a red beam. The green light source provides a green beam. The blue light source provides a blue beam. The first supplementary light source provides a first supplementary beam. The first X-shaped light-splitting assembly guides the first supplementary beam and the blue beam to the first light-splitting element. The first light-splitting element guides the red beam, the green beam, the blue beam, and the first supplementary beam to the light-uniforming element. The first supplementary beam is a red supplementary beam or a blue supplementary beam, and the illumination system includes at least five light-emitting elements. A projection apparatus including the above illumination system is also provided.

Abstract: The present invention relates to the technical field of endoscopes, and discloses a confocal endoscope with a fixing device.

Abstract: A three-dimensional printing apparatus includes a liquid tank capable of accommodating a photosensitive liquid. The liquid tank includes a film, a plurality of side walls, a plate and a motor. The film has a workpiece curing area. The plurality of side walls surrounds the film. The plate is capable of supporting the film and having at least one fluid tunnel extending from a first surface of the plate contacting the film to a second surface of the plate. The motor is connected to the liquid tank to incline the liquid tank. A gap is formed between the plat and one of the plurality of side walls of the liquid tank, and the film is communicated with an outside space via the gap.

Abstract: An electronic device includes a device body and an antenna module disposed in the device body and including a conductive structure and a coaxial cable including a core wire, a shielding layer wrapping the core wire, and an outer jacket wrapping the shielding layer. The conductive structure includes a structure body and a slot formed on the structure body and penetrating the structure body in a thickness direction of the structure body. A section of the shielding layer extends from the outer jacket and is connected to the structure body. A physical portion of the structure body and the section of the shielding layer are respectively located on two opposite sides of the slot in a width direction of the slot. A section of the core wire extends from the section of the shielding layer and overlaps the slot and the physical portion in the thickness direction.

Abstract: The present invention discloses a vessel tracking and monitoring system and operating method thereof. Specifically, the vessel tracking and monitoring system comprises at least one camera, a processing module and a storage module. On the other hand, the processing module may keep the water object which is detected and recognized by the at least one camera in the center area of a monitoring screen. Therefore, the present invention may track and recognize the type of the at least one water object, assisting areas such as ports in managing and tracking water object arrivals and departures under various environmental conditions.

Abstract: The present disclosure provides an extreme ultraviolet (EUV) lithography system including a radiation source and an EUV control system integrated with the radiation source. The EUV control system includes a 3-dimensional diagnostic module (3DDM) designed to collect a laser beam profile of a laser beam from the radiation source in a 3-dimensional (3D) mode, an analysis module designed to analyze the laser beam profile, a database designed to store the laser beam profile, and an EUV control module designed to adjust the radiation source. The analysis module is coupled with the database and the EUV control module. The database is coupled with the 3DDM and the analysis module. The EUV control module is coupled with the analysis module and the radiation source.

Abstract: A method, system, and computer program product for script generation and recommendation from behavior trees are provided. The method receives a set of input commands within a programming interface. The set of input commands is parsed into a set of command parts. The set of input commands is normalized based on the set of command parts to generate a set of normalized commands. A set of behavior trees are generated based on the set of normalized commands and the set of parts. The method generates a set of command scripts based on the set of behavior trees.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first source/drain structure and a second source/drain structure over and in a substrate. The method includes forming a first gate stack, a second gate stack, a third gate stack, and a fourth gate stack over the substrate. Each of the first gate stack or the second gate stack is wider than each of the third gate stack or the fourth gate stack. The method includes forming a first contact structure and a second contact structure over the first source/drain structure and the second source/drain structure respectively. A first average width of the first contact structure is substantially equal to a second average width of the second contact structure.

Abstract: A pixel circuit, a driving method therefor and a display apparatus are provided. The pixel circuit includes a driving sub-circuit, a write sub-circuit, a compensation sub-circuit, a reset sub-circuit, a first light-emitting control sub-circuit, a second light-emitting control sub-circuit, a leak-proof sub-circuit, a storage sub-circuit and a light-emitting element. The reset sub-circuit is configured to reset a fourth node under control of a signal of a light-emitting control signal terminal and reset a fifth node under control of a signal of a reset control signal terminal. The compensation sub-circuit is configured to compensate a threshold voltage of the driving sub-circuit to the fifth node under the control of a signal of a first scanning signal terminal. The leak-proof sub-circuit is configured to write a signal of the fifth node into a first node under control of a signal of a second scanning signal terminal.

Abstract: A method for forming a semiconductor structure is provided. The method for forming the semiconductor structure includes forming a fin structure over a substrate in a first direction, forming a first gate stack, a second gate stack and a third gate stack across the fin structure, removing the first gate stack to form a trench, depositing a cutting structure in the trench, and forming a first contact plug between the cutting structure and the second gate stack and a second contact plug between the second gate stack and the third gate stack. The fin structure is cut into two segments by the trench. A first dimension of the first contact plug in the first direction is greater than a second dimension of the second contact plug in the first direction.

Abstract: A method for determining parameters of nanostructures, wherein the method includes steps as follows: Firstly, an X-ray reflection intensity measurement curve of a nanostructure to be tested is obtained by radiating the nanostructure to be tested with X-ray. The X-ray reflection intensity measurement curve is compared with an X-ray reflection intensity standard curve to obtain a comparison result. Subsequently, at least one parameter existing in the nanostructure to be tested is determined according to the comparison result.

Abstract: A manufacturing method of a chip package includes patterning a wafer to form a scribe trench, in which a light-transmissive function layer below the wafer is in the scribe trench, the light-transmissive function layer is between the wafer and a carrier, and a first included angle is formed between an outer wall surface and a surface of the wafer facing the light-transmissive function layer; cutting the light-transmissive function layer and the carrier along the scribe trench to form a chip package that includes a chip, the light-transmissive function layer, and the carrier; and patterning the chip to form an opening, in which the light-transmissive function layer is in the opening, a second included angle is formed between an inner wall surface of the chip and a surface of the chip facing the light-transmissive function layer, and is different from the first included angle.

Abstract: A magnetic particle imaging (MPI) and fluorescence molecular tomography (FMT)-fused multimodal imaging system and method for a small animal are provided. The multimodal imaging system includes an image processing module, a display module, a control module, an object table, a gradient coil, a driving coil, a reception coil, a fluorescence camera, and a light source module, where the gradient coil includes a first rounded rectangular coil and a second rounded rectangular coil; the driving coil includes a third rounded rectangular coil, a fourth rounded rectangular coil, and a fifth rounded rectangular coil; and the reception coil is a circular coil.

Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.